10M40DCF256C7G - MAX 10 FPGA, 40K LE, 256-LBGA | Intel / Altera
MPN: 10M40DCF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.8 | $3,380.00 |
| 500 | $29.95 | $14,975.00 |
| 1,000 | $26.4 | $26,400.00 |
Drop-in alternatives for 10M40DCF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40DCF256I7G
✅ Drop-In✓ In Stock
$52.12 / Unit
View Datasheet →10M40DAF256C7G
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View Datasheet →10M40DAF256I7G
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$65.8 / Unit
View Datasheet →10M40DCF256A7G
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$21.8 / Unit
View Datasheet →10M40DAF256C8G
✅ Drop-In✓ In Stock
$55.2 / Unit
View Datasheet →10M40DCF256C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Manufacturer | Intel / Altera |
| Logic Elements (LE) | 40,000 |
| Embedded SRAM Bits | 1,290,240 |
| Maximum User I/O | 178 |
| Maximum Operating Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Voltage (VCC) | 1.2 V |
| Supply Variant | Dual supply (DC suffix) |
| Package | 256-LBGA (FBGA) |
| Mounting Type | Surface Mount |
| On-chip Flash | Dual-configuration, non-volatile |
| Integrated ADC | Yes (12-bit, multiple channels) |
| DSP Blocks | Yes (embedded multipliers) |
| RoHS Status | Compliant |
| Operating Temperature Grade | Commercial (C suffix) |
10M40DCF256C7G Pin Configuration
| Pin A1 | I/O — General-purpose user I/O pin (bank 1A) |
| Pin A2 | I/O — General-purpose user I/O pin (bank 1A) |
| Pin A3 | I/O — General-purpose user I/O pin (bank 1B) |
| Pin A4 | I/O — General-purpose user I/O pin (bank 1B) |
| Pin A5 | VCCIO1B — I/O bank 1B supply voltage |
| Pin A6 | I/O — General-purpose user I/O pin (bank 2) |
| Pin A7 | GND — Ground |
| Pin A8 | I/O — General-purpose user I/O pin (bank 2) |
| Pin A9 | I/O — General-purpose user I/O pin (bank 3) |
| Pin A10 | I/O — General-purpose user I/O pin (bank 3) |
| Pin A11 | VCCIO3 — I/O bank 3 supply voltage |
| Pin A12 | I/O — General-purpose user I/O pin (bank 4) |
| Pin A13 | I/O — General-purpose user I/O pin (bank 4) |
| Pin A14 | I/O — General-purpose user I/O pin (bank 5) |
| Pin A15 | GND — Ground |
| Pin A16 | I/O — General-purpose user I/O pin (bank 5) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DCF256C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Portable Test and Measurement, Video Processing and Bridging, Sensor Aggregation Hub, Low-Cost Communications Backplane.
Industrial Motor Control
The 10M40DCF256C7G fits industrial motor-control designs by combining 40K logic elements with integrated 12-bit ADC blocks and DSP multipliers, enabling closed-loop field-oriented control (FOC) for 3-phase PMSM and BLDC drives without an external MCU. Its 178 user I/O pins accept multiple encoder and Hall-sensor inputs while driving 6-channel PWM outputs directly via the LVDS-capable I/O banks. The non-volatile instant-on configuration reduces boot latency below 10 ms, critical for safety-rated machinery requiring rapid power-cycle recovery.
Recommended
Factory Automation I/O Expansion
The 10M40DCF256C7G serves as a programmable industrial I/O concentrator that aggregates fieldbus sensors and actuators into standardized protocols such as EtherCAT, PROFINET, or Modbus TCP. With 178 user I/O pins and on-chip flash storing both primary and golden configuration images, the part supports remote firmware updates for IIoT endpoints. The integrated ADC blocks digitize analog sensor readings directly, eliminating external ADC cost and reducing PCB complexity in PLC and distributed I/O modules.
Recommended
Portable Test and Measurement
The 10M40DCF256C7G enables portable instrument designs where 472.5 MHz DSP block performance drives real-time FFT, digital filtering, and signal averaging for oscilloscope and spectrum-analyzer channels. Its non-volatile instant-on configuration reduces cold-boot time on benchtop equipment, and 1,290,240 embedded SRAM bits provide deep acquisition buffers without external memory. The 256-LBGA package supports the multi-bank LVDS I/O needed for parallel ADC interfacing at 200+ MSPS sampling rates.
Recommended
Video Processing and Bridging
The 10M40DCF256C7G handles cost-sensitive video processing such as format conversion, scaling, and overlay generation for industrial displays, kiosks, and entry-level surveillance DVRs. Its 178 user I/O pins support parallel RGB, BT.656, and LVDS display interfaces simultaneously, while 40K logic elements implement color-space conversion and chroma resampling pipelines in a single device. The integrated flash stores multiple display-timing personalities, enabling one part to support several end-product SKUs without external boot memory.
Recommended
Sensor Aggregation Hub
The 10M40DCF256C7G aggregates multiple sensor streams (temperature, pressure, vibration, current) into a unified data interface for IIoT gateways. Its integrated 12-bit ADC blocks sample multiple analog sensors concurrently, while DSP blocks perform on-chip feature extraction such as RMS and peak detection. Dual-configuration flash supports A/B firmware updates with rollback safety, critical for remote sensor installations that cannot tolerate field bricking, and the 256-LBGA package provides ample I/O for SPI, I2C, UART, and CAN sensor buses.
Recommended
Low-Cost Communications Backplane
The 10M40DCF256C7G implements low-cost serial-link bridges (UART-to-Ethernet, SPI-to-CAN, LVDS-to-GPIO) for industrial backplanes where dedicated ASSP bridges are uneconomical. Its 40K logic elements support soft IP cores for protocols up to 100 Mbit Ethernet MAC, while 178 user I/O pins drive multiple downstream transceivers in parallel. The 55 nm process keeps static power low enough for fan-less chassis designs, and on-chip flash eliminates external boot PROM cost in volume-produced backplane cards.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DCF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DCF256I7G | 10M40DAF256C7G | 10M40DAF256I7G | 10M40DCF256A7G | 10M40DAF256C8G |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Embedded SRAM Bits | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 |
| Supply Topology | Dual-supply (DC) | Dual-supply (DC) | Single-supply (DA) | Single-supply (DA) | Dual-supply (DC) | Single-supply (DA) |
| Temperature Grade | Commercial 0C to 85C | Industrial -40C to 100C | Commercial 0C to 85C | Industrial -40C to 100C | Automotive -40C to 125C | Commercial 0C to 85C |
| Speed Grade | 7 | 7 | 7 | 7 | 7 | 8 |
| User I/O Pins | 178 | 178 | 178 | 178 | 178 | 178 |
Key Differentiators
- Dual-configuration non-volatile flash on-chip (vs 10M40DAF256C7G)
- Commercial 0C-85C temperature grade with full lead-time availability (vs 10M40DCF256I7G)
- Integrated ADC and DSP blocks reduce BOM (vs 10M40DAF256C8G)
Design Notes
The 256-LBGA package has a 1.0 mm ball pitch requiring microvia (laser-drilled) stack-up for fanout routing. A 4-layer 1+N+1 stack-up with 0.5 oz copper on outer layers and 1 oz inner planes is recommended. Assign one full inner plane to GND directly beneath the BGA, and dedicate a second inner plane to VCCINT (1.2 V) to provide low-impedance core power distribution. Decouple each VCC/VCCIO pin pair with 0.1 uF X7R 0402 placed within 2 mm of the ball pad.
Estimated: at 472.5 MHz DSP activity with 50% toggle rate and 1.2 V core supply, the 10M40DCF256C7G dissipates approximately 0.6-0.9 W. The 256-LBGA package thermal resistance (theta_JA) is approximately 15-20 C/W on a JEDEC 4-layer test board, giving a junction temperature rise of 9-18 C above ambient. For industrial designs targeting -40C to 100C, ensure ambient plus self-heating stays below the 100C commercial limit; for the I7G industrial variant the limit is 100C junction, providing additional margin.
The 'C' suffix in 10M40DCF256C7G denotes commercial temperature grade (0C-85C); using this part in industrial environments without de-rating is a frequent design mistake - substitute 10M40DCF256I7G for industrial deployments. Also note the 'D' (dual-supply) vs 'A' (single-supply) prefix difference: the DC variant requires separate VCC (1.2 V core) and VCCIO bank supplies, while the DA variant powers both from a single rail, so a PCB designed for DC cannot be populated with DA without re-checking the power tree.
LVDS signaling on MAX 10 I/O banks requires matched-pair routing with 100 ohm differential impedance and within-pair length matching of 10 mil or better. Use length-matched via fanout patterns from the BGA escape and avoid right-angle bends. For DDR memory interfaces (DDR3 up to 300 MHz supported on MAX 10), apply source-termination and use fly-by topology for address/command with VTT termination at the end of the fly-by chain to control simultaneous-switching noise.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 qualification status not applicable for this commercial-grade part - select 10M40DCF256A7G automotive variant if AEC-Q100 is required. Halogen-free status not explicitly listed in available web data and flagged as unknown.
