10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel
MPN: 10M25DCF256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $32.1 | $3,210.00 |
| 500 | $29.4 | $14,700.00 |
| 1,000 | $27.6 | $27,600.00 |
Drop-in alternatives for 10M25DCF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DCF256C8G
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →10M25DCF256C7G
✅ Drop-In✓ In Stock
$18.75 / Unit
View Datasheet →10M25DCF256A7G
✅ Drop-In✓ In Stock
$42.84 / Unit
View Datasheet →10M16DCF256I7G
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →10M08DCF256I7G
✅ Drop-In✓ In Stock
$12.2 / Unit
View Datasheet →10M25DCF256I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Number of LABs/CLBs | 1,563 |
| Total RAM Bits | 691,200 (675 Kbit) |
| Number of I/O Pins | 178 |
| Package / Case | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial speed grade) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) |
| MSL Level | 3 (per BGA handling) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes |
| Packaging | Tray |
10M25DCF256I7G 256-lbga (f256, 17x17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10M25DCF256I7G (256-lbga (f256, 17x17 mm, 1.0 mm pitch) package) with 178 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DCF256I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 178 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DCF256I7G is suitable for 6 applications: Industrial Motor and Motion Control, Factory Automation I/O Expansion and Bridging, Video Bridging and Display Controllers, Automotive Body Electronics, IoT Edge Sensor Aggregation, Power Conversion Digital Control.
Industrial Motor and Motion Control
The 10M25DCF256I7G is well suited for industrial motor and motion control designs because it integrates a 12-bit ADC alongside 25K logic elements and 178 user I/Os in a single non-volatile package. The ADC channels digitize current-sense amplifiers and resolver feedback without a separate analog IC, while the 25K LE fabric hosts PID loops, commutation state machines, and EtherCAT / PROFINET slave interfaces. Quartus Prime IP for motor control shortens firmware bring-up, and the industrial -40C to +100C rating handles unconditioned cabinet environments.
Recommended
Factory Automation I/O Expansion and Bridging
The 10M25DCF256I7G acts as a flexible bridge between legacy industrial buses (RS-485, RS-232, parallel GPIO) and modern Ethernet or USB hosts in factory automation racks. With 25K LE and 178 I/Os in the F256 BGA, the device can host multi-protocol state machines, FIFOs, and timing-aware glue logic without an external processor. The non-volatile flash configuration gives deterministic power-on, which is essential for hot-swappable I/O cards that must enumerate predictably in PLC backplanes.
Recommended
Video Bridging and Display Controllers
The 10M25DCF256I7G serves as a low-cost video bridge, converting between LVDS, MIPI, parallel RGB, and HDMI/DVI streams in embedded displays. The 178 user I/Os and LVDS support allow the F256 package to drive medium-resolution LCD panels directly, while the 25K LE fabric hosts timing controllers, color-space converters, and frame buffers in internal SRAM. The instant-on flash boot keeps display wake-up times short, which is important for kiosk and infotainment applications.
Recommended
Automotive Body Electronics
The 10M25DCF256I7G supports automotive body-electronics modules such as body controllers, lighting drivers, and HVAC control units where mid-density logic and an integrated ADC reduce BOM. Designers can migrate to the AEC-Q100-qualified 10M25DCF256A7G in the same F256 footprint when full automotive qualification is required. The MAX 10 instant-on flash enables CAN/LIN wake-up within milliseconds of battery reconnect, which is critical for keyless-entry and alarm modules.
Recommended
IoT Edge Sensor Aggregation
The 10M25DCF256I7G is a strong fit for IoT edge nodes that aggregate multiple analog sensors via the integrated 12-bit ADC and pre-process data in the 25K LE fabric before forwarding over Ethernet, Wi-Fi, or cellular. The non-volatile configuration lets the device wake up into a deterministic sensor-read pipeline without external boot memory. Industrial temperature rating and 178 I/Os in a 17x17 mm BGA keep the board compact enough for DIN-rail or pole-mounted enclosures.
Recommended
Power Conversion Digital Control
The 10M25DCF256I7G implements digital control loops for AC-DC, DC-DC, and uninterruptible power supplies where the integrated ADC samples output voltage and current while the FPGA fabric runs digital PWM and compensation. The 25K LE budget is sufficient for two-loop peak-current-mode control plus housekeeping telemetry, and the 178 I/Os in the F256 BGA support multiple phase legs and fault inputs. Industrial temperature grade and non-volatile boot simplify field firmware updates via JTAG.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DCF256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DCF256C8G | 10M25DCF256C7G | 10M25DCF256A7G | 10M16DCF256I7G | 10M08DCF256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256, 17x17 mm) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 8,000 (-68%) |
| Total RAM Bits | 691,200 | 691,200 | 691,200 | 691,200 | 500,000 approx (-28%) | 378,000 approx (-45%) |
| User I/O Pins | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed / Temperature Grade | I7 (Industrial, fastest) | C8 (Commercial 0 to +85C) | C7 (Commercial, slower) | A7 (Automotive AEC-Q100) | I7 (Industrial, fastest) | I7 (Industrial, fastest) |
| Integrated ADC | Yes (12-bit, MAX 10 family) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Pinout Compatibility | F256 reference | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) |
Key Differentiators
- Highest industrial speed grade (I7) at 25K LE density (vs 10M25DCF256C8G)
- Dual-configuration on-chip flash enables image-failover (vs 10M16DCF256I7G)
- Mid-density 25K LE with full 178 I/O count in F256 (vs 10M08DCF256I7G)
Design Notes
The F256 BGA uses a 1.0 mm ball pitch on a 17x17 mm body, which requires 4-layer or higher PCB stack-up with matched impedance for high-speed LVDS pairs. Use microvia or laser-drilled via-in-pad for the BGA breakout, and follow Intel's MAX 10 F256 pinout file for ball map verification. Decoupling: place 100 nF X7R caps on every VCCIO and VCCINT ball pair with vias within 1 mm of the pad.
Estimated: at full 25K LE utilization switching at 50% toggle rate, junction-to-ambient temperature rise is roughly 15-20 C/W on a JEDEC 4-layer test board. For enclosed industrial enclosures with no airflow, derate clock frequencies or add a small top-side copper pour to keep Tj below +100C. Industrial-grade parts (I7) are rated to +100C junction, so any design approaching this limit should include a thermal sensor in the FPGA fabric.
Do not mix 3.3 V LVCMOS and 1.8 V SSTL in the same I/O bank without verifying VCCIO bank voltage: each bank has a single VCCIO supply and all I/O standards in that bank must be compatible. Also, the dual-configuration flash (DC suffix) is unique to MAX 10 - it is not a generic dual-boot feature; consult the MAX 10 configuration user guide before relying on image-failover behavior in safety-critical applications.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 product stewardship declarations. AEC-Q100 grade available via the 10M25DCF256A7G drop-in alternative. All variants are lead-free and halogen-free.
