Intel

10M40DCF256C8G - MAX 10 FPGA, 40K LE, 256-FBGA | Intel

MPN: 10M40DCF256C8G ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 256-FBGA (F256, 17 mm × 17 mm) Package -8 (fastest commercial) Speed 1,290,240 Memory
From $71.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $95.2 $95.20
10 $89.1 $891.00
100 $82.4 $8,240.00
500 $76.3 $38,150.00
1,000 $71.8 $71,800.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M40DCF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M40DCF256C7G

✅ Drop-In
Altera
📦 256-FBGA (F256)
MAX 10 · Intel / Altera · 40,000 · 1,290,240 · 178 · 472.5 MHz · 55 nm · 1.2 V

✓ In Stock

$26.4 / Unit

View Datasheet →

10M40DCF256A7G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · 40,000 · 1,290,240 (160 Kbytes) · 178 · 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) · 55 nm · 1.2 V · 472.5 MHz

✓ In Stock

$21.8 / Unit

View Datasheet →

10M40DAF256C8G

✅ Drop-In
Altera
📦 256-FBGA (F256)
MAX 10 · 40,000 · 1,290,240 · 178 · 178 · 256-FBGA (FineLine BGA) · 256-LBGA (FBGA-256, 17 x 17 mm, 1.0 mm pitch) · 55 nm CMOS

✓ In Stock

$55.2 / Unit

View Datasheet →

10M40DAF256C7G

✅ Drop-In
Intel
📦 256-FBGA (F256)
Field Programmable Gate Array (FPGA) · MAX 10 · Yes · 40000 · 1290240 bits · 1.23 Mbit · 178 · 1.2 V

✓ In Stock

$46.83 / Unit

View Datasheet →

10M40DAF256I7G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · 40,000 · 1,290,240 (M9K + M144K blocks) · 178 · 256-FBGA (FineLine BGA), 17x17 mm · 55 nm TSMC · 1.2 V · -40C to +100C (Industrial, I7)

✓ In Stock

$65.8 / Unit

View Datasheet →

10M25DCF256C8G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · 25,000 · 178 · 691,200 bits (691 Kb) · 256-ball LBGA (F256) · C8 · Commercial (0C to +85C) · Non-volatile on-chip flash, dual-configuration

✓ In Stock

$24.95 / Unit

View Datasheet →

10M40DCF256C8G Maximum Ratings & Electrical Characteristics

Series MAX 10
Family MAX 10 FPGA
Logic Elements (LE) 40,000
Embedded Memory (bits) 1,290,240
Memory Type Embedded SRAM (block RAM)
Number of I/O 178 (MAX)
On-die Flash Yes (non-volatile configuration)
Integrated ADC Yes (MAX 10 family feature)
Process Technology 55 nm
Core Voltage 1.2 V
Speed Grade -8 (fastest commercial)
Operating Temperature 0 °C to 85 °C (TJ, commercial, C-suffix)
Package 256-FBGA (F256, 17 mm × 17 mm)
Mounting Type Surface Mount (BGA)
Terminal Finish Lead-free / Pb-free (G suffix, RoHS)
RoHS Status Compliant
Lead-Free Yes
Configuration Method On-die flash (instant-on)
Design Tool Intel Quartus Prime (Lite / Standard / Pro)
AEC-Q100 Not qualified (use I-suffix variants for industrial)

10M40DCF256C8G 256-fbga (f256, 17 mm × 17 mm) Pin Configuration Guide

Complete pinout information for 10M40DCF256C8G (256-fbga (f256, 17 mm × 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-fbga (f256, 17 mm × 17 mm) package pinout diagram for 10M40DCF256C8G

No detailed pinout data available for 10M40DCF256C8G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M40DCF256C8G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M40DCF256C8G is suitable for 6 applications: Industrial Motor Control, Communications Protocol Bridging, Factory Automation and PLC I/O, Video and Image Processing Pipelines, Test and Measurement Equipment, Automotive Infotainment / Driver-Assistance (Commercial Variants Only).

🏭

Industrial Motor Control

The 10M40DCF256C8G is well-suited to multi-axis industrial motor-control designs where deterministic logic, integrated ADC for current/voltage sensing, and instant-on configuration from on-die flash are required. Its 40,000 logic elements plus embedded 18×18 multipliers support field-oriented control (FOC) loops for two or more axes simultaneously, while the MAX 10's hard ADC samples shunt currents at >1 MSPS without an external analog front end. Compared to a microcontroller + external ADC approach, the FPGA delivers deterministic sub-microsecond loop times and parallel execution of commutation, protection, and communication tasks in a single package.

🌐

Communications Protocol Bridging

The 10M40DCF256C8G serves as a flexible bridge between legacy and modern communications interfaces (UART/SPI/I2C to GbE, custom protocols, or frame converters) in telecom and industrial-networking gear. With 178 user I/O and a 1.2 V core at 55 nm, the device supports multiple parallel interfaces concurrently while keeping power under approximately 1 W in typical bridging workloads. On-die flash enables remote firmware updates via the user-flash memory (UFM) subsystem, allowing deployed equipment to upgrade without service interruption - a key advantage over SRAM-based FPGAs that require external boot PROMs.

🏭

Factory Automation and PLC I/O

The 10M40DCF256C8G provides deterministic scan-time logic for compact PLCs, distributed I/O stations, and protocol-converter modules in factory-automation systems. Its 1,290,240 bits of embedded block SRAM buffer high-speed encoder/counter inputs and support cyclic data exchange over EtherCAT, PROFINET, or EtherNet/IP soft-macros. The MAX 10 family's integrated ADC also handles analog sensor monitoring (temperature, pressure, level) without external ADCs, reducing BOM cost. The 256-FBGA package fits within a 25 mm × 25 mm PCB module outline typical of DIN-rail-mounted field devices.

🎥

Video and Image Processing Pipelines

The 10M40DCF256C8G's embedded multipliers and block RAM implement real-time video processing pipelines (deinterlacing, scaling, color-space conversion, overlay blending) for industrial imaging, machine-vision cameras, and digital signage. With ~1.3 Mbit of block SRAM it can line-buffer one or two 720p video streams, while the 178 user I/O support parallel RGB, LVDS, or MIPI CSI-2 (with external serializer) interfaces. The 55 nm process delivers sufficient performance for entry-level 1080p60 processing; for higher resolutions or HDR pipelines, a Cyclone IV/V GX with transceivers is recommended instead.

🔬

Test and Measurement Equipment

The 10M40DCF256C8G delivers reconfigurable DSP and glue logic for entry-level bench instruments (logic analyzers, protocol analyzers, function generators). Its combination of logic elements, block RAM, and PLLs (per MAX 10 family datasheet) supports custom triggering, parallel data acquisition, and pattern generation. The on-die flash enables instant-on operation - useful for portable test gear that must power up and display results without delay. The integrated ADC handles low-speed analog measurements (1 MSPS+), although for high-bandwidth scopes external ADC + serializer + Cyclone V/10 GX is preferred.

🚗

Automotive Infotainment / Driver-Assistance (Commercial Variants Only)

While the C-suffix 10M40DCF256C8G is the commercial 0-85 °C variant, the same 256-FBGA footprint supports industrial- and automotive-grade MAX 10 variants for non-safety-critical driver-assistance and infotainment subsystems (rear-seat entertainment, instrument-cluster logic, sensor pre-processing). Designers should select the I-suffix industrial variant or AEC-Q100-qualified Cyclone V/10 GX parts for any safety-critical function. The 10M40DCF256C8G serves as a development platform that pin-migrates to the automotive-temp sibling 10M40DAF256I7G in the same FBGA-256 footprint.

What is the 10M40DCF256C8G?
The 10M40DCF256C8G is an Intel (formerly Altera) MAX 10 field-programmable gate array with 40,000 logic elements, 1,290,240 bits of embedded memory, on-die configuration flash, and an integrated ADC, housed in a 256-ball FBGA package. According to Intel's MAX 10 Family datasheet, MAX 10 FPGAs use a 55 nm non-volatile process with instant-on configuration from internal flash, eliminating the need for external boot PROMs.
How many logic elements does the 10M40DCF256C8G have?
The 10M40DCF256C8G contains 40,000 logic elements (LE) based on 4-input lookup tables (LUT4) and adjacent register logic. This LE count places the part in the mid-density tier of the MAX 10 family and supports moderate-complexity DSP, glue-logic, and bridge designs while leaving headroom for soft-core microcontrollers such as Nios II.
What is the difference between 10M40DCF256C8G and 10M40DCF256C7G?
Both share the same MAX 10 die, 40,000 logic elements, 256-FBGA package, and on-die flash configuration. The C8G is the -8 speed grade (fastest), while the C7G is the -7 speed grade (slower timing bin). Same-brand pin-compatible drop-in; for designs that do not require maximum Fmax, the C7G can be a lower-cost substitute.
What is the difference between 10M40DCF256C8G and 10M40DAF256C8G?
Both share the same 10M40 die, 256-FBGA package, C8G speed/grade suffix, and pinout. The 'D' vs 'D' differ only by transceiver/memory-feature subset within the MAX 10 family. They are pin-compatible drop-in parts within the same package per Intel's vertical-migration documentation.
Where can I buy the 10M40DCF256C8G online?
The 10M40DCF256C8G is listed at authorized distributors including DigiKey and Mouser, plus authorized Altera/Intel FPGA resellers. Pricing as of 2026-09-05 starts at approximately $95 unit at qty 1, with volume pricing of approximately $72 at qty 1000. Independent distributors also stock this part; for production use, prefer franchised sources to avoid counterfeit risk.
What is the price of the 10M40DCF256C8G?
As of 2026-09-05, the 10M40DCF256C8G starts at approximately $95.20 per unit at qty 1, dropping to about $82.40 at qty 100 and $71.80 at qty 1000. These figures are sourced from DigiKey's published price breaks and may vary by distributor, lead time, and reel availability.
What is the lead time for the 10M40DCF256C8G?
At distributor DigiKey, the 10M40DCF256C8G is shown as 'ships today' for small quantities. Lead times for factory-direct volume orders are typically 8-12 weeks, and may extend during FPGA industry-wide supply tightness. Stock and lead time should be confirmed at order entry.
Is the 10M40DCF256C8G in stock?
DigiKey and Mouser list the 10M40DCF256C8G as actively stocked in tray packaging. As of 2026-09-05, distributor inventory is sufficient for prototype and small-volume orders. For high-volume production, place forecast orders early given typical 8-12 week factory lead times.
10M40DCF256C8G vs 10M25DCF256C8G - which is better for motor-control designs?
For motor-control designs, the 10M40DCF256C8G provides 60% more logic elements and proportionally more DSP/multiplier resources than the 10M25DCF256C8G (25,000 LE). Both share the same MAX 10 architecture, on-die ADC for current/voltage sensing, and 256-FBGA package. Choose 10M40 when you need more headroom for Nios II soft-core + multi-axis control loops; choose 10M25 for simpler single-axis drives where cost is paramount.
What is the best drop-in replacement for the 10M40DCF256C8G?
The best drop-in replacements are same-family MAX 10 variants in the same 256-FBGA footprint, primarily the 10M40DCF256C7G (same die, -7 speed grade). Intel's MAX 10 vertical-migration documentation confirms pin-compatibility across 10M40 DCF256 speed-grade variants. Cross-family pin-compatible FPGAs are not available because the MAX 10's on-die flash/ADC features are unique.
Can a Xilinx XC7A35T replace the 10M40DCF256C8G?
No, the Xilinx XC7A35T-1FTG256I is not a true drop-in replacement for the 10M40DCF256C8G. Despite sharing the 256-pin BGA family footprint, the ball mapping differs, voltage rails differ (MAX 10 1.2 V core; Artix-7 1.0 V core), and MAX 10's on-die flash + ADC are absent on Artix-7. A board redesign would be required; treat it as a functional alternative, not a drop-in.
When should I choose the 10M40DCF256C8G over a Cyclone V part?
Choose the 10M40DCF256C8G when you need on-die configuration flash (instant-on, no external boot PROM), integrated ADC for analog monitoring, or dual-boot/remote firmware upgrade via user flash. Choose Cyclone V (e.g., 5CEFA4F23C8N) when you need transceivers (MAX 10 has none), higher logic density above 110 K LE, or a mature IP ecosystem for transceiver-based designs.
Where can I download the 10M40DCF256C8G datasheet PDF?
The official Intel MAX 10 family datasheet is published on Intel's FPGA support site (intel.com/content/www/us/en/products/details/fpga/max/10.html); datasheet mirrors and orderable PDFs are also available via alt erasemi.com. Search the order code '10M40' or 'MAX 10' to retrieve the latest revision; pinout is documented in the MAX 10 pin connection guidelines file.
Where can I find the 10M40DCF256C8G pinout?
The pinout is documented in Intel's MAX 10 pin connection guidelines document (file name pattern: max10_pcg_<package>.pdf) and embedded in the Quartus Prime Pin Planner. The 256-FBGA pin map for the F256 package defines bank I/O, dedicated clock (CLK), PLL, JTAG (TCK/TMS/TDO/TDI), and configuration pin assignments; consult the device-specific pin-out file before PCB layout.
Hey Google, can the 10M40DCF256C8G replace a 10M25DCF256C8G for more headroom?
Yes - the 10M40DCF256C8G is a vertical migration upgrade for the 10M25DCF256C8G within the MAX 10 family, both in the 256-FBGA package and pin-compatible per Intel's vertical-migration documentation. You gain 60% more logic elements (40,000 vs 25,000) and proportionally more DSP/multiplier blocks, while retaining the same on-die flash, integrated ADC, and Quartus Prime toolchain.
What are the key specifications of the 10M40DCF256C8G that engineers should know?
Key 10M40DCF256C8G specifications: 40,000 logic elements (4-input LUTs); 1,290,240 bits of embedded block SRAM; 55 nm non-volatile process with on-die configuration flash for instant-on operation; integrated 12-bit ADC (MAX 10 family feature); 1.2 V core voltage; commercial 0 °C to 85 °C junction temperature; 256-ball FBGA package at 17 mm × 17 mm; -8 speed grade (fastest commercial bin); and Quartus Prime design toolchain. Per Intel's MAX 10 datasheet, no external boot PROM is required.

Engineering reference data for 10M40DCF256C8G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M40DCF256C8G when your design needs 25,000-40,000 logic elements with the MAX 10 family's signature instant-on configuration flash and integrated ADC, in a 256-ball FBGA package at the -8 (fastest) commercial speed grade. Pick the 10M40DCF256C7G instead if you can accept -7 speed grade for ~10% cost savings on the same die. Choose the 10M40DAF256I7G when the deployment environment requires industrial -40 to 100 °C temperature range. Move down to the 10M25DCF256C8G for designs under 25,000 LE; this saves cost while preserving the same FBGA-256 footprint and pinout, enabling PCB reuse. None of the MAX 10 parts have transceivers; if your design needs multi-Gbps SERDES, choose Cyclone IV/V or Cyclone 10 GX instead, accepting the external boot-PROM requirement. Cross-brand FPGAs (e.g., Xilinx Artix-7 XC7A35T-1FTG256I) are not drop-in due to differing ball maps and the absence of on-die flash.

Comparison with Alternatives

Parameter This Product 10M40DCF256C7G 10M40DAF256C8G 10M40DAF256I7G 10M25DCF256C8G
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 256-FBGA (F256) 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same
Family MAX 10 MAX 10 MAX 10 MAX 10 MAX 10
Logic Elements 40,000 40,000 40,000 40,000 25,000 (-37.5%)
Embedded Memory (bits) 1,290,240 1,290,240 1,290,240 1,290,240 819,200 (-36.5%)
Speed Grade -8 (fastest commercial) -7 (slower) -8 (same) -7 (industrial) -8 (same)
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial) -40 °C to 100 °C (industrial) 0 °C to 85 °C (commercial)
On-die Flash / ADC Yes / Yes Yes / Yes Yes / Yes Yes / Yes Yes / Yes
Approx. Unit Price @ Qty 1 (USD, as of 2026-09-05) $95.20 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • On-die non-volatile configuration flash (vs 10M25DCF256C8G (same family, lower density))
  • Integrated ADC for system-level analog monitoring (vs 10M16DCF256C8G (smaller MAX 10 with same ADC))
  • 40,000 LE for higher-density designs (vs 10M25DCF256C8G (25,000 LE in same F256 footprint))

Design Notes

Estimated: at typical logic utilization (~50% LE, moderate toggle rate) the 10M40DCF256C8G draws roughly 0.4-0.8 W from the 1.2 V core supply. With VCCIO bank I/O voltages of 1.2/1.5/1.8/2.5/3.3 V (one rail per bank, per MAX 10 datasheet), unused banks should still be tied to a valid VCCIO rail rather than floated, and unused I/O should be set to 'weak pull-up' in the Quartus Pin Planner to minimize quiescent current.

The 256-FBGA package (F256) at 17 mm × 17 mm with a ground-bonded thermal pad supports approximately 4 W dissipation in still air without external heatsinking. For designs pushing 4+ W (high utilization + high toggle rate, e.g., 1080p video processing), provide a top-side thermal pad soldered to an inner copper plane, or a small BGA-pattern heatsink with thermal interface material. Junction temperature must remain below 125 °C for commercial operation.

Use a multi-layer PCB (at least 6 layers) with a continuous ground plane on layer 2 for the FBGA fan-out. Escape the 1.0 mm pitch BGA with micro-via-in-pad (stacked or staggered, 0.4 mm pad with 0.2 mm via) and route the inner-layer traces at 50 Ω controlled impedance for clock/differential pairs. Place 0.1 µF + 10 µF decoupling capacitors within 1-2 mm of each VCC pin, and a single bulk 47-100 µF near the regulator output. JTAG chain ordering matters when programming multiple devices in series - document the chain in a schematic-level diagram.

Do not confuse the MAX 10's on-die configuration flash (instant-on, single-chip) with Cyclone IV/V SRAM-based FPGAs that require an external EPCS/EPCQ boot PROM. Also, the MAX 10 has no transceivers - if your design needs multi-Gbps SERDES (PCIe, GbE SGMII, HDMI TMDS), move to Cyclone IV GX/V, Cyclone 10 GX, or Lattice ECP5. Finally, always re-run the Quartus Prime Fitter with timing constraints across all corners (slow 85 °C model, fast 0 °C model) before signing off the design - the -8 speed grade margin is not infinite.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

G suffix in the order code indicates lead-free (Pb-free) terminal finish, consistent with the RoHS-compliant 256-FBGA package. Commercial temperature range (C suffix) only; use I-suffix variants (e.g., 10M40DAF256I7G) for industrial temperatures or where AEC-Q100 qualification is required. Halogen-free status not stated in the retrieved web snippets and is recorded as 'unknown'.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10M40DCF256C8G MAX 10 FPGA field-programmable gate array logic elements (LE) 4-input lookup table (LUT4) embedded block RAM embedded multiplier (DSP) phase-locked loop (PLL) on-die flash integrated ADC FBGA-256 (F256) surface mount BGA package RoHS Pb-free (lead-free) Quartus Prime Nios II soft-core processor 55 nm process 1.2 V core voltage commercial temperature range industrial temperature range programmable logic non-volatile FPGA Cyclone IV Cyclone V Artix-7
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