10M40SCE144A7G - MAX 10 FPGA, 40K LE, 144-EQFP | Intel
MPN: 10M40SCE144A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.92 | $87.92 |
| 10 | $79.13 | $791.30 |
| 100 | $70.34 | $7,034.00 |
| 500 | $63.5 | $31,750.00 |
| 1,000 | $57.21 | $57,210.00 |
Drop-in alternatives for 10M40SCE144A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M40SCE144I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$43.85 / Unit
View Datasheet β10M40SCE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$43.2 / Unit
View Datasheet β10M25SCE144A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$47.21 / Unit
View Datasheet β10M16SCE144A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$24.5 / Unit
View Datasheet β10M40SCE144A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory Bits | 1,290,240 bits |
| Embedded Memory Type | M9K / M144K blocks |
| Maximum User I/O | 101 |
| Maximum Internal Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 144-LQFP Exposed Pad (EQFP, 22x22 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Automotive (-40C to +125C, inferred from A7G suffix) |
| Configuration Memory | On-chip dual-configuration flash |
| Hardened PCIe | Yes, Gen2 |
| Integrated ADC | Yes (MAX 10 hard IP) |
| RoHS Status | Compliant |
10M40SCE144A7G Pin Configuration
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| Pin 108 | GND β Ground |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40SCE144A7G is suitable for 6 applications: Industrial Motor Control, Automotive Body Electronics, ASIC Prototyping, I/O Expansion and Protocol Bridging, Low-Cost Video Processing Bridges, Battery Management Systems.
Industrial Motor Control
The 10M40SCE144A7G's 40,000 logic elements, integrated 12-bit ADC, and hardened PCIe Gen2 make it well-suited for industrial motor control applications such as BLDC and servo drives. The on-chip ADC samples phase currents and bus voltage directly, eliminating an external ADC and shrinking BOM cost. With 101 user I/O, the device can drive multiple gate-driver channels, encoder interfaces (EnDat, BISS, SSI), and CAN/RS-485 communications in a single chip. Quartus Prime provides motor-control reference designs with field-oriented control (FOC) blocks on the 18x18 DSP multipliers, achieving deterministic torque-loop cycles at 20-50 kHz. The automotive -40C to +125C temperature grade covers harsh factory-floor environments where convection cooling is limited.
Recommended
Automotive Body Electronics
Body-control modules, lighting controllers, and gateway ECUs benefit from the 10M40SCE144A7G's automotive temperature grade (-40C to +125C) and integrated features. The on-chip dual-configuration flash supports secure OTA updates and instant-on boot in <100 ms, critical for CAN/LIN wake-up scenarios. Hardened LVDS and 3.3 V LVCMOS I/O support direct connection to automotive transceivers and LED matrix drivers. The 1,290 Kbits embedded SRAM buffer sensor data and CAN-FD message queues without external memory. The exposed-pad 144-EQFP package is reflow-compatible with standard automotive PCB processes and meets AEC-Q100 expectations when paired with the matching -Q1 ordering code.
Recommended
ASIC Prototyping
The 10M40SCE144A7G's 40K logic elements and abundant DSP blocks make it a strong target for ASIC RTL prototyping of moderate-complexity designs, particularly mixed-signal ASICs where the integrated ADC is used as a placeholder block. Quartus Prime supports incremental compilation, allowing the same physical prototype board to absorb design iterations without re-synthesis from scratch. Instant-on flash boot enables <100 ms bring-up for CI/CD verification flows. The automotive temperature range lets prototypes be reused for both lab and field validation.
Recommended
I/O Expansion and Protocol Bridging
SoCs and microcontrollers often need additional GPIOs, UART, I2C, SPI, or custom interfaces that the host cannot provide. The 10M40SCE144A7G offers 101 user I/O plus hardened LVDS and PCIe, enabling bridging from a single SoC to multiple peripherals or to a downstream backplane. The on-chip flash simplifies firmware updates over JTAG or AS without external boot memory. Automotive grade supports in-cabin or under-hood gateway modules.
Recommended
Low-Cost Video Processing Bridges
The 10M40SCE144A7G's LVDS I/O, embedded M9K memory, and 18x18 multipliers can implement light-weight video pipelines such as MIPI-CSI-2 to parallel RGB conversion, frame-rate conversion, and overlay compositing. The automotive temperature grade suits in-cabin driver-monitoring and surround-view pre-processing where off-the-shelf SoCs are over-spec. Embedded memory provides line buffers without external SDRAM, keeping BOM and PCB area minimal.
Recommended
Battery Management Systems
Battery-management systems (BMS) in e-mobility and energy storage require multi-channel cell-voltage and temperature monitoring with deterministic timing. The 10M40SCE144A7G's integrated 12-bit ADC samples multiple cell voltages through external multiplexer arrays, while the 1,290 Kbits of embedded SRAM log transient events for state-of-charge algorithms. Automotive grade -40C to +125C operation covers under-hood and outdoor cabinet environments. The hardened PCIe interface supports direct connection to a vehicle domain controller without an intermediate bridge.
Recommended
Recommended Products Summary
Engineering reference data for 10M40SCE144A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40SCE144I7G | 10M40SCE144C8G | 10M25SCE144A7G | 10M16SCE144A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 25,000 | 16,000 |
| Embedded Memory | 1,290,240 bits | 1,290,240 bits | 1,290,240 bits | 837,120 bits | 549,888 bits |
| Maximum User I/O | 101 | 101 | 101 | 101 | 78 |
| Temperature Grade | Automotive (-40C to +125C) | Industrial (0C to +85C) | Industrial (0C to +85C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) |
| On-chip Configuration Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
| Maximum Internal Frequency | 472.5 MHz | 472.5 MHz | 472.5 MHz | 472.5 MHz | 472.5 MHz |
| Approximate Unit Price (qty 1, USD) | 87.92 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in the 144-EQFP MAX 10 package (vs 10M25SCE144A7G)
- On-chip dual-configuration flash (non-volatile boot) (vs 10M16SCE144A7G)
- Automotive temperature grade at full logic capacity (vs 10M40SCE144I7G)
Design Notes
The 144-EQFP package relies on the exposed pad for primary heat dissipation. Solder the exposed pad to a top-layer copper pour of at least 1 square inch connected to the ground plane with a thermal via array (recommended 5x5 vias of 0.3 mm drill). Without proper thermal bonding, junction-to-ambient theta_JA exceeds 30 C/W and the device may throttle or shut down under sustained DSP utilization. Always run the Intel PowerPlay Power Analyzer early in the design flow to confirm worst-case junction temperature.
Place decoupling capacitors as close as possible to every power pin pair (VCCINT, VCCA, VCCIO bank supplies). Use 100 nF X7R 0402/0603 on every VCCIO pin and bulk 10 uF tantalum or ceramic on VCCINT. Keep JTAG and configuration traces away from high-speed LVDS/PCIe lanes and route them over a continuous ground reference for signal integrity.
Estimated: a common error is leaving the configuration pins (MSEL[0..3], nCONFIG, nSTATUS, CONF_DONE) floating. Tie MSEL to the correct mode (AS=00, JTAG=01, PS=10) using 4.7 kohm pull-ups or pull-downs per the MAX 10 configuration guide. Also confirm the dual-purpose pins (e.g. JTAG and GPIO sharing) are correctly assigned in Quartus Pin Planner to avoid the device locking out JTAG after the first configuration.
Compliance Information
RoHS and lead-free confirmed via distributor listings; the A7G temperature grade is automotive but the ordering code itself does not imply separate AEC-Q100 qualification - design should validate system-level qualification
