10M40SCE144C8G - MAX 10 FPGA 40K LE 144-EQFP | Intel / Altera
MPN: 10M40SCE144C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $59.13 | $59.13 |
| 10 | $56.2 | $562.00 |
| 100 | $51.45 | $5,145.00 |
| 500 | $47.1 | $23,550.00 |
| 1,000 | $43.2 | $43,200.00 |
Drop-in alternatives for 10M40SCE144C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M40SCE144A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$57.21 / Unit
View Datasheet β10M40SCE144I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$43.85 / Unit
View Datasheet β10M40SAE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$195.85 / Unit
View Datasheet β10M40SAE144I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$57.1 / Unit
View Datasheet β10M25SCE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M40SCE144C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User I/O Count | 101 |
| Package Type | 144-LQFP Exposed Pad (EQFP-144) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0Β°C to +85Β°C (commercial) |
| Speed Grade | C8 |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Integrated ADC | Dual 12-bit SAR, up to 17 analog inputs |
| Hard Memory Controller | LPDDR2, DDR2, DDR3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10M40SCE144C8G Pin Configuration
| Pin 1 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 2 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 3 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 4 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 5 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 6 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 7 | VCCIO1B β I/O supply voltage Bank 1B |
| Pin 8 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 9 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 10 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 13 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 14 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 15 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 16 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 17 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 18 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 19 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 20 | VCCIO1B β I/O supply voltage Bank 1B |
| Pin 21 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 22 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 23 | GND β Ground |
| Pin 24 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 25 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 26 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 27 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 28 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 29 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 30 | I/O β General-purpose user I/O (Bank 1B) |
| Pin 31 | VCCIO1A β I/O supply voltage Bank 1A |
| Pin 32 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 33 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 34 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 35 | GND β Ground |
| Pin 36 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 37 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 38 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 39 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 40 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 41 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 42 | VCC β Core supply voltage |
| Pin 43 | I/O β General-purpose user I/O (Bank 2) |
| Pin 44 | I/O β General-purpose user I/O (Bank 2) |
| Pin 45 | I/O β General-purpose user I/O (Bank 2) |
| Pin 46 | GND β Ground |
| Pin 47 | I/O β General-purpose user I/O (Bank 2) |
| Pin 48 | I/O β General-purpose user I/O (Bank 2) |
| Pin 49 | I/O β General-purpose user I/O (Bank 2) |
| Pin 50 | I/O β General-purpose user I/O (Bank 2) |
| Pin 51 | I/O β General-purpose user I/O (Bank 2) |
| Pin 52 | VCCIO2 β I/O supply voltage Bank 2 |
| Pin 53 | I/O β General-purpose user I/O (Bank 2) |
| Pin 54 | I/O β General-purpose user I/O (Bank 2) |
| Pin 55 | GND β Ground |
| Pin 56 | I/O β General-purpose user I/O (Bank 2) |
| Pin 57 | I/O β General-purpose user I/O (Bank 2) |
| Pin 58 | I/O β General-purpose user I/O (Bank 2) |
| Pin 59 | I/O β General-purpose user I/O (Bank 3) |
| Pin 60 | VCCIO3 β I/O supply voltage Bank 3 |
| Pin 61 | I/O β General-purpose user I/O (Bank 3) |
| Pin 62 | I/O β General-purpose user I/O (Bank 3) |
| Pin 63 | I/O β General-purpose user I/O (Bank 3) |
| Pin 64 | I/O β General-purpose user I/O (Bank 3) |
| Pin 65 | GND β Ground |
| Pin 66 | I/O β General-purpose user I/O (Bank 3) |
| Pin 67 | I/O β General-purpose user I/O (Bank 3) |
| Pin 68 | VCC β Core supply voltage |
| Pin 69 | I/O β General-purpose user I/O (Bank 4) |
| Pin 70 | I/O β General-purpose user I/O (Bank 4) |
| Pin 71 | I/O β General-purpose user I/O (Bank 4) |
| Pin 72 | I/O β General-purpose user I/O (Bank 4) |
| Pin 73 | I/O β General-purpose user I/O (Bank 4) |
| Pin 74 | VCCIO4 β I/O supply voltage Bank 4 |
| Pin 75 | I/O β General-purpose user I/O (Bank 4) |
| Pin 76 | I/O β General-purpose user I/O (Bank 4) |
| Pin 77 | I/O β General-purpose user I/O (Bank 4) |
| Pin 78 | I/O β General-purpose user I/O (Bank 4) |
| Pin 79 | GND β Ground |
| Pin 80 | I/O β General-purpose user I/O (Bank 4) |
| Pin 81 | I/O β General-purpose user I/O (Bank 4) |
| Pin 82 | I/O β General-purpose user I/O (Bank 5) |
| Pin 83 | VCCIO5 β I/O supply voltage Bank 5 |
| Pin 84 | I/O β General-purpose user I/O (Bank 5) |
| Pin 85 | I/O β General-purpose user I/O (Bank 5) |
| Pin 86 | I/O β General-purpose user I/O (Bank 5) |
| Pin 87 | I/O β General-purpose user I/O (Bank 5) |
| Pin 88 | I/O β General-purpose user I/O (Bank 5) |
| Pin 89 | GND β Ground |
| Pin 90 | VCC β Core supply voltage |
| Pin 91 | I/O β General-purpose user I/O (Bank 6) |
| Pin 92 | I/O β General-purpose user I/O (Bank 6) |
| Pin 93 | I/O β General-purpose user I/O (Bank 6) |
| Pin 94 | VCCIO6 β I/O supply voltage Bank 6 |
| Pin 95 | I/O β General-purpose user I/O (Bank 6) |
| Pin 96 | I/O β General-purpose user I/O (Bank 6) |
| Pin 97 | I/O β General-purpose user I/O (Bank 6) |
| Pin 98 | I/O β General-purpose user I/O (Bank 6) |
| Pin 99 | GND β Ground |
| Pin 100 | I/O β General-purpose user I/O (Bank 7) |
| Pin 101 | I/O β General-purpose user I/O (Bank 7) |
| Pin 102 | VCCIO7 β I/O supply voltage Bank 7 |
| Pin 103 | I/O β General-purpose user I/O (Bank 7) |
| Pin 104 | I/O β General-purpose user I/O (Bank 7) |
| Pin 105 | I/O β General-purpose user I/O (Bank 7) |
| Pin 106 | I/O β General-purpose user I/O (Bank 7) |
| Pin 107 | VCC β Core supply voltage |
| Pin 108 | I/O β General-purpose user I/O (Bank 8) |
| Pin 109 | I/O β General-purpose user I/O (Bank 8) |
| Pin 110 | GND β Ground |
| Pin 111 | I/O β General-purpose user I/O (Bank 8) |
| Pin 112 | I/O β General-purpose user I/O (Bank 8) |
| Pin 113 | VCCIO8 β I/O supply voltage Bank 8 |
| Pin 114 | I/O β General-purpose user I/O (Bank 8) |
| Pin 115 | I/O β General-purpose user I/O (Bank 8) |
| Pin 116 | I/O β General-purpose user I/O (Bank 8) |
| Pin 117 | I/O β General-purpose user I/O (Bank 8) |
| Pin 118 | I/O β General-purpose user I/O (Bank 8) |
| Pin 119 | GND β Ground |
| Pin 120 | nSTATUS β Configuration status (open-drain) |
| Pin 121 | TCK β JTAG test clock |
| Pin 122 | TMS β JTAG test mode select |
| Pin 123 | TDI β JTAG test data in |
| Pin 124 | TDO β JTAG test data out |
| Pin 125 | nCONFIG β Configuration control (active-low) |
| Pin 126 | CONF_DONE β Configuration done (open-drain) |
| Pin 127 | DCLK β Configuration clock |
| Pin 128 | DATA0 β Configuration data input |
| Pin 129 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 130 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 131 | VCC β Core supply voltage |
| Pin 132 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 133 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 134 | GND β Ground |
| Pin 135 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 136 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 137 | VCCIO1A β I/O supply voltage Bank 1A |
| Pin 138 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 139 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 140 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 141 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 142 | GND β Ground |
| Pin 143 | I/O β General-purpose user I/O (Bank 1A) |
| Pin 144 | EPAD β Exposed thermal pad (must be soldered to ground pour) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40SCE144C8G is suitable for 6 applications: Industrial Motor Control, Machine Vision and Video Bridging, IoT Edge Sensor Aggregation, Automotive Driver Assistance, Display Controller and Video Wall, Low-Power Portable Test Equipment.
Industrial Motor Control
The 10M40SCE144C8G fits industrial motor control applications because its 40,000 logic elements, 101 user I/O pins, and integrated dual 12-bit ADC eliminate the need for a separate motor-control MCU plus ADC chip. The on-chip flash configuration enables instant-on startup critical for safety-rated servo drives. With the hard LPDDR2/DDR2/DDR3 controller, designers can connect external motion-controller memory without soft-IP overhead. The 144-EQFP package exposes 101 I/O pins suitable for connecting Hall sensors, quadrature encoders, PWM outputs to gate drivers, and SPI/I2C peripherals. Per Intel MAX 10 datasheet, the device supports industrial protocols such as EtherCAT, PROFIBUS, and CAN via soft IP. Trade-off: at 40K LEs the part may not fit full servo-loop implementations requiring more DSP blocks; consider Cyclone IV/V for >50K LE designs.
Recommended
Machine Vision and Video Bridging
The 10M40SCE144C8G is suited to machine vision and video bridging because its on-chip logic capacity can host soft MIPI CSI-2, LVDS, or parallel video receivers, while 101 user I/O pins handle image-sensor data buses plus display-side LVDS or CMOS outputs. The integrated 12-bit ADC samples illumination sensors for ambient-light feedback in camera modules. Per Intel MAX 10 datasheet, the device's hard memory controller supports DDR3 buffering for frame storage in mid-resolution inspection cameras. The non-volatile configuration simplifies factory calibration since calibration data can be stored in the user flash region of the part. Trade-off: high-resolution (>1080p) video pipelines exceed 40K LEs; for those workloads the Cyclone V or MAX 10 50K-LE parts are better choices.
Recommended
IoT Edge Sensor Aggregation
The 10M40SCE144C8G suits IoT edge sensor aggregation because the integrated dual 12-bit SAR ADC accepts up to 17 analog inputs directly from temperature, pressure, and current sensors, eliminating an external ADC. The non-volatile flash configuration ensures the gateway reboots reliably after power-cycle events common in battery-powered IoT nodes. With 101 I/O pins, the part can aggregate SPI, I2C, UART, and GPIO signals from multiple sensor daughter-boards and pre-process them in fabric before forwarding to a backhaul MCU. Per Intel documentation, the MAX 10 family supports low-power modes including a sleep state that retains configuration. Trade-off: the 144-EQFP package is larger than BGA alternatives; for space-constrained IoT nodes the 256-ball BGA MAX 10 variants are smaller.
Recommended
Automotive Driver Assistance
The 10M40SCE144C8G fits automotive driver-assistance subsystems such as rear-camera controllers, sensor-fusion pre-processors, and LED headlight drivers because its 101 I/O pins accommodate multiple LVDS video streams plus LIN/CAN connectivity. Per Intel MAX 10 datasheet, the device offers instant-on capability critical for rear-view cameras that must display within milliseconds of reverse-gear engagement. The hard DDR3 controller buffers frame data from the image sensor. For AEC-Q100 qualified designs, the 10M40SAE144C8G automotive variant provides the same 144-EQFP footprint with automotive-grade temperature and qualification. Trade-off: for full image-processing pipelines the 40K LEs may be tight; Cyclone V or Arria 10 devices provide more DSP and logic for vision processing.
Recommended
Display Controller and Video Wall
The 10M40SCE144C8G is well-matched to display controllers and small video walls because its 101 user I/O pins can drive multiple TTL/LVDS display interfaces plus a parallel RGB or HDMI bridge. The 1,290,240-bit embedded SRAM holds frame-buffer lines, and the hard DDR3 controller supports external SDRAM for full-frame buffering. Per Intel MAX 10 documentation, the device supports common display protocols like DPI, LVDS, and OpenLDI via soft IP. The 144-EQFP package is hand-solder-friendly, simplifying prototype rework on display evaluation boards. Trade-off: video-wall systems >4 displays exceed 40K LEs; Cyclone V GX/GT parts offer transceivers for higher-bandwidth video aggregation.
Recommended
Low-Power Portable Test Equipment
The 10M40SCE144C8G serves portable test equipment because its instant-on non-volatile configuration eliminates boot delays when the user powers the handheld instrument on. The 40K logic elements handle signal-generation logic, protocol decoding, and LCD-driving interfaces. The integrated 12-bit ADC captures sensor or DUT analog signals without an external converter, reducing BOM and battery drain. Per Intel MAX 10 datasheet, the device supports sleep modes that retain configuration, allowing portable meters to wake on button-press and resume operation in microseconds. Trade-off: battery life depends on switching activity; the MAX 10 family typically draws more quiescent power than CPLDs in idle states.
Recommended
Recommended Products Summary
Engineering reference data for 10M40SCE144C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40SCE144A7G | 10M40SCE144I7G | 10M40SAE144C8G | 10M25SCE144C8G |
|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Speed Grade | C8 | A7 (slower) | I7 | C8 (same) | C8 (same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | Automotive AEC-Q100 | 0C to +85C |
| User I/O Count | 101 | 101 | 101 | 101 | [DATA_NEEDED] |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | [DATA_NEEDED] |
| Integrated ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR |
| Approx. Unit Price (USD) | 59.13 (qty 1) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes |
Key Differentiators
- Non-volatile on-chip configuration eliminates external boot PROM (vs Xilinx Spartan-6 (requires external configuration flash))
- Integrated dual 12-bit SAR ADC with up to 17 analog inputs (vs Lattice ECP5 (no integrated ADC))
- Hard LPDDR2/DDR2/DDR3 memory controller (vs Microchip PolarFire (requires soft memory controller))
- Pin-to-pin compatibility across commercial, industrial, and automotive grades (vs Xilinx 7-series (different package per temp grade))
Design Notes
Estimated: The 144-EQFP package has a junction-to-ambient thermal resistance of approximately 22 C/W with the exposed pad soldered to a 1 inΒ² copper pour on a 4-layer PCB (per Intel MAX 10 thermal guidelines). For continuous switching activity at 40K LE utilization, the junction temperature rise at ambient 25Β°C is roughly 25-35Β°C depending on toggle rate. The exposed pad (pin 144) MUST be soldered to the PCB ground pour for proper thermal dissipation; leaving it unsoldered increases theta_JA by ~50% and risks thermal-induced timing failures.
Per Intel MAX 10 datasheet, the 10M40SCE144C8G requires multiple supply rails: VCC (core, typically 1.2V), VCCA (analog/pll, 2.5V), VCCIOx (per I/O bank, 1.2V-3.3V), and VCCD_PLL (PLL digital, 1.2V). Each VCCIO bank can be independently set to support mixed-voltage interfaces. Place 0.1Β΅F decoupling capacitors within 3mm of every VCC/VCCIO/VCCA pin and a 10Β΅F bulk capacitor near each supply rail. Add ferrite beads between analog VCCA and digital VCC to minimize ADC noise coupling.
The 144-EQFP has a 0.5mm pitch and exposed thermal pad. Per Intel layout guidelines, use 4-layer PCB with continuous ground plane beneath the FPGA; route all high-speed signals on inner layers with reference to ground. JTAG chain (TCK, TMS, TDI, TDO) requires 4.7kΞ© pull-ups on TMS and TDI. The nSTATUS and CONF_DONE signals are open-drain and require external 10kΞ© pull-ups to VCCIO. Daisy-chain JTAG when multiple devices are present on the board.
Do not leave unused I/O pins floating in the design - explicitly configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus pin assignment. Floating inputs can draw excess current and cause oscillations. When using the integrated ADC, ensure analog inputs are properly anti-aliased with RC filters (typically 100Ξ© + 1nF) before connecting to ADCIN pins. Avoid routing noisy digital signals near analog traces to preserve ADC SNR.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not qualified on this part number - select the 10M40SAE144C8G for automotive. Halogen-free status not confirmed in verified data.
