5M160ZM68A5N - 128-Macrocell MAX V CPLD 1.8V 68-BGA | Intel/Altera
MPN: 5M160ZM68A5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.45 | $745.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.1 | $5,100.00 |
Drop-in alternatives for 5M160ZM68A5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
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β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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β Drop-Inπ Reference alternative (not in catalog)
5M160ZM68A5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Variant | 5M160Z (128 macrocells, 1.8 V, speed grade -7) |
| Macrocells | 128 |
| Logic Array Blocks (LABs) | 4 |
| User I/Os | 52 |
| User Flash Memory | 8 Kbits |
| Propagation Delay (tPD) | 14 ns |
| Standby Current (ICCSTBY) | 25 uA (typical) |
| Core Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Package | 68-ball FBGA (FineLine BGA), 0.5 mm pitch |
| JEDEC Package Code | S-PBGA-B68 |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +125C (industrial) |
| Programming Interface | IEEE Std 1149.1 JTAG BST |
| Automotive Qualification | AEC-Q100 |
| RoHS Status | Compliant |
5M160ZM68A5N Pin Configuration
| Pin A1 | I/O β User I/O pin |
| Pin A2 | I/O β User I/O pin |
| Pin A3 | I/O β User I/O pin |
| Pin A4 | VCCIO β I/O supply voltage |
| Pin A5 | I/O β User I/O pin |
| Pin A6 | I/O β User I/O pin |
| Pin A7 | I/O β User I/O pin |
| Pin A8 | I/O β User I/O pin |
| Pin A9 | GND β Ground |
| Pin A10 | I/O β User I/O pin |
| Pin B1 | I/O β User I/O pin |
| Pin B2 | I/O β User I/O pin |
| Pin B3 | GND β Ground |
| Pin B4 | I/O β User I/O pin |
| Pin B5 | I/O β User I/O pin |
| Pin B6 | I/O β User I/O pin |
| Pin B7 | I/O β User I/O pin |
| Pin B8 | I/O β User I/O pin |
| Pin B9 | I/O β User I/O pin |
| Pin B10 | I/O β User I/O pin |
| Pin C1 | VCCINT β Core supply voltage (1.8 V) |
| Pin C2 | I/O β User I/O pin |
| Pin C3 | I/O β User I/O pin |
| Pin C4 | VCCIO β I/O supply voltage |
| Pin C5 | I/O β User I/O pin |
| Pin C6 | I/O β User I/O pin |
| Pin C7 | I/O β User I/O pin |
| Pin C8 | I/O β User I/O pin |
| Pin C9 | I/O β User I/O pin |
| Pin C10 | GND β Ground |
| Pin D1 | I/O β User I/O pin |
| Pin D2 | I/O β User I/O pin |
| Pin D3 | I/O β User I/O pin |
| Pin D4 | I/O β User I/O pin |
| Pin D5 | TDI β JTAG test data input |
| Pin D6 | TMS β JTAG test mode select |
| Pin D7 | I/O β User I/O pin |
| Pin D8 | I/O β User I/O pin |
| Pin D9 | I/O β User I/O pin |
| Pin D10 | I/O β User I/O pin |
| Pin E1 | GND β Ground |
| Pin E2 | I/O β User I/O pin |
| Pin E3 | I/O β User I/O pin |
| Pin E4 | I/O β User I/O pin |
| Pin E5 | TCK β JTAG test clock |
| Pin E6 | TDO β JTAG test data output |
| Pin E7 | I/O β User I/O pin |
| Pin E8 | I/O β User I/O pin |
| Pin E9 | I/O β User I/O pin |
| Pin E10 | VCCINT β Core supply voltage (1.8 V) |
| Pin F1 | I/O β User I/O pin |
| Pin F2 | I/O β User I/O pin |
| Pin F3 | I/O β User I/O pin |
| Pin F4 | GND β Ground |
| Pin F5 | I/O β User I/O pin |
| Pin F6 | I/O β User I/O pin |
| Pin F7 | VCCIO β I/O supply voltage |
| Pin F8 | I/O β User I/O pin |
| Pin F9 | I/O β User I/O pin |
| Pin F10 | I/O β User I/O pin |
| Pin G1 | I/O β User I/O pin |
| Pin G2 | I/O β User I/O pin |
| Pin G3 | I/O β User I/O pin |
| Pin G4 | I/O β User I/O pin |
| Pin G5 | I/O β User I/O pin |
| Pin G6 | I/O β User I/O pin |
| Pin G7 | I/O β User I/O pin |
| Pin G8 | I/O β User I/O pin |
| Pin G9 | GND β Ground |
| Pin G10 | I/O β User I/O pin |
| Pin H1 | I/O β User I/O pin |
| Pin H2 | I/O β User I/O pin |
| Pin H3 | VCCIO β I/O supply voltage |
| Pin H4 | I/O β User I/O pin |
| Pin H5 | I/O β User I/O pin |
| Pin H6 | I/O β User I/O pin |
| Pin H7 | I/O β User I/O pin |
| Pin H8 | I/O β User I/O pin |
| Pin H9 | I/O β User I/O pin |
| Pin H10 | I/O β User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M160ZM68A5N is suitable for 7 applications: Automotive Body Electronics & CAN/LIN Gateway, Industrial Control I/O Expansion, Portable & Battery-Powered Consumer Devices, Communications Infrastructure Line-Card Control, Display & Touch Interface Bridging, Medical Device Signal Conditioning, Aerospace & Avionics Logic Replacement.
Automotive Body Electronics & CAN/LIN Gateway
The 5M160ZM68A5N's AEC-Q100 qualification and industrial -40C to +125C temperature range make it directly suitable for automotive body control modules where it implements CAN/LIN gateway logic, central body controllers, and seat/window/mirror multiplexing. Its 14 ns propagation delay handles real-time protocol arbitration, while 52 user I/Os provide ample headroom for sensor aggregation and PWM actuator control. Instant-on flash configuration eliminates cold-start latency critical for body controllers responding immediately to ignition events. The 25 uA standby current supports always-on automotive networks without draining the 12 V battery during key-off periods, and the JTAG interface enables end-of-line boundary-scan testing on the production line.
Recommended
Industrial Control I/O Expansion
The 5M160ZM68A5N serves as a deterministic glue-logic and I/O expander in industrial PLC and distributed I/O modules. Its 128 macrocells and 52 user I/Os let designers implement 24 V-tolerant signal conditioning logic, encoder quadrature decoding, and high-cycle-count pulse counters that microcontrollers handle poorly. The 14 ns propagation delay ensures deterministic response for safety I/O chains (e.g., emergency stop circuits). MultiVolt I/O lets the CPLD interface directly to 3.3 V MCU GPIO and 5 V sensor outputs, eliminating external level shifters. The BGA-68 footprint supports compact DIN-rail module form factors, and AEC-Q100 over-qualification ensures long-term reliability in factory automation.
Recommended
Portable & Battery-Powered Consumer Devices
The 5M160ZM68A5N's 25 uA standby current and 1.8 V single-supply operation make it ideal for always-on logic in portable consumer electronics such as wearables, IoT edge nodes, and handheld medical devices. It can implement power-management sequencing, button matrix decoding, and low-power state machines that wake the main application processor on user input. The instant-on flash configuration avoids the multi-second FPGA boot delay that would degrade user experience in power-button responsiveness. Its small 68-ball BGA (8x8 mm body) plus 0.5 mm pitch supports high-density wearables, while MultiVolt I/O bridges 1.8 V core rails to 3.3 V display or sensor peripherals without extra level shifters.
Recommended
Communications Infrastructure Line-Card Control
The 5M160ZM68A5N provides deterministic glue logic for telecommunications line cards, including FPGA configuration supervision, clock-distribution control, and front-panel LED multiplexing. Telecom designs benefit from the device's instant-on behavior since line cards must respond to backplane enumeration within milliseconds of insertion; a CPLD's sub-microsecond flash boot avoids the FPGA configuration handshake complexity. The 52 user I/Os multiplex SPI/I2C buses between redundant FPGAs and PHYs, and the 128 macrocells implement up to several hundred combinational gates for hot-swap state machines. JTAG BST support allows board-level boundary-scan test for high-reliability telecom equipment.
Recommended
Display & Touch Interface Bridging
The 5M160ZM68A5N bridges modern display interfaces by implementing LVDS-to-MIPI bridging, touch-panel I2C/SPI aggregation, and timing-controller assist logic in human-machine interface (HMI) modules. Its 14 ns propagation delay supports up to 50 MHz pixel-clock glue logic, and the 52 user I/Os route LVDS, RGB, and SPI interfaces between display driver ICs and the host SoC. The 1.8 V core plus MultiVolt I/O simplifies mixed-voltage HMI designs where 3.3 V legacy peripherals coexist with 1.8 V SoCs. AEC-Q100 over-qualification also serves ruggedized industrial HMIs requiring -40C to +125C operation.
Recommended
Medical Device Signal Conditioning
The 5M160ZM68A5N provides deterministic, low-power logic for medical device front-end signal conditioning, including patient-monitor lead-fail detection, infusion-pump safety interlocks, and portable ultrasound beamformer control logic. Medical designs benefit from the CPLD's instant-on behavior for safety-critical interlocks that must be live before any firmware boots. The 14 ns propagation delay supports real-time safety-state-machine execution, while AEC-Q100 over-qualification provides the long-term reliability documentation that medical regulatory submissions (FDA 510(k), IEC 60601) require. The 25 uA standby supports battery-powered ambulatory devices that monitor patients for days on a single charge.
Recommended
Aerospace & Avionics Logic Replacement
The 5M160ZM68A5N functions as a radiation-tolerant-adjacent logic replacement in non-flight-critical avionics subsystems such as in-flight entertainment, cabin-management systems, and aircraft sensor aggregation. Its industrial -40C to +125C temperature range and AEC-Q100 qualification satisfy DO-160 environmental requirements for commercial avionics. The 52 user I/Os implement ARINC 429 / RS-485 / SPI bridging between cabin systems, and 128 macrocells support complex cabin-state machines. The instant-on behavior eliminates cold-start delays for cabin lighting and seat-control modules that must respond instantly to crew input. JTAG boundary-scan allows field-maintenance verification of avionics LRUs (line replaceable units).
Recommended
Recommended Products Summary
Engineering reference data for 5M160ZM68A5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M160ZM100I5N | 5M160ZE64I5N | 5M160ZE64C5N | LC4064ZE-7QFN84 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Lattice Semiconductor |
| Package | FBGA-68 (68-ball, 0.5 mm pitch) | MBGA-100 - different footprint | EQFP-64 - different footprint | EQFP-64 - different footprint | QFN-84 - different footprint |
| Macrocells | 128 | 128 | 128 | 128 | 64 |
| User I/Os | 52 | 79 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Propagation Delay | 14 ns | 14 ns | 14 ns | 14 ns | 7.5 ns (faster) |
| Standby Current | 25 uA (typical) | 25 uA | 25 uA | 25 uA | [DATA_NEEDED] |
| Automotive Grade | Yes (AEC-Q100, A5 suffix) | Industrial only | Industrial only | Commercial only | Industrial only |
Key Differentiators
- AEC-Q100 qualified with -40C to +125C industrial temperature range (vs 5M160ZM100I5N)
- Compact 68-ball BGA footprint optimized for space-constrained designs (vs 5M160ZE64I5N)
- Cross-brand functional equivalence with Lattice ispMACH 4000ZE (vs LC4064ZE-7QFN84)
Design Notes
The 68-ball FineLine BGA package with 0.5 mm pitch requires PCB via-in-pad (VIP) or microvia technology for reliable assembly. Per the MAX V family datasheet, each BGA ball should have a corresponding microvia in the land pad connected to the inner signal layer. PCB land pattern must follow the JEDEC MO-225 recommendation. Use NSMD (non-solder mask defined) pads with 0.4 mm pad diameter for optimum solder joint reliability. Estimated: PCB fabrication cost increases ~$0.30/unit vs QFP, but routing density improves ~60%.
Decoupling requires a 0.1 uF X7R ceramic capacitor placed within 5 mm of each VCCINT and VCCIO ball pair. According to the MAX V family datasheet, bulk decoupling of 10 uF tantalum or ceramic should be placed near the device. Power sequencing: VCCINT must ramp before or simultaneously with VCCIO to prevent I/O latch-up; in-system programming via JTAG requires both rails within specification before configuration. Estimated: 4-6 decoupling capacitors needed for this 68-ball package.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, but each VCCIO bank must be tied to a single voltage. According to the MAX V family datasheet, mixing voltages within a bank causes undefined I/O behavior. JTAG signals (TCK/TMS/TDI/TDO) should be pulled to known states with 10 kohm resistors to prevent inadvertent JTAG state transitions. For high-speed (>50 MHz) designs, use 50 ohm controlled-impedance traces on clock and JTAG signals.
Per the MAX V family datasheet, unused user I/O pins should be configured as outputs driving low (not left floating) to minimize power consumption and reduce susceptibility to ESD events. The 68-ball FineLine BGA has no center balls (perimeter-only BGA), so all balls are accessible for routing. Do not exceed the 1.89 V maximum VCCINT - the device is NOT 2.5 V or 3.3 V tolerant on core supply. Automotive 'A5' grade must be operated within -40C to +125C ambient.
Place the 5M160ZM68A5N on the top PCB layer with no signal traces routed beneath the BGA land pads except through microvias to inner layers. Per the MAX V family datasheet, keep high-speed signal traces short and matched (within 1 mm) for bus interfaces. JTAG connector should be placed within 50 mm of the device to minimize signal degradation. Thermal pad is integrated into GND balls; provide a continuous ground pour beneath the device for thermal dissipation.
Compliance Information
RoHS and REACH compliance per Intel/Altera product declaration. AEC-Q100 qualified per automotive datasheet. Lead-free reflow-compatible per JEDEC J-STD-020. Halogen-free status not explicitly stated in verified web data.
