5M240ZM100C5N - 192 Macrocell MAX V CPLD, 100-MBGA | Intel
MPN: 5M240ZM100C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.8 | $12.80 |
| 10 | $11.4 | $114.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.65 | $4,325.00 |
| 1,000 | $7.4 | $7,400.00 |
Drop-in alternatives for 5M240ZM100C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M240ZM100C4N
✅ Drop-In✓ In Stock
$4.62 / Unit
View Datasheet →5M240ZM100A5N
✅ Drop-In✓ In Stock
$3.95 / Unit
View Datasheet →5M160ZM100C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.35 / Unit
View Datasheet →5M240ZM100C5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device | 5M240Z |
| Logic Elements (LEs) | 240 |
| Macrocells | 192 |
| User I/Os | 79 |
| Package | 100-MBGA (FineLine BGA), 6 mm x 6 mm |
| Pin/Ball Count | 100 |
| Configuration Memory | On-chip flash, non-volatile |
| Core Voltage VCCINT | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Voltage VCCIO | 1.2 V to 3.3 V (MultiVolt, banked) |
| Pin-to-Pin Delay tPD | 7.5 ns |
| Register-to-Register tCO | 4.7 ns max |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| On-chip User Flash | Yes (8 Kbits) |
| Internal Oscillator | Yes |
5M240ZM100C5N 100-mbga (fineline bga), 6 mm x 6 mm Pin Configuration Guide
Complete pinout information for 5M240ZM100C5N (100-mbga (fineline bga), 6 mm x 6 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M240ZM100C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M240ZM100C5N is suitable for 6 applications: Industrial I/O Expansion and Voltage-Level Translation, LED Display Row/Column Driver, Telecom Line-Card Glue Logic, Server Backplane Power Sequencing, Bus-Interface Bridge (SPI / I2C / UART / Parallel), Automotive Infotainment Auxiliary Logic (Non-Safety).
Industrial I/O Expansion and Voltage-Level Translation
The 5M240ZM100C5N is widely deployed as an I/O expander and voltage-level translator in industrial PLC and factory-automation backplanes. Its MultiVolt I/O architecture allows each of the four I/O banks to operate at an independent voltage from 1.2 V to 3.3 V, with 5.0 V input tolerance, so a single chip can bridge a 3.3 V microcontroller to 1.8 V sensors and 5 V legacy drivers without external translators. With 79 user I/Os in the 100-MBGA package, engineers can replace four or five 74-series glue-logic ICs and reclaim significant board area. The 7.5 ns pin-to-pin delay suits interrupt-driven control loops at sub-100 MHz, and the instant-on flash configuration ensures deterministic startup at power-on, critical for safety controllers. Recommended companion parts: 5M240ZM100C4N (drop-in speed-grade downgrade) and 5M160ZM100C5N (cost-reduced I/O variant).
Recommended
LED Display Row/Column Driver
LED matrix displays and large outdoor signage rely on the 5M240ZM100C5N as a row/column scan controller. The 192 macrocells easily absorb 16-to-1 or 32-to-1 multiplexing state machines, while 79 user I/Os provide ample row and column drive lines for medium-resolution panels. The flash-based instant-on (<1 ms) configuration eliminates the visual flicker that SRAM-based CPLDs and FPGAs exhibit at power-up, which is critical for retail and stadium signage. The 1.8 V VCCINT and 3.3 V VCCIO allow direct LED-driver interface at common logic levels, and the internal oscillator provides a free scan-time clock. Per the MAX V handbook, PWM dimming and brightness-correction logic can be implemented entirely on-chip, removing the need for an external MCU for animation. Recommended companion parts: 5M2210ZF256C5N (higher-density MAX V for very large panels) and 5M1270ZT144C5N (TQFP-144 variant for through-hole-friendly designs).
Recommended
Telecom Line-Card Glue Logic
In telecom line cards and network switches, the 5M240ZM100C5N serves as deterministic glue logic between ASICs, FPGAs, PHYs, and backplane SERDES. Tasks include asynchronous FIFO buffering between clock domains, I2C/SPI bus multiplexers, interrupt-aggregation logic, and hot-swap control sequencers. The 7.5 ns tPD timing supports 100+ MHz interfaces, and the MultiVolt I/O banks interface cleanly with 1.2 V, 1.8 V, 2.5 V, and 3.3 V PHYs without external translators. Because MAX V is non-volatile, the device boots into a known state at every power cycle - essential for NEBS-compliant telecom systems where unpredictable logic state at POR is unacceptable. Recommended companion parts: 5M240ZM100A5N (industrial-temp variant) and 5M160ZM100C5N (smaller pin-compatible sibling).
Recommended
Server Backplane Power Sequencing
The 5M240ZM100C5N is a popular power-sequencing controller in server and storage backplanes where multiple voltage rails must be turned up in a strict order to satisfy processor and ASIC POR requirements. Its 192 macrocells can implement PG (power-good) watchdog timers, fault-detect state machines, and rail-interlock logic for 8-12 voltage domains. The 1.8 V VCCINT and 3.3 V VCCIO allow direct interface to PMBus controllers and supervisors. The instant-on flash configuration guarantees that the sequencer is operational before the first voltage rail rises - critical for hot-swap and redundant-power-supply designs. Recommended companion parts: 5M1270ZF324C5N (higher-density MAX V) and 5M160ZT100C5N (TQFP-100 variant for hand-rework-friendly debug boards).
Recommended
Bus-Interface Bridge (SPI / I2C / UART / Parallel)
Engineers use the 5M240ZM100C5N as a low-cost protocol bridge between incompatible bus standards - for example, SPI-to-I2C, UART-to-parallel, or 8-bit async SRAM to APB. The 192 macrocells comfortably absorb 32-bit datapath state machines and FIFO buffers up to 64 entries, and the MultiVolt I/O banks mean the bridge can simultaneously drive 1.8 V and 3.3 V peripherals from the same chip. The on-chip 8 Kbit user flash stores non-volatile configuration data such as I2C device addresses and bus-timing constants. Because the design boots instantly at power-up, the bridge is immediately available to the host processor without any driver-load delay. Recommended companion parts: 5M2210ZF256C5N (for higher-throughput bridges) and 5M160ZE64C5N (64-pin EQFP variant for low-cost bridges).
Recommended
Automotive Infotainment Auxiliary Logic (Non-Safety)
Within non-safety automotive infotainment domains - head-unit display backlight controllers, amplifier mute sequencers, and rear-seat-entertainment routers - the 5M240ZM100C5N provides instant-on deterministic glue logic. The device operates from 1.8 V VCCINT with 3.3 V VCCIO banks that can directly interface with infotainment SoCs. Note: This part is commercial-temperature (0 °C to +85 °C) and is NOT AEC-Q100 qualified; for AEC-Q100 requirements, designers should select the MAX V 'A' speed grade with industrial temperature range or migrate to MAX 10. The instant-on flash configuration ensures that audio mute and amplifier enable signals are in a known safe state at every key-on cycle, preventing speaker pop. Recommended companion parts: 5M240ZM100A5N (industrial-temp) and 5M160ZE64C5N (compact 64-pin sibling).
Recommended
Recommended Products Summary
Engineering reference data for 5M240ZM100C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M240ZM100C4N | 5M240ZM100A5N | 5M160ZM100C5N |
|---|---|---|---|---|
| Package | 100-MBGA (6x6 mm) | 100-MBGA (6x6 mm) - same | 100-MBGA (6x6 mm) - same | 100-MBGA (6x6 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same |
| Family | MAX V | MAX V | MAX V | MAX V |
| Macrocells | 192 | 192 | 192 | 160 (-17%) |
| Logic Elements | 240 | 240 | 240 | 160 (-33%) |
| Pin-to-Pin Delay tPD | 7.5 ns | 9.0 ns (+20%) | Approximately 7.5 ns (A-grade) | 7.5 ns |
| User I/Os | 79 | 79 | 79 | 79 (same package) |
| Core Voltage VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) |
Key Differentiators
- Highest speed grade in the 100-MBGA MAX V family (vs 5M240ZM100C4N)
- Highest macrocell density in the 100-MBGA MAX V family (vs 5M160ZM100C5N)
- Flash-based instant-on vs SRAM-based MAX II CPLDs (vs EPM240GT100C5N (MAX II, SRAM-based))
Design Notes
Place at least one 0.1 µF X7R ceramic decoupling capacitor within 2 mm of each VCCINT and VCCIO ball, and add a single 10 µF bulk capacitor per supply rail near the device. For BGA escape routing, use a 0.5 mm via-in-pad microvia stack on a 1.6 mm FR-4 stack-up; the 100-MBGA's 0.5 mm pitch allows standard 4-layer escape without HDI if the design tolerates longer traces. Maintain a continuous ground plane on layer 2 directly under the BGA field to provide a low-impedance return path for switching I/Os.
Configure each I/O bank's VCCIO supply BEFORE driving outputs above that voltage - applying 3.3 V to an I/O bank that is still at 1.8 V can permanently damage the device. When using the JTAG interface for in-system programming, ensure the JTAG chain is properly terminated with a 4.7 kΩ pull-up on TCK and TDI per the MAX V handbook. Do not leave JTAG pins floating on production boards - either tie them to a defined state (pull-up on TMS, pull-down on TCK) or route them to a JTAG header for field upgrades.
Estimated: For 79 I/Os toggling simultaneously at 100 MHz into 15 pF loads, total dynamic current can reach 80-120 mA from VCCIO banks. Use a 4-layer PCB with a dedicated power plane for each VCCIO bank to minimize supply bounce. For high-speed (>50 MHz) outputs, route signals over a continuous ground reference and avoid layer transitions; keep stub lengths under 5 mm. Add 33 Ω series termination at the driver when the trace length exceeds approximately one-sixth of the signal rise time.
Estimated: With all 79 I/Os driving 3.3 V CMOS loads at 50 MHz into 15 pF, total power dissipation is approximately 0.5 W, producing a 12-15 °C junction rise on a JEDEC 4-layer test board (θJA ≈ 30 °C/W). At industrial temperatures, derate by 25 % to maintain the 100,000-hour reliability target. For very high I/O utilization designs, consider the larger 5M1270 / 5M2210 MAX V devices with better thermal performance due to their larger package footprint.
Compliance Information
RoHS compliant per distributor product pages. AEC-Q100 NOT qualified - use MAX V 'A' speed grade with industrial temperature range or migrate to MAX 10 for automotive applications.
