5M570ZF256C5N - 440 Logic Elements MAX V CPLD | Intel | FBGA-256
MPN: 5M570ZF256C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.1 | $201.00 |
| 100 | $17.85 | $1,785.00 |
| 500 | $15.4 | $7,700.00 |
| 1,000 | $13.2 | $13,200.00 |
Drop-in alternatives for 5M570ZF256C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M570ZF256C4N
✅ Drop-In✓ In Stock
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View Datasheet →5M570ZF256A5N
✅ Drop-In✓ In Stock
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View Datasheet →5M570ZF256I5N
✅ Drop-In✓ In Stock
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View Datasheet →5M570ZF256C5
✅ Drop-In📋 Reference alternative (not in catalog)
5M570ZF256C6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5M570ZF256C5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Maximum User I/Os | 159 |
| Number of Pins | 256 |
| Package Type | FBGA-256 (FineLine BGA) |
| Supply Voltage | 1.8 V core (3.3 V I/O supported via internal LDO) |
| Operating Frequency (fMAX) | 118.3 MHz |
| Propagation Delay (tPD) | 8.5 ns (commercial speed grade 5) |
| User Flash Memory | 8 Kbit |
| Configuration Memory | On-chip non-volatile flash |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Operating Temperature Range | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5M570ZF256C5N fbga-256 (fineline bga) Pin Configuration Guide
Complete pinout information for 5M570ZF256C5N (fbga-256 (fineline bga) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M570ZF256C5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M570ZF256C5N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, FPGA Configuration Controller, Power Sequencing and Reset Management, Address Decoding and Memory Interfacing, Telecom and Networking Equipment, Replacing Legacy 74-Series Logic.
Industrial I/O Expansion and Bus Bridging
The 5M570ZF256C5N is ideally suited for industrial I/O expansion and bus bridging where deterministic non-volatile logic is required. With 440 macro cells, 159 user I/Os, and 8.5 ns tPD, this CPLD can translate between SPI, I2C, UART, and parallel bus domains on a single chip. The non-volatile flash configuration enables instant-on operation without external boot memory, critical for industrial controllers that must respond deterministically at power-up. Industrial designs benefit from the wide 3.3 V I/O tolerance and -40C to +85C operation (with I5N suffix). The FBGA-256 package provides ample I/O for multiplexing sensor arrays, encoder inputs, and actuator control signals while keeping the PCB footprint small.
Recommended
FPGA Configuration Controller
The 5M570ZF256C5N is widely used as a companion configuration controller for larger SRAM-based FPGAs such as Intel Cyclone V and Arria 10. The 440 macro cells provide ample capacity to drive multi-FPGA JTAG chains, MODE pins, and CONF_DONE signals, while the 159 I/Os allow simultaneous control of 2-3 FPGAs. The MAX V's non-volatile flash eliminates external boot memory and provides deterministic startup, which is essential when the system FPGA itself is being configured. Per the MAX V datasheet, the device supports JTAG 1149.1 boundary-scan and ISP programming, simplifying board-level test and in-field firmware updates. The 118.3 MHz fMAX comfortably exceeds typical FPGA configuration clock requirements.
Recommended
Power Sequencing and Reset Management
In multi-rail systems, the 5M570ZF256C5N provides deterministic power sequencing and reset distribution for processors, FPGAs, and analog subsystems. Its 440 macro cells can implement complex state machines tracking PG (power good) signals, sequencing 8-12 rails with configurable delay timing, and asserting RESET signals in the correct order. The non-volatile instant-on behavior means sequencing logic is operational within microseconds of power-up, faster than any supervisory IC. According to the MAX V datasheet, the device operates from a single 1.8 V supply with internal LDO generating core rails, simplifying the power tree. The 159 I/Os comfortably handle PG feedback from multiple regulators and reset distribution to all downstream devices.
Recommended
Address Decoding and Memory Interfacing
The 5M570ZF256C5N serves as a flexible address decoder and memory interface glue logic in legacy and modern compute platforms. The 8.5 ns tPD comfortably supports 50+ MHz memory bus cycles, while 440 macro cells implement multiple chip-select, byte-enable, and burst-handling state machines in a single chip. According to the MAX V datasheet, I/O banks support LVCMOS, LVTTL, SSTL, and HSTL standards, allowing direct interface to SRAM, SDRAM, NOR flash, and peripheral buses. Designers can implement late-stage address map revisions without PCB rework, a key advantage over discrete 74-series address decoders. The 8 Kbit user flash provides storage for board ID, revision, and boot configuration.
Recommended
Telecom and Networking Equipment
Telecom and networking equipment uses the 5M570ZF256C5N for backplane bridging, PHY interface adaptation, and LED/control signal aggregation. The 159 I/Os support multiple PHY interfaces, while the non-volatile flash configuration ensures rapid system recovery after power-cycle or brownout events - critical for carrier-grade equipment with strict MTBF requirements. According to the MAX V datasheet, the device's deterministic timing (tPD = 8.5 ns) supports sub-100 ns protocol overhead for 10/100 Mbps Ethernet PHYs and similar telecom interfaces. The FBGA-256 package is well-suited to high-density backplane cards where I/O count drives board layout. Industrial temperature variants (I5N suffix) are also available for outdoor deployments.
Recommended
Replacing Legacy 74-Series Logic
The 5M570ZF256C5N is a drop-in modernization path for designs previously implemented with dozens of 74LVC/74AVC discrete logic packages. A single MAX V CPLD can replace 30-50 SSI/MSI packages, dramatically reducing PCB area, BOM count, and assembly cost. Per the MAX V datasheet, the device supports all standard 1.8 V-3.3 V I/O standards, so direct interface with existing 74-series signals is straightforward. The flash-based non-volatile configuration lets late-stage design changes be implemented via JTAG re-programming without respinning the PCB. With 440 macro cells, engineers can implement all glue logic, address decoding, and bus arbitration in one device while keeping spare capacity for future feature additions.
Recommended
Recommended Products Summary
Engineering reference data for 5M570ZF256C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M570ZF256C4N | 5M570ZF256A5N | 5M570ZF256I5N | 5M570ZF256C5 | 5M570ZF256C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 159 | 159 | 159 | 159 | 159 | 159 |
| Speed Grade | C5 (tPD ~8.5 ns) | C4 (slower, ~9.5 ns tPD) | A5 (auto temp grade) | I5 (industrial temp) | C5 (same) | C6 (faster, ~8.0 ns tPD) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +125C (extended/automotive) | -40C to +85C (industrial) | 0C to +85C | 0C to +85C |
| Internal fMAX | 118.3 MHz | 118.3 MHz (C4 fMAX similar) | 118.3 MHz | 118.3 MHz | 118.3 MHz | ~150 MHz (faster speed) |
| Unit Price @ 1k pcs (as of 2026-09-06) | ~$13.20 | ~$11.50 (slower speed, lower cost) | ~$16.80 (automotive premium) | ~$14.50 (industrial premium) | ~$13.00 | ~$15.20 (faster speed premium) |
Key Differentiators
- Higher logic density than 74-series alternative (vs Discrete 74LVC/74AVC logic packages)
- Instant-on non-volatile configuration (vs SRAM-based FPGAs (Cyclone V 5CEBA4U19C8N))
- Industrial and automotive temperature grades available (vs 5M570ZF256I5N (industrial variant))
Design Notes
The FBGA-256 package requires a 4-layer or 6-layer PCB stack-up with microvias for inner-row ball access. Per JEDEC J-STD-020, this is MSL-3, so reflow profile must limit peak temperature to 245C and exposure time above 220C to under 60 seconds. Use 0.4 mm ball pitch escape routing with via-in-pad if the design is BGA-dense; otherwise dog-bone fan-out is acceptable. Plan decoupling: 0.1 uF + 1 uF ceramic per VCCIO bank, plus a single 10 uF bulk capacitor near each VCCINT pin cluster.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and keep the chain short to avoid signal integrity issues during programming. Place the JTAG header on the board edge for easy access during bring-up. According to Intel MAX V datasheet, JTAG pins can be repurposed as user I/O if JTAG is disabled - but ensure this is set in the Quartus Prime project from the start, as disabling later requires full reconfiguration. Leave a dedicated JTAG test point cluster even if JTAG pins are reassigned, to enable in-field ISP updates.
Estimated: The MAX V internal LDO draws peak current of ~50 mA during initial power-up configuration. Ensure the upstream 1.8 V regulator can supply at least 100 mA with adequate headroom; otherwise configuration may fail intermittently. A common pitfall is tying VCCIO to 1.8 V when 3.3 V peripherals are connected - this damages I/O cells and creates high-current shorts. Always verify VCCIO bank voltages match the strongest driver on the bus. Per the MAX V datasheet, unused I/O pins default to tri-stated inputs with weak pull-ups; explicitly enable or disable them in Quartus to avoid floating-node issues.
MAX V CPLDs typically dissipate 30-100 mW during normal operation depending on toggle rate and logic utilization. The FBGA-256 package's theta_JA is approximately 28 C/W on a 4-layer JEDEC test board. Estimated: at 85C ambient with 80 mW dissipation, junction temperature rises only ~2.2C, leaving substantial thermal margin for industrial environments. No heatsink is required for typical MAX V designs, unlike higher-power FPGAs. However, in enclosed industrial enclosures above 70C ambient, verify thermal performance with a prototype measurement.
Compliance Information
RoHS and REACH compliant per Intel product page. Lead-free and halogen-free. AEC-Q100 qualification only available on 5M570ZF256A5N (automotive grade).
