6EDL04N02PRXUMA1 - 200V 3-Phase Gate Driver IC | Infineon
MPN: 6EDL04N02PRXUMA1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.28 | $4.28 |
| 10 | $3.86 | $38.60 |
| 100 | $3.42 | $342.00 |
| 500 | $2.96 | $1,480.00 |
| 1,000 | $2.59 | $2,590.00 |
| 2,500 | $2.32 | $5,800.00 |
6EDL04N02PRXUMA1 Overview
A gate driver IC is a specialized power management semiconductor that sits between a low-power microcontroller/MCU and a high-power switching transistor stage, translating 3.3 V or 5 V logic-level PWM signals into high-current gate drive signals capable of rapidly switching MOSFETs or IGBTs. Gate drivers belong to the broader hierarchy of power management ICs, then PMIC > driver > half/full/three-phase gate driver, and are critical building blocks in motor drives, solar inverters, and switched-mode power supplies.
Key features of the 6EDL04N02PRXUMA1 include integrated bootstrap diodes (BSD) for the three high-side drivers - eliminating the need for external bootstrap diodes and reducing BOM cost and PCB area - plus a dedicated fault output pin (nFAULT) that signals desaturation/over-current events to the host MCU. Each phase pair includes hardware interlocking to prevent shoot-through cross-conduction, and a single EN pin enables clean start-up sequencing. CMOS/LSTTL-compatible inputs accept 3.3 V logic directly, simplifying interface to modern MCUs.
The device is built on Infineon's proprietary thin-film SOI process, which provides excellent negative VS transient immunity (a critical spec for high-side switching in motor drives), latch-up immunity, and low power dissipation. The maximum junction temperature is +150 °C and the operating supply range is 10 V to 20 V VCC, with a separate logic-level supply on VBS for each high side.
Typical applications include 3-phase brushless DC (BLDC) motor drives for home appliances and HVAC fans, low-voltage (24 V to 96 V) industrial servo drives, e-bike and e-scooter traction inverters, and small solar/string inverter stages. The integrated bootstrap diode simplifies PCB layout and improves long-term reliability by reducing the part count.
When designing with this driver, ensure the VCC decoupling is sized for the total gate charge of all six switches switched simultaneously, and keep the bootstrap capacitor loop area minimal. The over-current protection uses a single shunt resistor on the low-side return path; place the RC filter on the ITRIP/CIN pin within 10 mm of the IC to avoid false tripping.
This page synthesizes distributor pricing across six sources, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 6EDL04N02PRXUMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 6EDL04N02PRXUMA1 (same form factor and footprint) — differing in Package, Bootstrap Diode, Product Type, Blocking Voltage, Driver Configuration.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
6EDL04N02PR
✅ Drop-In📋 Reference alternative (not in catalog)
6ED003L02F2XUMA1
✅ Drop-In✓ In Stock
$3.31 / Unit
View Datasheet →6EDL04N02PRXUMA1 Maximum Ratings & Electrical Characteristics
| Product Type | 3-Phase Gate Driver IC |
| Driver Configuration | Half-bridge (3 high-side + 3 low-side) |
| Maximum Blocking Voltage | +180 V (VS referenced to GND for high side) |
| Rated Supply Voltage (VCC) | 200 V class (operating range 10 V to 20 V on VCC) |
| Source Current (typ.) | 0.375 A |
| Sink Current (typ.) | 0.75 A |
| Bootstrap Diode | Integrated (BSD) on all 3 high-side drivers |
| Over-Current Protection | Yes (single-shunt, ITRIP/CIN pin) |
| Enable Pin (EN) | Yes (active-high) |
| Fault Output (nFAULT) | Yes (active-low, open-drain) |
| Input Logic Compatibility | CMOS / LSTTL, 3.3 V and 5 V |
| Interlocking / Anti-shoot-through | Yes (built-in per phase pair) |
| Process Technology | Thin-film SOI (Silicon-On-Insulator) |
| Operating Temperature Range | -40 °C to +125 °C |
| Maximum Junction Temperature | +150 °C |
| Package | PG-TSSOP-28 (28-pin, 4.40 mm width, exposed pad) |
| Mounting Type | Surface Mount |
| Target Switches | MOSFETs up to 180 V, IGBTs up to 180 V |
| RoHS Status | Compliant |
6EDL04N02PRXUMA1 Pin Configuration
| Pin 1 | HIN1 — High-side input 1 (logic) |
| Pin 2 | HIN2 — High-side input 2 (logic) |
| Pin 3 | HIN3 — High-side input 3 (logic) |
| Pin 4 | LIN1 — Low-side input 1 (logic) |
| Pin 5 | LIN2 — Low-side input 2 (logic) |
| Pin 6 | LIN3 — Low-side input 3 (logic) |
| Pin 7 | EN — Enable (active high) |
| Pin 8 | nFault — Fault indicator (active low, open-drain) |
| Pin 9 | ITRIP/CIN — Over-current threshold / comparator input |
| Pin 10 | VSS — Logic ground |
| Pin 11 | VCC — +15 V supply for low-side drivers |
| Pin 12 | LO1 — Low-side gate output 1 |
| Pin 13 | LO2 — Low-side gate output 2 |
| Pin 14 | LO3 — Low-side gate output 3 |
| Pin 15 | COM — Low-side return (negative VS reference) |
| Pin 16 | VS1 — High-side phase 1 return |
| Pin 17 | HO1 — High-side gate output 1 |
| Pin 18 | VB1 — High-side bootstrap supply 1 |
| Pin 19 | VS2 — High-side phase 2 return |
| Pin 20 | HO2 — High-side gate output 2 |
| Pin 21 | VB2 — High-side bootstrap supply 2 |
| Pin 22 | VS3 — High-side phase 3 return |
| Pin 23 | HO3 — High-side gate output 3 |
| Pin 24 | VB3 — High-side bootstrap supply 3 |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | EP — Exposed thermal pad (connect to VSS or large copper) |
Typical Applications
6EDL04N02PRXUMA1 is suitable for 7 applications: 3-Phase BLDC Motor Drive (24-96 V), E-Bike / E-Scooter Traction Inverter, Small Solar String Inverter (≤180 V), HVAC Fan and Pump Motor Drives, Industrial Servo Drive (Low-Voltage), Cordless Power Tool Drives (≥36 V), Robotics / Drone BLDC Motor Stage.
3-Phase BLDC Motor Drive (24-96 V)
The 6EDL04N02PRXUMA1 is purpose-built for low-voltage 3-phase BLDC motor drives in the 24 V to 96 V bus range, where its +180 V VS blocking and 0.375 A source / 0.75 A sink drive are more than adequate for typical MOSFET half-bridges. Integrated bootstrap diodes remove six external parts and shrink the driver section by roughly 40%. The single-shunt OCP scheme pairs with most commodity FOC control MCUs to deliver complete hardware cycle-by-cycle protection. Compared to a discrete IR2114 x3 design, this IC cuts PCB area by half and drops BOM cost by 25-35%.
Recommended
E-Bike / E-Scooter Traction Inverter
E-bike and e-scooter traction inverters operating on 36 V or 48 V battery packs benefit from the 6EDL04N02PRXUMA1's compact PG-TSSOP-28 footprint, integrated bootstrap diodes, and built-in OCP that protects the battery during regen-braking current spikes. With 0.75 A sink capability, gate-drive losses stay low even with high-Qg MOSFETs; designers can switch above 25 kHz to keep the motor silent. The exposed thermal pad plus the SOI technology's negative VS transient immunity are essential for the harsh automotive-grade e-mobility environment. LCSC stocks 2,500-piece reels ideal for mid-volume e-bike production.
Recommended
Small Solar String Inverter (≤180 V)
For sub-180 V string-inverter power stages (single 60-cell panel or two panels in series), the 6EDL04N02PRXUMA1 provides the six-drive outputs plus OCP needed to drive a 3-phase MOSFET H-bridge used in some isolated micro-inverter topologies. The integrated BSDs reduce assembly cost in outdoor power electronics where reliability and reduced part count matter. Negative VS transient immunity from the SOI process is critical when the inverter feeds reactive loads or suffers from high dv/dt switching transients. Operating ambient of -40 °C to +125 °C covers outdoor enclosure ratings.
Recommended
HVAC Fan and Pump Motor Drives
Residential HVAC fans and water pumps increasingly use BLDC motors for efficiency, and the 6EDL04N02PRXUMA1 is an ideal driver for these sub-180 V appliances. Its integrated fault reporting (nFAULT) lets a low-cost MCU shut down safely on rotor lock, over-current, or over-temperature events without external comparator circuitry. Anti-shoot-through interlocking eliminates MCU dead-time software errors that would otherwise destroy the bridge during a firmware bug. PG-TSSOP-28 package is reflow-compatible with consumer HVAC contract-manufacturer lines.
Recommended
Industrial Servo Drive (Low-Voltage)
Low-voltage industrial servo drives for factory automation - typically 48 V to 96 V DC bus - use the 6EDL04N02PRXUMA1 to drive 3-phase servo motors with precise PWM control. The 3.3 V-compatible logic inputs pair directly with modern Cortex-M4/M7 servo MCUs (no level shifter needed), reducing design complexity and BOM count. Hardware interlocking and ITRIP-based OCP satisfy IEC 61800-5-1 functional safety requirements for industrial drives. RoHS and halogen-free compliance per Infineon's declaration supports industrial product environmental certifications.
Recommended
Cordless Power Tool Drives (≥36 V)
Cordless drills, saws, and outdoor power tools with 36 V or 48 V battery packs use the 6EDL04N02PRXUMA1 as the main bridge driver for high-current BLDC motors. The 0.75 A sink drive strength handles the high-Qg MOSFETs preferred in tools that must deliver peak torque of 80 Nm+. Integrated OCP protects the battery during stall events, while the nFAULT output triggers MCU-controlled emergency stop. Wide operating temperature range supports the hot-ambient conditions inside tool housings.
Recommended
Robotics / Drone BLDC Motor Stage
Compact 24 V to 72 V BLDC motor stages in robotics, drones, and small UAVs benefit from the 6EDL04N02PRXUMA1's small PG-TSSOP-28 footprint and 4.40 mm width. Weight and area are premium, so the integrated bootstrap diodes save critical board space on the ESC (Electronic Speed Controller). SOI technology's negative VS transient immunity keeps the driver robust against the regenerative energy spikes common in brushless ESC application. Operating temperature of -40 °C to +125 °C handles outdoor drone operating conditions.
Recommended
Recommended Products Summary
Engineering reference data for 6EDL04N02PRXUMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 6EDL04N02PR | 6ED003L02F2XUMA1 |
|---|---|---|---|
| Brand | Infineon | Infineon | Infineon |
| Package | PG-TSSOP-28 | PG-TSSOP-28 (same) | PG-DSO-28 (same 28-pin) |
| Blocking Voltage | +180 V | +180 V | +600 V |
| Bootstrap Diode | Integrated (3x) | Integrated (3x) | Integrated (3x) |
| Over-Current Protection | Yes (single shunt) | Yes (single shunt) | Yes (single shunt) |
| Fault Reporting | nFAULT pin | nFAULT pin | nFAULT pin |
| Process Technology | Thin-film SOI | Thin-film SOI | Thin-film SOI |
| Unit Price (1 pc, 2026-09-14) | USD 4.28 | USD ~3.95 | USD ~3.75 |
Key Differentiators
- All-in-one 3-phase driver in a single TSSOP-28 (vs IR2114STRPBF (requires 3 ICs + 6 external diodes))
- Integrated bootstrap diodes (vs Discrete bootstrap diodes (typical discrete driver design))
- Built-in over-current protection with fault reporting (vs Discrete driver (no OCP, requires external comparator))
- Thin-film SOI level-shifter for negative VS immunity (vs Older junction-isolation drivers (e.g. IR2104))
Design Notes
Estimated: at VCC = 15 V, switching six MOSFETs each with Qg = 30 nC at 20 kHz, total gate-drive power = 6 × 30 nC × 15 V × 20 kHz = 0.54 W. The PG-TSSOP-28 exposed pad has theta_JA of approximately 60 C/W on a JEDEC 4-layer test board; ensure at least 25 mm² of top-layer copper under the EP pin. Add a 10 µF / 25 V X7R ceramic bypass capacitor on VCC within 5 mm of pin 11, plus a 100 nF high-frequency decoupling cap within 2 mm. This is critical for reliable gate-drive operation.
Keep the high-side switching loops (VBx, VSx, HOx to FET) as small as possible - aim for loop area under 50 mm² to minimize parasitic inductance that causes VS undershoot below COM. The bootstrap capacitor (1 µF to 4.7 µF X7R) should be placed within 2 mm of each VBx-VSx pair. The ITRIP/CIN pin filter (typically 1 kΩ + 1 nF) must be within 10 mm of pin 9 to avoid false OCP trips. Star-ground the VSS pin and EP pad to a single point on the low-side shunt return.
Estimated: continuous 1 A drive current at 25 kHz with Qg = 50 nC dissipates P_total = 6 × 50e-9 × 15 × 25e3 = 0.113 W in the driver itself (negligible). However, the IC will also absorb shoot-through energy if dead-time is too short; aim for 200-500 ns dead-time on the MCU side. Total dissipation is dominated by the FETs, not the driver, but place a small copper pour under the EP for margin.
Common pitfalls when designing with this part include: (1) omitting the bootstrap capacitors on VBx - the high side will not switch without these. (2) Driving LIN1-3 or HIN1-3 with 5 V logic when the VCC is only 10 V - logic levels relative to VSS still work but check VIL spec. (3) Forgetting that nFAULT is open-drain and needs a pull-up to the MCU's logic rail. (4) Using the EN pin as a high-impedance input - it must be tied high (or driven) for normal operation, not left floating.
Compliance Information
RoHS and REACH compliant per Infineon product declaration. Lead-free and halogen-free per 'XUMA1' shipping suffix. Not AEC-Q100 qualified - this is a commercial/industrial part; consult Infineon sales for automotive-grade equivalents in the same family.
