AR1820HSSC12SHEA0-DP - 18MP CMOS Image Sensor | onsemi
MPN: AR1820HSSC12SHEA0-DP β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.57 | $19.57 |
| 10 | $18.6 | $186.00 |
| 100 | $17.62 | $1,762.00 |
| 500 | $16.64 | $8,320.00 |
| 1,000 | $15.66 | $15,660.00 |
AR1820HSSC12SHEA0-DP Overview
A CMOS image sensor is a semiconductor device that converts light into electrical signals using an array of photodiodes and per-pixel amplifiers fabricated on a CMOS process. Within the imaging signal chain hierarchy, it sits at the front end: image sensor -> camera module -> embedded vision system. BSI (back-side illumination) flips the silicon so light strikes the photodiode side directly, improving quantum efficiency and low-light sensitivity compared with front-illuminated sensors.
Key features of the AR1820HS family include full 18 MP resolution at 24 frames per second, high-speed burst modes up to 60 fps operation, and multiple operating modes that dynamically optimize resolution, low-light performance, and frame rate for changing environmental conditions. The A-PixHS BSI process delivers strong low-light sensitivity for a 1/2.3-inch optical format.
The dynamic mode switching architecture allows a camera to run full-resolution stills in bright light and automatically transition to binned or cropped high-frame-rate modes in low light, a capability typical of premium smartphone and action-camera sensors.
Typical applications include smartphone and tablet main cameras, action cameras, drones, security and surveillance cameras, and embedded vision systems where high resolution in a compact optical format is required.
Design consideration: the 60-IBGA package requires careful PCB stack-up with the sensor mounted on a flex or rigid PCB beneath a lens assembly; power supply noise on the analog rails directly degrades image SNR, so clean low-noise LDO supplies and short MIPI CSI-2 trace routing are essential.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for AR1820HSSC12SHEA0-DP β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
AR1820HSSC12SHEA0-DP1
β Drop-Inπ Reference alternative (not in catalog)
AR1820HSSC12SHEA0-DR1
β Drop-Inπ Reference alternative (not in catalog)
AR1820HSSC00SHEA0-DP1
β Drop-Inπ Reference alternative (not in catalog)
AR1820HSSC12SHEA0-DP Maximum Ratings & Electrical Characteristics
| Resolution | 18 MP |
| Optical Format | 1/2.3 inch |
| Pixel Size | 1.34 um x 1.34 um (DigiKey listing); 1.25 um per family datasheet |
| Technology | A-PixHS BSI CMOS |
| Frame Rate (Full Resolution) | 24 fps |
| Maximum Frame Rate | 60 fps (high-speed mode) |
| Package | 60-IBGA (10x10) |
| Mounting Type | Surface Mount |
| Packaging | Tray (per -DP suffix family listing) |
| RoHS Status | ROHS compliant (per JLCPCB/LCSC listing) |
| Dynamic Mode Switching | Yes (resolution / low-light / frame rate optimization) |
AR1820HSSC12SHEA0-DP 60-ibga (10x10) Pin Configuration Guide
Pin configuration for AR1820HSSC12SHEA0-DP (60-ibga (10x10) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for AR1820HSSC12SHEA0-DP.
Refer to the datasheet for full pin configuration.
Typical Applications
AR1820HSSC12SHEA0-DP is suitable for 6 applications: Smartphone and Tablet Main Cameras, Action Cameras and Wearables, Drone and Aerial Imaging, Security and Surveillance Cameras, Embedded Vision and Machine Vision Cameras, Automotive and Consumer Recording Modules.
Smartphone and Tablet Main Cameras
The AR1820HSSC12SHEA0-DP fits flagship smartphone and tablet main-camera modules where 18 MP still resolution must coexist with high-frame-rate video in a compact optical format. Its 1/2.3-inch A-PixHS BSI sensor delivers full 18 MP stills at 24 fps in bright light, then dynamically switches to higher-frame-rate, lower-resolution modes for video capture - a behavior that matches modern camera apps that move seamlessly between still and video modes. BSI technology raises quantum efficiency, improving photosite-level signal in the indoor and low-light scenes that dominate mobile photography. In the module, the 60-IBGA sensor mounts on a rigid-flex PCB beneath the lens stack with MIPI lanes routed to the application processor ISP. The trade-off versus larger-format mobile sensors is smaller per-pixel light collection, mitigated by the BSI stack and binned low-light modes.
Recommended
Action Cameras and Wearables
Action cameras benefit directly from the AR1820HSSC12SHEA0-DP dynamic mode architecture: the sensor runs 18 MP stills for photo capture and switches up to 60 fps in binned modes for fluid fast-motion video. The compact 60-IBGA (10x10 mm) package and 1/2.3-inch optical format keep the module small enough for palm-sized, battery-powered enclosures where every millimeter and milliwatt matters. The A-PixHS BSI process improves photon collection at each photosite, which is critical for action-cam scenarios such as trail riding, skiing, and underwater use where lighting changes constantly. The sensor mounts on a short flex PCB under the lens barrel; clean analog power rails from low-noise LDOs preserve SNR under vibration and temperature swings. The engineering trade-off is thermal management in sealed waterproof housings, so PCB copper pours should extend beneath the sensor for heat spreading.
Recommended
Drone and Aerial Imaging
For drones, the AR1820HSSC12SHEA0-DP offers an attractive balance of still resolution and video performance: 18 MP aerial photographs at 24 fps for mapping and surveying missions, with dynamic switching to high-frame-rate modes for flight footage and obstacle-awareness views. Aerial scenes change lighting rapidly between sun, shadow, and ground reflections; the sensor dynamic optimization of resolution, low-light sensitivity, and frame rate handles these transitions without host-side mode reconfiguration latency. The lightweight 60-IBGA package suits gimballed camera payloads where mass is budgeted in grams. Power supply design is critical on multirotor platforms, where switching-regulator ripple from ESCs and flight controllers must be filtered before the sensor analog rails - typically with an LDO post-regulator stage. MIPI CSI-2 lanes should be kept short and impedance-controlled across the gimbal flex to preserve signal integrity.
Recommended
Security and Surveillance Cameras
Surveillance applications exploit the AR1820HSSC12SHEA0-DP combination of high still resolution for evidentiary detail and adaptive frame rate for continuous monitoring. In daylight, the sensor captures 18 MP frames at 24 fps sufficient for facial and license-plate identification at distance; when lighting falls, dynamic mode switching trades resolution for sensitivity and frame rate, maintaining usable motion imagery instead of dark noise. The 1/2.3-inch format supports cost-effective lens options for fixed-dome and bullet camera form factors. BSI pixel architecture improves low-light quantum efficiency compared to front-illuminated parts of the same generation, extending the usable IR-illuminated night range. In the camera PCB, the sensor sits behind an IR-cut filter assembly, and its MIPI output feeds the SoC ISP; decoupling per the onsemi reference design and keeping analog grounds star-routed are the primary board-level concerns.
Recommended
Embedded Vision and Machine Vision Cameras
Embedded vision systems - smart appliances, kiosks, barcode and OCR stations, and robotics perception - can use the AR1820HSSC12SHEA0-DP where 18 MP still-detail capture enhances algorithm accuracy. High resolution reduces the optical magnification needed to resolve small features such as QR codes, fine text, or component defects, allowing shorter focal-length lenses and simpler optics. The sensor multiple operating modes let a single design serve both a high-resolution inspection snapshot mode and a faster preview/alignment mode, eliminating a second sensor in the BOM. The 60-IBGA package integrates into compact camera boards paired with an SoC ISP over MIPI CSI-2. Designers should budget ISP processing throughput for 18 MP frames and verify lens-shading correction tables, since BSI pixel arrays require per-lens calibration for uniform color and shading across the field of view.
Recommended
Automotive and Consumer Recording Modules
The AR1820HS family is referenced for automotive-adjacent and consumer recording applications - dashcams, rear-view and surround-view modules, and portable recorders - where high resolution improves number-plate and sign readability. The sensor ability to run 18 MP stills at 24 fps and shift to faster binned modes matches event-driven recording: continuous lower-rate video with automatic high-resolution capture on impact or motion triggers. The 60-IBGA (10x10) package withstands typical module assembly reflow processes, and its small footprint suits the multi-camera rings used in surround-view systems. In automotive environments, power rails must be protected from load-dump transients; a qualified front-end protection device ahead of the sensor regulator chain is recommended. Verify the specific ordering-code qualification level against the program requirement, as suffix variants within the AR1820HS family differ in grade and shipping format.
Recommended
Recommended Products Summary
Engineering reference data for AR1820HSSC12SHEA0-DP β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AR1820HSSC12SHEA0-DP1 | AR1820HSSC12SHEA0-DR1 | AR1820HSSC00SHEA0-DP1 |
|---|---|---|---|---|
| Package | 60-IBGA (10x10) | 60-IBGA (10x10) - same | 60-pin IBGA - same | 60-pin IBGA - same |
| Brand | onsemi | onsemi | onsemi | onsemi |
| Resolution | 18 MP | 18 MP | 18 MP | 18 MP |
| Optical Format | 1/2.3 inch | 1/2.3 inch | 1/2.3 inch | 1/2.3 inch |
Key Differentiators
- Same-family drop-in availability (vs AR1820HSSC12SHEA0-DP1)
- Dynamic mode optimization (vs AR1820HSSC00SHEA0-DP1)
- Shipping format flexibility (vs AR1820HSSC12SHEA0-DR1)
Design Notes
CMOS image sensors are highly sensitive to power-supply noise: ripple on the analog and pixel-supply rails appears directly as fixed-pattern noise and banding in the image. Power the AR1820HSSC12SHEA0-DP from dedicated low-noise LDOs fed by a shared buck preregulator, and sequence the rails per the datasheet power-up order before releasing sensor reset. Place bulk 10 uF and local 0.1 uF decoupling at each ball-side supply via, and verify ripple below the datasheet limit with the actual MIPI link active, since output driver switching couples back into the supplies.
The 60-IBGA (10x10 mm) package requires a ball-matched land pattern with via-in-pad or dog-bone fan-out for inner rows. Route MIPI CSI-2 differential pairs as 100-ohm matched-length pairs, keep them shorter than ~50 mm where possible, and reference a continuous ground plane with no splits beneath the pairs. Extend a solid copper pour under the sensor to spread heat from the die during continuous 24-60 fps operation, and place the lens holder so its alignment features reference the sensor optical center per the datasheet mechanical drawing.
Distributor listings show two pixel-size values for this family: DigiKey lists 1.34 um x 1.34 um for this MPN while family datasheet text describes a 1.25 um pixel. Confirm the active array dimensions and pixel pitch from the current onsemi datasheet revision before finalizing lens selection and resolution-dependent algorithms, since optical format and crop factors depend on the exact active area. Also verify the ordering-code suffix meaning (-DP vs -DP1 vs -DR1) against the onsemi legend before qualifying a substitute, and obtain the datasheet register map for mode-switching configuration rather than copying settings from other AR1820 family members.
Compliance Information
RoHS compliance indicated by JLCPCB and Lisleapex listings (IBGA-60 Image Sensors ROHS). Other compliance attributes not stated in verified data.
