BCM2711ZPKFSB06C0T - Quad-Core A72 1.5GHz SoC | Broadcom
MPN: BCM2711ZPKFSB06C0T β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $35 | $35.00 |
| 10 | $33.5 | $335.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $30.2 | $15,100.00 |
| 1,000 | $28.7 | $28,700.00 |
BCM2711ZPKFSB06C0T Overview
A system-on-chip integrates an entire computer - CPU cores, GPU, memory controller, peripheral controllers, and interconnect - onto a single silicon die. SoCs sit at the top of the embedded-computing hierarchy, combining a microprocessor, graphics processor, and microcontroller-class peripherals (GPIO, SPI, I2C, UART, PWM, DMA) into one power-optimized device. The BCM2711 is classified as an application processor / multimedia SoC for embedded and single-board-computer applications.
Key features include four 64-bit ARM Cortex-A72 cores with out-of-order execution, hardware H.265 (HEVC) 4Kp60 video decode, dual-display support via two HDMI interfaces at up to 4K resolution, and a substantially upgraded peripheral set over the earlier BCM2837: a PCIe 2.0 lane (used for Gigabit Ethernet via an external LAN controller), native USB 3.0, a redesigned GPIO bank with more flexible alternate functions, and up to 8GB LPDDR4 SDRAM support on the same die via package-on-package memory stacking in end products.
Architecturally, the BCM2711 uses an AMBA AXI-compatible interconnect. According to the official BCM2711 ARM Peripherals datasheet, the AXI system does not always return read data in-order; the GPU contains special logic to cope with out-of-order arrivals while the ARM core requires ordered access - a consideration critical for bare-metal OS porting. Peripherals documented in the datasheet include timers, interrupt controller, GPIO, USB, PCM/I2S, DMA controller, and I2C masters.
Typical applications are single-board computers (Raspberry Pi 4 Model B), compute modules (CM4), industrial gateways, digital signage and media players leveraging 4Kp60 HEVC decode, and embedded vision or kiosk systems.
Design consideration: the BCM2711 requires specific boot media (SPI boot EEPROM plus SD/eMMC) and a regulated core-voltage power tree; thermal design with a heat spreader or heatsink is recommended at sustained CPU load. Verify exact memory-density suffix and package dimensions against the Raspberry Pi technical data sheet before layout.
This page synthesizes the manufacturer peripherals documentation, technical data sheet references, drop-in variant analysis, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for BCM2711ZPKFSB06C0T β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with BCM2711ZPKFSB06C0T (same form factor and footprint) β differing in CPU Core, GPU, Memory Support, USB, Video Decode.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
BCM2711ZKFSBG04T
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
BCM2711ZPKFSBG06T
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
BCM2711ZPKFSB08T
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
BCM2711ZPKFSB06C0T Maximum Ratings & Electrical Characteristics
| CPU Core | ARM Cortex-A72 (64-bit) |
| Number of Cores | 4 |
| CPU Frequency | 1.5 GHz |
| GPU | Broadcom VideoCore VI |
| Video Decode | H.265 (HEVC) 4Kp60 hardware decode |
| Display Output | Dual HDMI up to 4K, plus DSI |
| USB | USB 3.0 and USB 2.0 controllers |
| Ethernet Support | Gigabit Ethernet via PCIe 2.0 lane |
| Memory Support | LPDDR4 SDRAM (up to 8 GB per Pi 4 technical data sheet) |
| Peripherals | GPIO, SPI, I2C, UART, PCM/I2S, PWM, DMA controller, timers, interrupt controller |
| Interconnect | AMBA AXI-compatible |
| Wireless (end-product) | Dual-band 2.4/5.0 GHz WLAN and Bluetooth 5.0 (via companion radio in Pi 4 design) |
| Instruction Set | AArch64 (ARMv8-A) |
| Mounting Type | Surface Mount (BGA) |
BCM2711ZPKFSB06C0T standard Pin Configuration Guide
Pin configuration for BCM2711ZPKFSB06C0T (standard package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for BCM2711ZPKFSB06C0T.
Refer to the datasheet for full pin configuration.
Typical Applications
BCM2711ZPKFSB06C0T is suitable for 6 applications: Single-Board Computers, Compute Modules and Embedded Gateways, Digital Signage and Media Players, Industrial HMI and Control Panels, Kiosks and Interactive Terminals, Embedded Vision and Edge AI Prototyping.
Single-Board Computers
The BCM2711ZPKFSB06C0T is the defining SoC of the Raspberry Pi 4 Model B, delivering four 64-bit Cortex-A72 cores at 1.5 GHz, VideoCore VI graphics, dual 4K HDMI, USB 3.0, and Gigabit Ethernet in one device. Its integrated peripheral set - GPIO, SPI, I2C, UART, PCM/I2S and a multi-channel DMA controller - lets a full Linux desktop-class board ship on a credit-card footprint. Designers benefit from documented register-level peripherals (RP-008248-DS), enabling custom OS ports, while the AMBA AXI interconnect sustains the bandwidth LPDDR4 memory and USB 3.0 demand.
Recommended
Compute Modules and Embedded Gateways
On the Compute Module 4 form factor, the BCM2711 SoC gives industrial integrators access to all processor interfaces - PCIe 2.0, dual MIPI, USB 3.0, and up to 28 GPIO - on a DDR2-SODIMM-class carrier board. With LPDDR4 up to 8 GB and Gigabit Ethernet via PCIe, it handles edge analytics, protocol translation, and on-prem data buffering. The out-of-order AXI caveat documented in the peripherals datasheet matters for custom bootloader work, while standard Linux BSPs abstract it. Its 4Kp60 HEVC engine also enables local video preview in smart-camera gateways.
Recommended
Digital Signage and Media Players
The BCM2711's VideoCore VI GPU and hardware H.265 decoder sustain 4Kp60 HEVC playback while the CPU cores remain available for content management and networking - a decisive advantage over software-decode ARM parts. Dual HDMI interfaces drive two independent 4K displays from one chip, enabling video-wall tiles and menu-board pairs without external graphics silicon. According to the Pi 4 data sheet, the same SoC also handles audio over HDMI and I2S/PCM, so a single BCM2711 design covers video, audio, and network delivery in a fanless signage player when paired with adequate heatsinking.
Recommended
Industrial HMI and Control Panels
Touch-panel HMIs exploit the BCM2711's DSI display interface, quad Cortex-A72 CPU for Qt-class GUI stacks, and rich industrial I/O - GPIO with flexible alternate functions, SPI, I2C, UART, and PWM for direct sensor and actuator attachment. Gigabit Ethernet via the PCIe 2.0 lane connects to factory networks while USB 3.0 supports cameras and data loggers. LPDDR4 memory (to 8 GB per the Pi 4 technical data sheet) headroom keeps real-time trends and browser-based dashboards responsive, and the documented register map (RP-008248-DS) allows deterministic GPIO handling from custom firmware where needed.
Recommended
Kiosks and Interactive Terminals
Retail and self-service kiosks built on the BCM2711 combine dual 4K HDMI output (screen plus second customer-facing display), USB 3.0 for payment peripherals and scanners, and Gigabit Ethernet for transaction backhaul in a low-cost, single-SoC design. The Cortex-A72 quad core at 1.5 GHz runs full browser stacks and local applications with margin, while hardware HEVC decode handles promotional video without CPU load. Thermal design is the key constraint: sustained UI animation load requires a heatsink or conductive enclosure coupling, per Raspberry Pi 4 board-level measurements.
Recommended
Embedded Vision and Edge AI Prototyping
The BCM2711 accelerates vision prototyping: USB 3.0 and dual MIPI camera paths feed the quad Cortex-A72 cores for OpenCV pipelines, while the VideoCore VI GPU assists compositing and preview rendering. Its PCIe 2.0 lane - normally used for Gigabit Ethernet on Pi 4 boards - can instead host AI accelerator add-ons such as USB/PCIe NPUs in custom carrier designs. With LPDDR4 bandwidth substantially above BCM2837-class parts, frame buffers and model tensors move without starving the CPU. Register-level GPIO/DMA documentation (RP-008248-DS) supports deterministic sensor triggering for synchronized capture rigs.
Recommended
Recommended Products Summary
Engineering reference data for BCM2711ZPKFSB06C0T β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | BCM2711ZKFSBG04T | BCM2711ZPKFSBG06T | BCM2711ZPKFSB08T |
|---|---|---|---|---|
| Package | FBGA (proprietary BCM2711 package) | FBGA (proprietary BCM2711 package) - same | FBGA (proprietary BCM2711 package) - same | FBGA (proprietary BCM2711 package) - same |
| Brand | Broadcom | Broadcom | Broadcom | Broadcom |
| CPU Architecture | 4x Cortex-A72, 64-bit, 1.5 GHz | 4x Cortex-A72, 64-bit, 1.5 GHz | 4x Cortex-A72, 64-bit, 1.5 GHz | 4x Cortex-A72, 64-bit, 1.5 GHz |
| GPU | VideoCore VI | VideoCore VI | VideoCore VI | VideoCore VI |
| Video Decode | H.265 4Kp60 hardware | H.265 4Kp60 hardware | H.265 4Kp60 hardware | H.265 4Kp60 hardware |
| Memory Class (ordering suffix) | 06C0-class (4 GB-class per Pi 4 family) | 04-class (4 GB-class) | 06-class (4 GB-class) | 08-class (8 GB-class) |
| USB 3.0 | Yes | Yes | Yes | Yes |
| Drop-in Compatibility with Target | N/A (reference) | Yes - same die/package, verify suffix meaning | Yes - same die/package | Yes - same die/package, verify memory PoP |
Key Differentiators
- 64-bit out-of-order Cortex-A72 performance (vs BCM2837B0IFSBG)
- True Gigabit Ethernet via dedicated PCIe 2.0 lane (vs BCM2837B0IFSBG)
- 4Kp60 HEVC hardware decode and dual 4K HDMI (vs BCM2711ZPKFSB08T)
Design Notes
The BCM2711 AXI interconnect does not always return read data in-order. According to the BCM2711 ARM Peripherals datasheet (RP-008248-DS), the GPU contains special logic to tolerate out-of-order data, but the ARM core does not - so bare-metal boot code and DMA drivers must enforce ordering explicitly on the ARM path. This is the single most common source of subtle crashes in custom OS ports.
Estimated: Raspberry Pi 4 board-level stress tests indicate the SoC path dissipates roughly 6-7 W at full quad-core load. With a typical bare-BGA board-level theta-JA of 30-40 C/W and no spreading copper, junction rise reaches 180-280 C above ambient - unusable. Provide a bonded heatsink, metal enclosure coupling, or forced airflow and verify with thermography. Input values are Pi 4 documentation board power and assumed theta-JA; confirm against your own layout.
The BCM2711 requires a sequenced multi-rail power tree (core, memory, I/O) and boots via an SPI EEPROM that chains to SD/eMMC/USB/network boot. Do not omit bulk capacitance at the LPDDR4 supply; USB 3.0 VBus and the PCIe-based Ethernet path add transient loads. Follow the Raspberry Pi 4 reference power design and the official technical data sheet for rail sequencing before release to production.
This is a fine-pitch BGA requiring controlled-impedance breakout: length-match LPDDR4 byte lanes within datasheet tolerances, and route USB 3.0 and PCIe 2.0 as 90-ohm differential pairs with referenced ground. Verify the exact package drawing (ball count, ball pitch, dimensions) directly with Raspberry Pi/Broadcom, since the verified data did not include the package mechanical drawing.
Compliance Information
Compliance data was not present in the verified web data for this MPN; request manufacturer compliance documentation with your quote.
