BSL606SNH6327XTSA1 - 60V N-Channel OptiMOS3 MOSFET | Infineon
MPN: BSL606SNH6327XTSA1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.45 | $0.45 |
| 10 | $0.39 | $3.90 |
| 100 | $0.32 | $32.00 |
| 500 | $0.27 | $135.00 |
| 1,000 | $0.22 | $220.00 |
| 3,000 | $0.19 | $570.00 |
BSL606SNH6327XTSA1 Overview
A small-signal/small-power MOSFET such as the BSL606SNH6327XTSA1 is a discrete semiconductor device that uses a gate electric field to control current flow between drain and source terminals. Small-signal MOSFETs sit below the taxonomy of power MOSFETs (>10 A) and above simple switches; they belong to the broader family of field-effect transistors (FET) under transistors, discrete semiconductors. OptiMOS is Infineon's trademarked trench MOSFET platform optimized for low RDS(on) x Qg figure-of-merit, low gate charge, and fast switching - making these parts especially attractive in high-frequency DC-DC converter and load-switch roles.
Key electrical characteristics include a typical gate threshold voltage around 2 V, very low total gate charge Qg, low reverse transfer capacitance Crss, and avalanche-rated single-pulse robustness. The OptiMOS3 process delivers a strong balance of conduction loss and switching loss: a typical figure-of-merit of roughly 4 mOhm-nC means the device is suitable for synchronous rectification in sub-amp DC-DC converters, high-side load switches, battery protection, and small motor drive stages. Pb-free lead plating ensures RoHS compliance, while the AEC-Q101 automotive qualification makes the part a credible choice under the hood, in body electronics, and in chassis-control domains.
Typical applications include high-side load switching in automotive body-control modules, USB power-distribution switches, hot-swap controllers, DC-DC converter synchronous rectifiers, LED backlight drivers, motor driver H-bridges, and battery management protection FETs. The wide 60 V drain rating also provides comfortable margin on 12 V and 24 V industrial buses. When designing in this part, observe the recommended 10 V gate-drive level for full RDS(on) performance, respect the SOA at elevated case temperatures, and follow PG-TSOP6-6 land-pattern guidelines for proper thermal dissipation through copper pours.
This page synthesizes distributor pricing, drop-in alternatives from Infineon's OptiMOS family and qualified third parties, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for BSL606SNH6327XTSA1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with BSL606SNH6327XTSA1 (same form factor and footprint) β differing in Package, Technology, Operating Temperature, RoHS Status, Qualification.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
BSL606SNH6327
β Drop-Inπ Reference alternative (not in catalog)
BSL606SNA6327
β Drop-Inπ Reference alternative (not in catalog)
BSL606SN
β Drop-Inπ Reference alternative (not in catalog)
BSL207SPH6327XTSA1
β Drop-Inβ In Stock
$0.33 / Unit
View Datasheet βVB7638
β Drop-Inπ Reference alternative (not in catalog)
NTR4101PT1G
β Drop-Inπ Reference alternative (not in catalog)
BSL606SNH6327XTSA1 Maximum Ratings & Electrical Characteristics
| Transistor Type | N-Channel MOSFET (Enhancement Mode) |
| Technology | OptiMOS3 trench MOSFET |
| Drain-Source Voltage (VDS) | 60 V |
| Continuous Drain Current (ID) at Ta | 4.5 A |
| Static Drain-Source On-Resistance (RDS(on)) | 60 mOhm (max, VGS = 10 V) |
| Total Power Dissipation (PD) at Ta | 2 W |
| Gate-Source Voltage (VGS) | +/-20 V (max) |
| Total Gate Charge (Qg) | 5.6 nC (max) |
| Operating Temperature Range | -55C to +150C (Tj) |
| Package | PG-TSOP6-6 (6-pin, SOT-23-6 compatible) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q101 (Automotive) |
| RoHS Status | Compliant (Pb-free plating) |
| MSL Level | 1 (per JEDEC J-STD-020) |
BSL606SNH6327XTSA1 Pin Configuration
| Pin 1 | G β Gate - gate drive input |
| Pin 2 | S β Source - power return path |
| Pin 3 | D β Drain - internally connected to pins 4 and 6 |
| Pin 4 | D β Drain - internally connected to pins 3 and 6 |
| Pin 5 | S β Source - internally connected to pin 2 |
| Pin 6 | D β Drain - internally connected to pins 3 and 4 |
Typical Applications
BSL606SNH6327XTSA1 is suitable for 6 applications: Automotive High-Side Load Switch, Synchronous Rectifier in DC-DC Buck Converters, USB Power-Distribution Switch (VBUS Protection), Battery Management Protection FET (1S/2S Li-Ion), H-Bridge Driver for Small DC Motors, LED Lighting PWM Dimmer Switch.
Automotive High-Side Load Switch
The BSL606SNH6327XTSA1 is ideal for 12 V automotive high-side load switching in body-control modules, lighting drivers, and accessory power distribution. With 60 V VDS rating it tolerates load-dump transients up to ISO 7637-2 pulse severity, and the 60 mOhm RDS(on) at 4.5 A continuous conduction produces only ~1.2 W conduction loss - manageable in PG-TSOP6-6 with a 1 square-inch copper pour. AEC-Q101 qualification permits deployment under the hood and in cabin electronics without further requalification. Compared to relay-based switching the part provides silent, bounce-free operation and >1 billion cycle endurance, critical for seat heaters, mirror adjusters, and lighting PWM dimming at 100-400 Hz.
Recommended
Synchronous Rectifier in DC-DC Buck Converters
The BSL606SNH6327XTSA1 serves as the low-side synchronous rectifier in sub-10 A buck converters for POL (point-of-load) regulation in industrial and automotive systems. Its 5.6 nC total gate charge keeps gate-drive losses below 30 mW at 500 kHz, and 60 mOhm RDS(on) translates to roughly 1% conduction loss at 5 A. OptiMOS3's low Crss reduces shoot-through risk during dead-time transitions, easing timing constraints on the controller. The PG-TSOP6-6 package's three drain pins (3, 4, 6) share conduction loss and improve thermal spreading. Designers should pair the part with a gate driver capable of 1-2 A peak source/sink current to fully enhance the FET within the controller's programmed dead-time window.
Recommended
USB Power-Distribution Switch (VBUS Protection)
In USB Type-A and Type-C VBUS power-distribution switches, the BSL606SNH6327XTSA1 provides a compact, low-loss hot-swap element that meets the 5 V / 0.5-3 A typical load profile. The 60 V VDS rating gives substantial margin over the 5 V VBUS rail and any inductive cable transients, while the 60 mOhm RDS(on) limits steady-state voltage drop to about 180 mV at 3 A - well within USB 2.0/3.0 drop budgets. AEC-Q101 qualification makes the part attractive for in-vehicle USB chargers that must operate over -40C to +85C ambient. The PG-TSOP6-6 footprint is footprint-compatible with industry-standard TSOP-6 load switches, simplifying layout reuse across consumer and automotive USB hubs.
Recommended
Battery Management Protection FET (1S/2S Li-Ion)
In single-cell or two-cell lithium-ion battery management systems (BMS), the BSL606SNH6327XTSA1 acts as the low-side protection FET, interrupting charge or discharge current on cell over-voltage, under-voltage, over-current, or short-circuit events. At 4.5 A continuous rating it suits 1S packs up to ~15 W discharge, while 60 V VDS provides safety margin against transient events. The 60 mOhm on-resistance contributes only ~5% to the discharge path loss in a 1S pack - acceptable for cost-optimized consumer and IoT batteries. The PG-TSOP6-6 package fits within the tight PCB area of battery protection boards used in power banks, e-bikes, and small electric tools.
Recommended
H-Bridge Driver for Small DC Motors
The BSL606SNH6327XTSA1 forms the low-side or high-side switches of an H-bridge driving small brushless or brushed DC motors in seat adjusters, mirror actuators, HVAC flaps, and small pump modules. With 60 V VDS the device tolerates back-EMF spikes from 12 V and 24 V motor windings, while 4.5 A continuous handles inrush currents typical of small motors during stall or start-up. Two BSL606SNH6327XTSA1 in a half-bridge deliver a compact, low-cost output stage; adding two more completes a full H-bridge. The AEC-Q101 qualification and -55C to +150C Tj range cover under-hood and cabin environments reliably. Designers should add gate-source pull-down resistors and shoot-through dead-time in the controller firmware.
Recommended
LED Lighting PWM Dimmer Switch
In automotive interior and exterior LED lighting, the BSL606SNH6327XTSA1 enables high-frequency PWM dimming of LED strings at 100 Hz to 20 kHz with high dynamic range. The low 5.6 nC Qg supports fast switching edges, minimizing transition loss and audible noise from the LED inductor. With 60 V VDS and 4.5 A continuous, the part can drive multi-LED strings at 12 V or 24 V supply rails. AEC-Q101 qualification makes the part a reliable choice for headlamp matrix, daytime running light, and interior ambient lighting where thermal cycling and vibration stress demand automotive-grade silicon. The PG-TSOP6-6 footprint allows a very compact driver PCB suitable for placement inside the lamp housing.
Recommended
Recommended Products Summary
Engineering reference data for BSL606SNH6327XTSA1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | BSL606SNH6327 | BSL606SNA6327 | BSL606SN | BSL207SPH6327XTSA1 | VB7638 | NTR4101PT1G |
|---|---|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | VBsemi | onsemi |
| Package | PG-TSOP6-6 | PG-TSOP6-6 - same | PG-TSOP6-6 - same | PG-TSOP6-6 - same | PG-TSOP6-6 - same | SOT-23-6 - pin-compatible | TSOP-6 - pin-compatible |
| Drain-Source Voltage (VDS) | 60 V | 60 V | 60 V | 60 V | 20 V | 60 V | 60 V |
| Automotive Qualification | AEC-Q101 | AEC-Q101 | AEC-Q101 | AEC-Q101 | AEC-Q101 | AEC-Q101 compatible (VBsemi) | AEC-Q101 |
Key Differentiators
- Lowest Qg in the 60 V TSOP-6 class among the listed alternatives (vs VB7638)
- AEC-Q101 qualified with full automotive-grade documentation (vs VB7638)
- Three internally-connected drain pins for lower thermal resistance (vs NTR4101PT1G)
- Higher VDS rating than lower-voltage OptiMOS siblings in same package (vs BSL207SPH6327XTSA1)
Design Notes
Estimated: At continuous 4.5 A drain current with 60 mOhm RDS(on) and VGS=10 V, conduction loss is P=I^2 x R = 4.5^2 x 0.06 = 1.215 W. The PG-TSOP6-6 package on a 1-square-inch copper pour on a standard 1 oz FR-4 PCB has a typical junction-to-ambient thermal resistance of approximately 80 C/W (per Infineon PG-TSOP6-6 application note). Junction temperature rise is therefore about 97 C above 25 C ambient, putting Tj near 122 C - within the 150 C rating but leaving limited margin. For sustained 4.5 A operation above 60 C ambient, increase copper area to 2-3 square inches or force-air-cool the package.
The PG-TSOP6-6 has three drain pins (3, 4, 6) and two source pins (2, 5) internally connected to share conduction loss and improve thermal spreading. On the PCB, all three drain pads must be soldered to a continuous copper pour that extends to a thermal via array under the package. The source pads must likewise connect to a low-impedance ground pour with multiple vias to inner ground planes. Avoid routing signal traces between the drain and source pads, as this adds parasitic inductance and may degrade switching performance above 100 kHz.
Do not drive the gate above the absolute maximum VGS rating of +/-20 V - even brief transients above this can puncture the gate oxide. Use a gate-source Zener clamp (e.g., 12-15 V) if the gate driver output is exposed to inductive ringing. Also, do not exceed the pulsed drain current rating during start-up into capacitive loads; place a soft-start ramp on the gate or use a current-limited gate drive. Finally, observe the safe operating area: at high VDS (>40 V) the device can only sustain very short pulse currents before thermal limitations apply.
Recommended land pattern follows IPC-7351 nominal density for SOT-23-6 (PG-TSOP6-6): 0.95 mm pitch, 0.50 mm pad width, 0.45 mm pad length. Thermal vias under the drain pads (3, 4, 6) should be 0.3 mm diameter, plated shut or tented to prevent solder wicking, with 4-6 vias per pad. Place input/output bulk capacitors close to the device to minimize high-frequency loop inductance. For switching applications above 100 kHz, keep the gate-drive loop area under 10 mm^2 to control ringing.
Compliance Information
AEC-Q101 (automotive) qualified per Infineon product family page. Pb-free lead plating per RoHS-compliant designation in datasheet excerpt. Halogen-free status not explicitly stated in provided data.
