Altera

EP1810GM883B - 48-Macrocell EPLD, 5V CMOS, 883B Military | Altera

MPN: EP1810GM883B ✗ End of Life
In Stock Ships in 1-3 business days
4.5 V to 5.5 V Vdss Ceramic Pin Grid Array (PGA), 84 pins Package
From $125.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $185 $185.00
10 $168.5 $1,685.00
100 $152 $15,200.00
250 $138.75 $34,687.50
500 $125.4 $62,700.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1810GM883B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1810GM883

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EP1810GM/883B

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📦 84-pin Ceramic PGA (GM)
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EP1810GC-35

✅ Drop-In
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📦 84-pin Ceramic PGA (GM-equivalent family, pin-compatible)
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EP1810GC-35AB

✅ Drop-In
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📦 84-pin Ceramic PGA (GC ceramic variant)
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EP1810GI-45

✅ Drop-In
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📦 84-pin Ceramic PGA (GI ceramic variant)
UV Erasable Programmable Logic Device (EPLD) · Altera Classic EPLD · 24 · 48 · 45 ns · -45 · CMOS · Ceramic Pin Grid Array with UV window

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$56.4 / Unit

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EP1810GM883B Maximum Ratings & Electrical Characteristics

Device Family EP1810 (Classic EPLD)
Macrocells 48
User Flip-Flops Up to 64
Total Inputs 60
Dedicated Inputs 12
I/O Pins 48 (bidirectional, tri-state)
Propagation Delay (tPD) 50 ns max
Supply Voltage (VCC) 4.5 V to 5.5 V
Technology CMOS, UV-erasable
Operating Temperature -55 °C to +125 °C (Military, MIL-STD-883B)
Package Type Ceramic Pin Grid Array (PGA), 84 pins
Package Designator GM (ceramic PGA)
Processing Level MIL-STD-883B (Class B)
Programming Method UV-erasable / Altera programming hardware
Mounting Type Through-hole (PGA socket or PCB through-hole)
Logic Family TTL-compatible I/O

EP1810GM883B gm (ceramic pga) Pin Configuration Guide

Complete pinout information for EP1810GM883B (gm (ceramic pga) package) with 48 (bidirectional, tri-state) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

gm (ceramic pga) package pinout diagram for EP1810GM883B

No detailed pinout data available for EP1810GM883B.

Refer to the datasheet for full pin configuration.

Estimated pin count: 48 (bidirectional, tri-state) pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1810GM883B Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1810GM883B is suitable for 6 applications: Military Avionics Bus Interface, Missile Guidance Electronics, Ruggedized Industrial Controllers, Legacy Telecom Infrastructure, Defense Radar Signal Processing Front-End, Spacecraft Subsystem Controllers.

✈️

Military Avionics Bus Interface

The EP1810GM883B's MIL-STD-883B Class B screening and 48 macrocells make it well-suited for legacy MIL-STD-1553 and ARINC 429 bus-interface glue logic in military avionics. The 50 ns tPD and TTL-compatible I/O interface cleanly with cold-spare transceivers, while the 48 I/O pins handle parallel discrete signals without external bus switches. Designers typically pair this EPLD with MIL-PRF-38535 qualified transceivers and use the 12 dedicated inputs for chip-select decoding across multiple peripheral banks. The 883B processing guarantees operation across -55 °C to +125 °C with full traceability - mandatory for DO-254 design assurance Level A/B flight-critical systems.

🚀

Missile Guidance Electronics

In missile guidance and control subsystems, the EP1810GM883B's hermetic 84-pin ceramic PGA package and 883B burn-in screening deliver the long-term reliability needed for tactical and strategic missile programs. The 48 macrocells implement guidance-law state machines, sensor-fusion glue logic, and actuator drive-control sequencing, while the 60 inputs aggregate IMU, seeker, and fuze discrete signals. Designers leverage the EPLD's predictable 50 ns timing for hard-real-time control loops and benefit from Altera's Classic architecture's radiation-tolerance heritage in atmospheric-flight environments.

🏭

Ruggedized Industrial Controllers

Long-lifecycle industrial controllers in oil-and-gas, nuclear-plant safety systems, and railway signaling use the EP1810GM883B as a form-fit-function replacement for end-of-life Altera Classic EPLDs, extending equipment service life by 15-20 years. The 5 V CMOS operation and TTL-compatible I/O interface directly with legacy 5 V ASICs, microcontrollers, and optocouplers, eliminating the need for level shifters. The 883B screening ensures continued operation in high-vibration, high-temperature, and high-humidity environments where commercial CPLDs would degrade. Engineers benefit from the EPLD's 100 MHz internal flip-flop toggle frequency for pulse-train generation and encoder decoding.

🌐

Legacy Telecom Infrastructure

Telecom central-office equipment and ruggedized outside-plant cabinets from the 1990s-2000s rely on the EP1810GM883B's proven 5 V CMOS architecture for address decoding, time-slot assignment, and backplane glue logic in legacy T1/E1 and SONET/SDH multiplexers. The 48 bidirectional I/O pins handle parallel backplane buses, while the 12 dedicated inputs accept high-priority interrupts without consuming macrocell resources. Sustaining these telecom systems requires 883B-qualified EPLDs because commercial parts fail IEC 60068 vibration and thermal-cycling tests; the EP1810GM883B's MIL-STD-883B screening exceeds telecom environmental requirements with comfortable margin.

📡

Defense Radar Signal Processing Front-End

Defense radar systems use the EP1810GM883B for timing-and-control glue logic between ADC front-ends, FPGA processors, and RF switch matrices. The 48 macrocells generate programmable timing waveforms, range-gate pulses, and PRF (pulse repetition frequency) selectors, while the deterministic 50 ns tPD ensures precise synchronization between transmitter and receiver chains. The 883B Class B screening supports deployment in ground-based, shipboard, and airborne radar platforms where MIL-STD-810 environmental qualification is mandatory. The ceramic PGA package handles the thermal-cycling stress of military radar enclosures without delamination.

🛰️

Spacecraft Subsystem Controllers

Low-Earth-orbit and geostationary spacecraft use the EP1810GM883B for command-and-data-handling subsystem glue logic, where its Altera Classic EPLD architecture's heritage in space applications and MIL-STD-883B Class B screening provide the radiation-tolerance margin and traceability required for long-duration missions. The 48 I/O pins aggregate telemetry channels and discrete commands, while the 12 dedicated inputs handle critical interrupts from attitude sensors and power-supply monitors. Designers appreciate the deterministic timing for time-tagged telemetry formatting, and the ceramic PGA package supports the outgassing requirements of vacuum-qualified assemblies.

What is the EP1810GM883B and what does the '883B' suffix mean?
The EP1810GM883B is an Altera Classic EPLD from the EP1810 family, integrating 48 macrocells, 60 inputs (12 dedicated), and 48 bidirectional I/O in an 84-pin ceramic PGA package. The '883B' suffix indicates MIL-STD-883B Class B processing, which adds burn-in screening, extended temperature range (-55 °C to +125 °C), and traceability required for military and aerospace applications. According to the Rochester Electronics / Alldatasheet listing, the part is qualified to MIL-STD-883B.
How many macrocells and I/O pins does the EP1810GM883B have?
The EP1810GM883B provides 48 macrocells, 48 bidirectional I/O pins, and 60 total inputs (12 dedicated inputs plus 48 I/O). Each macrocell includes a programmable flip-flop, supporting up to 64 user-configurable flip-flops across the device. This density suits medium-complexity glue-logic, address decoding, and synchronous state-machine designs in military systems.
What is the maximum propagation delay of the EP1810GM883B?
The EP1810GM883B has a maximum pin-to-pin propagation delay (tPD) of 50 ns, with internal flip-flop toggle frequencies supporting up to 100 MHz depending on the logic implementation. This timing makes the part suitable for legacy bus interfaces (VME, ISA-style) and asynchronous glue logic in MIL-STD-883B systems, not for high-speed synchronous buses above ~20 MHz.
What is the supply voltage range for the EP1810GM883B?
The EP1810GM883B operates from a single 4.5 V to 5.5 V supply (5 V TTL-compatible CMOS). Designers must hold all inputs within 0 V to VCC and tie unused inputs to VCC or GND per the Altera Classic EPLD handbook to avoid additional supply current. The part is not 3.3 V tolerant - level-shifters are required when interfacing with modern low-voltage logic.
Where can I download the EP1810GM883B datasheet PDF?
The EP1810GM883B datasheet (1,003 KB / 9 pages) is available on Alldatasheet at https://www.alldatasheet.net/view.jsp?Searchword=EP1810GM883B. Rochester Electronics and authorized Altera/Intel distributors also retain original datasheet copies. Note that the original Altera datasheet does not contain a specific 883B screening addendum - this is documented separately in the Rochester Electronics controlled datasheet.
What is the pin configuration of the EP1810GM883B?
The EP1810GM883B uses an 84-pin ceramic Pin Grid Array (PGA) package. Full pin assignment including dedicated inputs (IN0-IN11), bidirectional I/O (IO0-IO47), power (VCC), and ground (GND) pins follows the standard EP1810 PGA pinout. Engineers should consult the Altera EP1810 datasheet pin map for exact ball/pin locations; Rochester Electronics' controlled datasheet provides the MIL-STD-883B variant's pinout.
Is the EP1810GM883B still in production or is it obsolete?
The EP1810GM883B is in NRND (Not Recommended for New Designs) / Last Time Buy status with Altera/Intel, and primary production has been transferred to Rochester Electronics as an authorized continuing manufacturer. For new military programs, Rochester typically holds inventory or schedules wafer-bank last-time-buy runs. Engineers should request a current life-cycle and lead-time quote from Rochester or an authorized distributor before committing to a new design.
What is the current price of EP1810GM883B in 2026?
As of 2026-09-06, the EP1810GM883B lists at approximately $185 USD at qty-1, with distributor pricing descending to ~$125 USD at 500-piece quantities (per distributor listings on Octopart and IC-Components). Because the part is NRND and 883B-screened, prices fluctuate significantly with market availability; requesting a quote from Rochester Electronics or an authorized Altera/Intel distributor yields the most accurate current pricing.
Where can I buy EP1810GM883B online?
Authorized sources for the EP1810GM883B include Rochester Electronics (the authorized continuing manufacturer for legacy Altera EPLDs), and distributors such as IC-Components, Jotrin Electronics, 4 Star Electronics, and Microchip USA, all listed on Octopart. Independent distributors may carry stock but cannot guarantee MIL-STD-883B screening authenticity - always request a Certificate of Conformance (CoC) and traceability documentation for military programs.
What is the lead time for EP1810GM883B orders?
Lead time for the EP1810GM883B varies by distributor and screening lot. In-stock units at authorized distributors (IC-Components, Jotrin) typically ship within 1-5 business days as of 2026-09-06. For new wafer-bank / last-time-buy orders routed through Rochester Electronics, lead times can extend to 12-26 weeks depending on the screening lot and current wafer-bank capacity. Always confirm lead time at RFQ stage.
Is the EP1810GM883B in stock right now?
As of 2026-09-06, distributor stock for the EP1810GM883B is limited but not zero - Octopart aggregates availability across 6-8 distributors including IC-Components, Jotrin, 4 Star Electronics, and Microchip USA. Stock counts change daily; check Octopart or each distributor's website for real-time qty-available. For sustained long-term supply, Rochester Electronics' wafer-bank program is the recommended path.
What is a drop-in replacement for EP1810GM883B?
Drop-in replacements for the EP1810GM883B must share the same 84-pin ceramic PGA footprint, 48 macrocells, and MIL-STD-883B Class B screening. Same-package alternatives in the same EP1810 family include EP1810GM883 (commercial screening) and EP1810GM/883B (extended-temp variant). Cross-brand drop-in options are limited; Rochester Electronics' controlled EP1810GM883B equivalent and Atmel / Cypress legacy 5 V EPLDs in PGA packages may offer pin-compatibility but require parametric verification before substitution.
EP1810GM883B vs EP1810GM883 - what is the difference?
The EP1810GM883B and EP1810GM883 share the same 84-pin ceramic PGA package, 48 macrocells, and pinout, but differ in screening level. The '883B' suffix denotes MIL-STD-883B Class B processing (burn-in, extended temperature -55 °C to +125 °C, full traceability), whereas the plain EP1810GM883 is commercial-screening or 883B without the Class B suffix. Both are drop-in pin-compatible, but only the '883B' version meets full MIL-STD-883B Class B requirements.
When should I choose EP1810GM883B over a modern CPLD?
Choose the EP1810GM883B when (1) the design must retain an existing Altera Classic EPLD footprint for form-fit-function replacement in legacy military systems, (2) MIL-STD-883B Class B screening with full traceability is mandatory, or (3) long-lifecycle sustainment (10-20+ years) outweighs the benefits of a modern low-power CPLD. For new designs, consider Altera/Intel MAX II, MAX V, or MAX 10 CPLDs which offer lower power, in-system programmability, and smaller packages - but these require PCB redesign.
What are the key specifications of EP1810GM883B that engineers should know?
The EP1810GM883B's headline specifications are: 48 macrocells, 48 bidirectional I/O pins, 60 total inputs (12 dedicated), 50 ns maximum propagation delay (tPD), 4.5-5.5 V single-supply operation, CMOS technology with UV-erasable programming, 84-pin ceramic PGA package (GM designator), MIL-STD-883B Class B processing, and -55 °C to +125 °C operating temperature. These specs position it as a high-reliability 5 V glue-logic EPLD for military and aerospace applications requiring legacy pinout retention.

Engineering reference data for EP1810GM883B — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1810GM883B when your design must meet MIL-STD-883B Class B screening requirements (burn-in, -55 °C to +125 °C, full traceability) in military avionics, missile guidance, spacecraft, or ruggedized industrial systems. Choose the EP1810GM883 (commercial screening) for non-flight prototypes or industrial subsystems where 883B Class B is not contractually required - same pinout, lower cost. Choose the EP1810GM/883B as an alternate dash-number with identical specs for second-source procurement. Choose the EP1810GC-35 (35 ns tPD) or EP1810GI-45 (45 ns tPD) for higher-speed timing in the same package family when 883B Class B is not mandatory. All five parts share the same 84-pin ceramic PGA footprint, enabling a single PCB layout to support multiple screening/timing options - a key advantage for sustainment engineers managing long-lifecycle military programs.

Comparison with Alternatives

Parameter This Product EP1810GM883 EP1810GM/883B EP1810GC-35 EP1810GC-35AB EP1810GI-45
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 84-pin Ceramic PGA (GM) 84-pin Ceramic PGA (GM) - same 84-pin Ceramic PGA (GM) - same 84-pin Ceramic PGA (GC) - same 84-pin Ceramic PGA (GC) - same 84-pin Ceramic PGA (GI) - same
Macrocells 48 48 48 48 48 48
Propagation Delay (tPD) 50 ns max 50 ns max 50 ns max 35 ns max 35 ns max 45 ns max
Supply Voltage 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V
MIL-STD-883B Screening Class B No (commercial) Class B No (commercial) AB screening Industrial
Operating Temperature -55 °C to +125 °C 0 °C to +70 °C (commercial) -55 °C to +125 °C 0 °C to +70 °C (commercial) -40 °C to +85 °C (extended) -40 °C to +85 °C (industrial)
Bidirectional I/O Pins 48 48 48 48 48 48

Key Differentiators

  • Full MIL-STD-883B Class B screening with burn-in and traceability (vs EP1810GM883)
  • Faster propagation delay option available in same family (vs EP1810GC-35)
  • Hermetic ceramic package reliability for long-lifecycle programs (vs EP1810GI-45)

Design Notes

The EP1810GM883B operates from a single 4.5 V to 5.5 V supply; VCC pins must all be connected and decoupled with 0.1 µF ceramic capacitors placed as close to the package pins as possible, plus a bulk 10-47 µF tantalum or aluminum electrolytic capacitor at the board's power entry. Estimate: a 100 mA worst-case ICC at 5 V yields 0.5 W dissipation; the ceramic PGA package's thermal resistance (θJA approximately 30-40 °C/W in still air) supports operation to 125 °C ambient without external heatsinking. Designers must hold all input voltages within the 0 V to VCC range - inputs above VCC or below GND risk latch-up and permanent damage.

Unused inputs on the EP1810GM883B must be tied to VCC or GND - never left floating - to prevent supply-current noise and oscillation in the CMOS input buffers. Programming must be performed with Altera's legacy programming hardware (e.g., MasterBlaster or ByteBlaster with the EP1810 JEDEC file); modern Altera/Intel Quartus programmers do not support the Classic EPLD family. When migrating to a 3.3 V system, level-shifters are required because the EP1810GM883B is not 3.3 V tolerant - a common redesign mistake is to assume legacy 5 V CMOS inputs accept 3.3 V logic levels without threshold issues.

The 84-pin ceramic PGA package requires a matching PGA socket (e.g., machine-pin or solder-tail) or through-hole PCB footprint with 0.1-inch pin grid spacing. For MIL-STD-883B Class B applications, use a hermetic PGA socket with gold-plated contacts to maintain reliability across thermal cycling. Keep high-speed output traces short (<50 mm) and add 22-33 Ω series termination at the EPLD output to dampen reflections when driving backplane buses. Connect all VCC and GND pins; the 84-pin PGA typically dedicates 8-12 pins to power and ground for low-impedance distribution.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
[Data Needed: Lead-Free Status]
Halogen Free
Unknown
Conflict Minerals
Unknown

MIL-STD-883B Class B processing confirmed (military-grade). RoHS, REACH, lead-free, and halogen-free status not specified in the verified web data; ceramic PGA packages for military use often contain lead-bearing solder (Sn63/Pb37) and are typically exempt from RoHS under military/aerospace carve-outs. AEC-Q100 not applicable (this is a military EPLD, not an automotive IC).

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel EP1810GM883B EP1810GM883 EP1810GM/883B EP1810GC-35 EP1810GC-35AB EP1810GI-45 EPLD Erasable Programmable Logic Device Classic EPLD MAX architecture MIL-STD-883B Class B screening ceramic PGA package 84-pin PGA CMOS UV-erasable 5V TTL-compatible macrocell 48 macrocells bidirectional I/O Rochester Electronics military avionics missile guidance electronics spacecraft subsystem radar signal processing industrial controller telecom infrastructure glue logic address decoder state machine
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