EP1AGX50CF484C3 - 50K LE Arria GX FPGA, 484-BGA | Intel
MPN: EP1AGX50CF484C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 25 | $245 | $6,125.00 |
| 50 | $232 | $11,600.00 |
| 100 | $218 | $21,800.00 |
Drop-in alternatives for EP1AGX50CF484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50CF484C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP1AGX50CF484I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1AGX50CF484C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX35CF484C6N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1AGX35CF484C6
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP1AGX50CF484C3 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 bits |
| M4K Memory Blocks | 4,506 |
| M-RAM Blocks | 252 |
| Transceiver Channels | 12 (up to 3.125 Gbps) |
| User I/O Pins | 232 |
| Package | 484-ball FBGA (FineLine BGA) |
| Speed Grade | C3 (commercial, fastest) |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG |
| RoHS Status | Compliant |
| Process Technology | 90 nm |
EP1AGX50CF484C3 484-ball fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX50CF484C3 (484-ball fbga (fineline bga) package) with 232 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50CF484C3.
Refer to the datasheet for full pin configuration.
Estimated pin count: 232 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50CF484C3 is suitable for 6 applications: PCI Express Gen1 Endpoint Card, XAUI / 10 Gigabit Ethernet Bridge, Serial RapidIO Switch Fabric, Broadcast Video Processing Engine, Wireless Baseband Prototyping Platform, Industrial Protocol Bridge / Gateway.
PCI Express Gen1 Endpoint Card
The EP1AGX50CF484C3 is a classic mid-complexity PCI Express Gen1 endpoint solution for add-in cards and embedded host boards. Its 12 integrated 3.125 Gbps transceivers comfortably support x1/x4/x8 Gen1 links with 2.5 Gbps signaling, and the hardened PCIe hard IP block eliminates fabric logic for the PHY/MAC layers. The 50K logic elements are sufficient for a complete DMA engine plus application-layer payload. Designers should use the 484-FBGA package to route PCIe lanes on the top layers with reference-clock and PERST signals properly length-matched per the Arria GX hardware reference design.
Recommended
XAUI / 10 Gigabit Ethernet Bridge
The EP1AGX50CF484C3 fits well in 10 Gigabit Ethernet bridging and aggregation applications using XAUI (4 x 3.125 Gbps lanes) interfaces. With 12 transceivers, designers can implement two full XAUI ports plus a sideband management channel without fabric SERDES, leaving the 50K logic elements free for bridging logic, MAC framing, and forward-error correction. The 484-FBGA package with 232 user I/O pins exposes ample GPIO for PHY management interfaces, MDIO buses, and LEDs. Industrial-grade variant EP1AGX50CF484I7N extends operation to -40C to +100C for outdoor switch deployments.
Recommended
Serial RapidIO Switch Fabric
Serial RapidIO (SRIO) at 1.25/2.5/3.125 Gbps per lane is well-served by the EP1AGX50CF484C3, especially for DSP-cluster backplanes and baseband processing cards. The hardened SERDES blocks deliver deterministic low-latency RapidIO physical-layer performance, while the 50K logic elements and 2.4 Mbit embedded RAM are sufficient for a 4-port SRIO switch with non-blocking cut-through forwarding. The 484-FBGA package supports the high-speed SRIO lane routing required for signal integrity at 3.125 Gbps, with reference clocks sourced from dedicated transceiver clock pins.
Recommended
Broadcast Video Processing Engine
Broadcast video applications such as SDI (Serial Digital Interface) embedders, de-embedders, and format converters leverage the EP1AGX50CF484C3's transceiver density and fabric throughput. The 12 transceivers handle multiple SD/HD/3G-SDI streams at up to 2.97 Gbps, while the 50K logic elements implement pixel-domain processing, audio embedding, and ancillary data extraction. The 484-FBGA package exposes 232 user I/O pins for parallel video interfaces, GPIO for board control, and DDR2 memory controller pins. Designers should reference the Altera video reference design for SDI PHY implementation patterns.
Recommended
Wireless Baseband Prototyping Platform
The EP1AGX50CF484C3 is widely deployed as a wireless baseband prototyping platform for 3G/4G reference designs, CPRI/OBSAI fronthaul interfaces, and DSP algorithm development. Its 12 transceivers at 3.125 Gbps accommodate multiple CPRI links to remote radio heads, while the embedded DSP blocks accelerate chip-rate and symbol-rate processing. The 50K logic elements host complete PHY-layer implementations plus MAC prototypes. With the 484-FBGA package offering 232 user I/O pins, designers can interface to external ADCs/DACs, DDR2 memory, and backplane connectors without I/O contention.
Recommended
Industrial Protocol Bridge / Gateway
The EP1AGX50CF484C3 is suitable for industrial protocol bridge designs that convert between Ethernet, Serial RapidIO, CAN, Profibus, and other industrial protocols on a single board. With 12 transceivers supporting multiple Ethernet or RapidIO links simultaneously, plus 232 user I/O pins for CAN controllers, RS-485 transceivers, and GPIO, the device integrates bridge logic, protocol stack offload, and packet buffering on a single chip. The industrial-temperature variant EP1AGX50CF484I7N is preferred for harsh environments such as factory floors with extended temperature ranges from -40C to +100C.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50CF484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50CF484C6N | EP1AGX50CF484I7N | EP1AGX35CF484C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 50,160 | 50,160 (same) | 50,160 (same) | 35,160 (-30%) |
| Total RAM Bits | 2,475,072 | 2,475,072 (same) | 2,475,072 (same) | 1,349,376 (-45%) |
| Transceiver Channels | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) |
| User I/O Pins | 232 | 232 (same) | 232 (same) | 232 (same) |
| Speed Grade | C3 (fastest) | C6 (slower) | I7 (industrial temp, slower) | C6 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
Key Differentiators
- Highest speed grade (C3) within the EP1AGX50 family (vs EP1AGX50CF484C6N)
- Commercial temperature range with full transceiver performance (vs EP1AGX50CF484I7N)
- Mid-density with full 12-transceiver count (vs EP1AGX35CF484C6N)
Design Notes
Estimated: The EP1AGX50CF484C3 has separate analog and digital supply rails. The 1.2V VCCINT (core) rail typically draws 800 mA to 1.5 A under full logic utilization; VCCA_PLL, VCCA_TX, and VCCA_RX each need isolated filtering from VCCINT to prevent PLL and SERDES jitter. Use a four-layer PCB with dedicated power planes, ferrite-bead-isolated analog supplies, and bulk + decoupling per the Arria GX hardware reference. Designers should budget 5-8W typical power consumption and provide thermal relief via thermal vias under the BGA thermal pad.
The 484-FBGA package uses a 1.0 mm ball pitch and requires multilayer PCB fabrication with microvia (laser-drilled) technology for breakout routing. Route all transceiver channels on the top layers with continuous ground reference and length-match within 0.127 mm per the Arria GX hardware reference. Maintain 100-ohm differential impedance for SERDES pairs and 50-ohm single-ended for clock signals. Place the configuration flash (EPCS16/EPCS64) within 2 cm of the FPGA DATA0/DCLK/ASDO/nCSO pins to avoid configuration timing failures.
Common pitfalls when designing with the EP1AGX50CF484C3 include: (1) failing to power-up VCCINT before VCCA_PLL - causes PLL lock failures and intermittent transceiver errors; (2) not terminating the REFCLK inputs with proper AC coupling - degrades SERDES jitter to the point of link failure at 3.125 Gbps; (3) using NRND lifecycle parts without securing last-time-buy inventory - leading to production line-down scenarios. Always validate bitstream generation in Quartus II v13.1 (final version with Arria GX support) before committing to production.
Compliance Information
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGA not intended for automotive functional safety). Lead-free (Pb-free) finish on C-grade and N-suffix parts. Conflict-mineral compliance maintained per Intel's supply chain policy.
