EP1AGX50DF1152I6N - Arria GX FPGA, 50K LE, 1152-BGA | Intel
MPN: EP1AGX50DF1152I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165.5 | $1,655.00 |
| 100 | $142 | $14,200.00 |
| 500 | $120.75 | $60,375.00 |
| 1,000 | $105 | $105,000.00 |
Drop-in alternatives for EP1AGX50DF1152I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX50DF1152I6N Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Family | Arria GX FPGA |
| Logic Elements (LE) | 50,160 |
| Total Memory Bits | 2,475,072 |
| Number of LABs/CLBs | 2,508 |
| User I/O Count | 514 |
| Package | 1152-BBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (Industrial, I6 speed grade) |
| Speed Grade | I6 |
| Process Technology | 90 nm |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Configuration Method | SRAM-based, volatile (AS/PS/JTAG) |
| Mounting Type | Surface Mount |
EP1AGX50DF1152I6N 1152-bbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX50DF1152I6N (1152-bbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF1152I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF1152I6N is suitable for 7 applications: Telecom Line Card Interface Bridging, Serial RapidIO Switch Fabric, HD-SDI Video Router and Embedder, Military/Aerospace Signal Processor, Industrial Imaging and Machine Vision, PCI Express Gen1 Endpoint Card, Wireless Baseband Modem.
Telecom Line Card Interface Bridging
The EP1AGX50DF1152I6N's integrated 3.125 Gbps transceivers and 514 user I/Os make it ideal for telecom line cards needing protocol bridging between backplane serial links and parallel framer/mapper ASICs. The 50,160 LEs and 2.475 Mbits of embedded memory handle HDLC framing, Ethernet MAC, and packet buffer functions in a single chip, replacing legacy ASIC+FPGA solutions. Place the device between the backplane SERDES lines and the network processor, using dedicated PCS/PMA blocks for each serial channel. Designers benefit from a single-chip BOM but should verify the I6 speed grade meets the timing budget for the chosen protocol.
Recommended
Serial RapidIO Switch Fabric
The EP1AGX50DF1152I6N supports Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps through its built-in transceivers, making it a flexible RapidIO endpoint or small switch fabric. With 50K LEs the device can implement a 4-port SRIO switch with local packet buffer memory in the 2.475 Mbit block RAMs. The industrial temperature grade (I6, -40C to +100C) supports outdoor or industrial cabinet installations. Use the soft RapidIO IP from Altera to handle logical-layer transactions and traffic management.
Recommended
HD-SDI Video Router and Embedder
The Arria GX family is widely used in broadcast video routers for embedding/de-embedding audio in HD-SDI serial streams at 1.485 Gbps, with the EP1AGX50DF1152I6N providing enough logic for 8-12 channel embedder cards. Its 514 I/Os handle SMPTE 259M/292M/424M video I/O alongside AES/EBU audio and GPI control. The dedicated transceiver CDR recovers the embedded clock, while soft logic implements audio shuffling, Dolby E, and metadata insertion. Larger routers use multiple EP1AGX50 parts with cross-point switching in the FPGA fabric.
Recommended
Military/Aerospace Signal Processor
The industrial temperature grade and high logic density of the EP1AGX50DF1152I6N suit defense electronics applications such as radar front-end processing, electronic warfare subsystems, and secure communications. With 50K LEs and embedded 18x18 multipliers, the device implements FFT pipelines, channelizers, and digital downconverters in a single chip. Designers targeting military temperature (-55C to +125C) should look at the EP1AGX50Q-prefix SMD part numbers. The 1152-BGA package meets the rugged packaging requirements of MIL-PRF-38535 qualified builds.
Recommended
Industrial Imaging and Machine Vision
The EP1AGX50DF1152I6N's combination of 514 user I/Os and built-in transceivers suits high-speed Camera Link, CoaXPress, or GigE Vision frame grabbers used in machine vision systems. The 50K LEs implement image preprocessing pipelines (filtering, thresholding, Bayer conversion) while the transceivers move pixel data at line-rate speeds to the host PC. Industrial temperature operation enables deployment in factory automation cells and outdoor machine vision installations. The volatile SRAM configuration loads at power-up from a parallel flash or EPCS serial configuration device.
Recommended
PCI Express Gen1 Endpoint Card
The EP1AGX50DF1152I6N supports PCI Express Gen1 x1, x4, and x8 endpoints through its built-in transceivers and hard PCIe IP block, with 50K LEs available for the application logic. A typical PCIe endpoint card uses the FPGA for DMA engines, protocol processing, and I/O expansion while the integrated PCIe block handles the link layer. This combination removes the need for an external PCIe PHY and PHY-to-FPGA bridge chip. Designers should verify the I6 timing grade meets PCIe Gen1 jitter and latency requirements for their use case.
Recommended
Wireless Baseband Modem
The EP1AGX50DF1152I6N's 18x18 hardware multipliers and 2.475 Mbit of embedded memory implement PHY-layer baseband processing for small-cell wireless base stations, including turbo decoders, FFT/IFFT blocks, and channel estimation. The 3.125 Gbps transceivers connect to RF front-end ADCs/DACs via CPRI or OBSAI digital interfaces. With 50K LEs, a single FPGA can serve a 2x2 MIMO LTE femtocell PHY. Industrial temperature operation suits outdoor small-cell deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF1152I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF1152I5N | EP1AGX50DF1152I4N | EP1AGX50DF1152C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FineLine BGA) | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same |
| Logic Elements | 50,160 LE | 50,160 LE (identical) | 50,160 LE (identical) | 50,160 LE (identical) |
| Speed Grade | I6 (industrial) | I5 (industrial, faster) | I4 (industrial, fastest) | C6 (commercial, 0C to +85C) |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | 0C to +85C |
| User I/O | 514 | 514 (identical) | 514 (identical) | 514 (identical) |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD) | 185.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-range Arria GX with 50K LE and built-in 3.125 Gbps transceivers (vs EP1SGX40DF1020C6)
- Industrial temperature grade with 1152-ball BGA (vs EP1AGX50CF484I6N)
- I6 speed grade offers lowest cost among industrial Arria GX 1152-BGA options (vs EP1AGX50DF1152I5N)
Design Notes
Estimated: The 1152-FineLine BGA package dissipates up to ~8W typical for a 50K-LE Arria GX at full utilization. Provide a thermal pad land pattern with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to a continuous copper inner plane. Without thermal vias, junction temperature may exceed 100C ambient ratings. Use the Altera PowerPlay early power estimator in Quartus II before final layout to size the heatsink or forced-air cooling.
Route all high-speed transceiver differential pairs with 100 ohm differential impedance, length matching within 150 mils, and continuous reference plane on layer 2. Use 8 mil trace width with 6 mil spacing on a 4-layer 1 oz board to hit 100 ohm differential. Minimize the number of vias on each RX/TX pair - no more than 2 vias total. Place AC coupling capacitors (0.1 uF) close to the transmitter output pins.
Estimated: EP1AGX50DF1152I6N requires VCCINT (1.2V core for Arria GX 90 nm), VCCPD (3.3V pre-driver), VCCIO (1.5V/1.8V/2.5V/3.3V per bank), and VCCA_PLL (1.2V analog). Place at least 4 decoupling capacitors per supply pin (0.1 uF + 0.01 uF + 10 uF bulk + 220 uF bulk). Use a Ferrite bead on the PLL analog supply to isolate from digital switching noise. Power sequencing requires VCCINT before VCCIO with monotonic rise.
The EP1AGX50DF1152I6N is SRAM-based and volatile - it must reload configuration at every power-up. Use a serial EPCS16 or EPCS64 configuration flash with AS (active serial) mode for low-pin-count boot. For fastest boot use parallel x16 flash with PS (passive serial) or FPP (fast passive parallel). The CONF_DONE pin must be pulled high via 10K resistor to VCCPD, and nSTATUS pulled to 1K pull-up. JTAG header (10-pin or 20-pin Altera format) required for in-system programming.
Obsolescence risk: this part is obsolete as of 2026-09-06 with no authorized franchised stock. Before committing a new design, verify last-time-buy availability from independent distributors and authenticate each shipment (X-ray decapsulation, lot-trace, country-of-origin review). For new designs, evaluate migration paths to Arria 10 (10AX115N3F40I2SG) or Cyclone 10 GX, which require a complete PCB redesign and firmware port to Quartus Prime Pro.
Compliance Information
RoHS and lead-free status not explicitly confirmed in verified distributor data as of 2026-09-06. Request compliance documentation from distributor before volume orders. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified part.
