EP1AGX50DF1152I5N - Arria GX FPGA 50K LE | Altera | 1152-BBGA
MPN: EP1AGX50DF1152I5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $232.4 | $23,240.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
Drop-in alternatives for EP1AGX50DF1152I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF1152C6N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP1AGX50DF1152I6N
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP1AGX50DF1152C5N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX50DF1152C4N
✅ Drop-In✓ In Stock
$156.8 / Unit
View Datasheet →EP1AGX50DF1152I4N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EP1AGX50DF1152
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX50DF1152I5N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 50160 |
| Logic Array Blocks (LABs) | 2508 |
| Embedded Memory | 2475072 bits (approximately 2420 Kbit) |
| Total Memory Bits | 2475072 |
| Number of I/O | 514 |
| Transceiver Data Rate | 3.125 Gbps |
| Supply Voltage Core | 1.2 V |
| Package | 1152-BBGA (FineLine BGA, flip-chip) |
| Package Code | F1152 |
| Operating Temperature | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Speed Grade | 5 |
| Configuration Method | SRAM, JTAG, Passive Serial, Fast Passive Parallel |
| RoHS Status | Compliant (lead-free) |
| Mounting Type | Surface Mount |
EP1AGX50DF1152I5N f1152 Pin Configuration Guide
Complete pinout information for EP1AGX50DF1152I5N (f1152 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF1152I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF1152I5N is suitable for 6 applications: Telecom Line Card Aggregation, Industrial Video Processing, Military/Aerospace Signal Processing, PCIe Gen1 Endpoint Card, FPGA-Based Protocol Offload Engine, Test & Measurement Instrumentation.
Telecom Line Card Aggregation
The EP1AGX50DF1152I5N fits telecom line-card aggregation designs because it integrates 3.125 Gbps transceivers that map directly to backplane SERDES links without external PHY silicon. The 50,160 logic elements and 2,475 Kbit of embedded memory support packet classification, queue management, and traffic shaping for OC-48/STM-16 multi-port aggregation. Compared with a discrete FPGA + PHY architecture, the integrated transceivers reduce BOM cost by 25-40% and shrink the design footprint by approximately 30% on the line card PCB.
Recommended
Industrial Video Processing
The EP1AGX50DF1152I5N suits industrial video processing designs such as broadcast routers, multi-channel SDI switches, and machine-vision frame grabbers. Its 3.125 Gbps transceivers handle SD-SDI, HD-SDI, and 3G-SDI serial video streams directly, while 514 user I/O pins connect to parallel camera-link interfaces and HDMI/DVI bridges. The industrial temperature grade (-40C to +100C) allows deployment in factory-floor equipment and outdoor broadcast installations where ambient temperatures exceed commercial ranges.
Recommended
Military/Aerospace Signal Processing
The EP1AGX50DF1152I5N is qualified for military and aerospace signal processing platforms that require industrial-temperature-grade components and deterministic latency. Its 50,160 logic elements support radar pulse compression, electronic-warfare channelization, and Software Defined Radio (SDR) baseband processing where the 3.125 Gbps transceivers interface with RF ADC/DAC digital data links. The Altera Arria GX architecture is well-documented in defense reference designs, and the part is widely available through defense-grade component suppliers.
Recommended
PCIe Gen1 Endpoint Card
The EP1AGX50DF1152I5N works well as a PCIe Gen1 endpoint FPGA card because its 3.125 Gbps transceivers include a hardened PCIe PHY supporting x1, x4, and x8 lane configurations. Designers implement protocol layers (transaction layer, data link layer) in fabric using the Altera PCIe IP core, while the 50K logic elements and 514 I/O pins support downstream interface logic such as DDR2/3 controller, DMA engines, and proprietary I/O expansion. Industrial temperature grade allows deployment in server rooms with constrained cooling.
Recommended
FPGA-Based Protocol Offload Engine
The EP1AGX50DF1152I5N serves as a protocol offload engine for industrial networks that need hardware-accelerated parsing and forwarding of Serial RapidIO, Ethernet, or proprietary serial protocols. Its 50K logic elements handle full protocol stacks while the integrated transceivers eliminate external PHY cost. The 2,475 Kbit of embedded memory buffers packets between processing stages, and the 514 user I/O pins connect to host CPUs via parallel buses or high-speed serial links.
Recommended
Test & Measurement Instrumentation
The EP1AGX50DF1152I5N suits test and measurement instruments such as logic analyzers, protocol analyzers, and high-speed digitizers that need flexible parallel and serial I/O combined with real-time DSP processing. Its 514 user I/O pins capture parallel data buses up to 32 bits wide at hundreds of MHz, while the 3.125 Gbps transceivers acquire serial protocol data with deep on-chip memory for trace buffering. The DSP blocks accelerate FFT, FIR filtering, and modulation analysis in real time.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF1152I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF1152C6N | EP1AGX50DF1152I6N | EP1AGX50DF1152C5N | EP1AGX50DF1152I4N | EP1AGX50DF1152C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA (F1152) | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same |
| Logic Elements | 50160 | 50160 | 50160 | 50160 | 50160 | 50160 |
| Logic Array Blocks | 2508 | 2508 | 2508 | 2508 | 2508 | 2508 |
| Embedded Memory | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits |
| User I/O | 514 | 514 | 514 | 514 | 514 | 514 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 5 | 6 (faster) | 6 (faster) | 5 (same) | 4 (slower) | 4 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade with -40C to +100C support (vs EP1AGX50DF1152C6N)
- Higher Fmax timing margin than speed grade 4 variants (vs EP1AGX50DF1152I4N)
- Large 1152-ball BGA delivers 514 user I/O without multiplexing (vs EP1AGX50CF484I6N (F484 BGA))
- Balanced performance-cost option versus faster speed grades (vs EP1AGX50DF1152I6N)
Design Notes
The EP1AGX50DF1152I5N dissipates approximately 5-8 W under typical industrial workloads with transceivers active. The F1152 FineLine BGA exposes a large thermal die-attach pad on the bottom side, which must be soldered to a PCB thermal plane with multiple thermal vias to the inner copper layers. Per the Arria GX datasheet thermal management section, the F1152 package without airflow requires at least 4 layer PCB stack-up with a continuous ground/thermal pour; designers targeting continuous 100C ambient should specify industrial heatsink attachment.
The 1152-ball FineLine BGA uses a 1.0 mm pitch, requiring HDI PCB technology with laser-drilled microvias or via-in-pad construction for the inner rows. Per Altera Arria GX hardware design guidelines, escape routing from the inner rows is impossible without microvias on a 6-layer board; 8-10 layer stack-up is recommended. Decoupling capacitors must be placed within 50 mils of every power pin pair, with a bulk 470 uF tantalum or polymer capacitor near the device. Differential transceiver pairs require 100 ohm differential impedance with intra-pair length matching under 5 mil.
A common pitfall when designing with the EP1AGX50DF1152I5N is the configuration mode selection: this part supports JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), and Active Serial (AS) modes via dedicated configuration pins. Per the Arria GX configuration handbook, failing to properly strap the MSEL pins at boot leaves the device in an undefined state and can cause intermittent boot failures. Another frequent issue is leaving unused transceiver channels floating - they must be tied to VCCR_PC or VCCE_PC through the recommended bias network or they will leak and degrade signal integrity on adjacent active channels.
Compliance Information
RoHS compliant per Altera/Intel environmental statement; F1152 BGA uses lead-free solder balls (SAC305/SAC405 alloy). AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in available data.
