EP1AGX60CF484I8N - Arria GX FPGA, 60K LE, 484-BGA | Altera
MPN: EP1AGX60CF484I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1545 | $154,500.00 |
| 500 | $1410 | $705,000.00 |
Drop-in alternatives for EP1AGX60CF484I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX60CF484I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$218.75 / Unit
View Datasheet →EP1AGX60CF484I6N
✅ Drop-In✓ In Stock
$485.25 / Unit
View Datasheet →EP1AGX60CF484C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP1AGX60CF484C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185 / Unit
View Datasheet →EP1AGX60CF484C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$294.4 / Unit
View Datasheet →EP1AGX60CF484I8N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory (bits) | 2,528,640 |
| User I/O | 229 |
| Package | 484-ball FineLine BGA (FBGA-484) |
| Mounting Type | Surface Mount |
| Speed Grade | -8 (fastest in Arria GX) |
| Temperature Grade | Industrial (-40C to +100C case) |
| RoHS Status | Compliant (lead-free) |
| Process Technology | 90 nm |
| Design Toolchain | Altera Quartus II |
| Lead-Free | Yes (N suffix) |
EP1AGX60CF484I8N 484-ball fineline bga (fbga-484) Pin Configuration Guide
Complete pinout information for EP1AGX60CF484I8N (484-ball fineline bga (fbga-484) package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60CF484I8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60CF484I8N is suitable for 6 applications: Telecom Backhaul / SONET-SDH Aggregation, Broadcast Video Processing / SDI Bridging, Military / Aerospace Signal Processing, Test and Measurement Instrumentation, Industrial Control / Machine Vision, Medical Imaging / Ultrasound Beamforming.
Telecom Backhaul / SONET-SDH Aggregation
The EP1AGX60CF484I8N's 60,100 logic elements and embedded multi-gigabit transceivers make it well-suited for telecom backhaul designs that aggregate multiple SONET/SDH or OTN optical links. The Arria GX transceiver macro provides 3.125 Gbps operation with built-in clock-data recovery and 8B/10B encoding, eliminating an external PHY. Industrial temperature grade allows deployment in outdoor cabinets. Place between the optical SFP modules and the packet processor; expect roughly 25-30% logic utilization for a typical 4-channel aggregation design.
Recommended
Broadcast Video Processing / SDI Bridging
The Arria GX EP1AGX60CF484I8N handles HD-SDI and 3G-SDI bridging through its high-speed serial I/O and rich DSP blocks, supporting de-interlacing, scaling, and frame-rate conversion in broadcast studio equipment. 60,100 LEs accommodate a multi-channel SDI pipeline plus on-chip frame buffers. The 484-BGA exposes 229 user I/Os, sufficient for parallel video buses and audio embedding. Industrial temperature range is valuable in fan-less broadcast enclosures. Expect a typical design to use 70-80% of logic elements for a 4-channel 3G-SDI processor.
Recommended
Military / Aerospace Signal Processing
The EP1AGX60CF484I8N with industrial temperature range and rugged BGA package fits defense signal-processing applications such as radar front-end preprocessing, software-defined radio, and electronic-warfare subsystems. The Arria GX DSP blocks accelerate FFT and pulse-Doppler operations while transceivers drive fiber-optic links to downstream signal recorders. Conformal coating and underfilled BGA are typical for MIL applications. Plan for thermal management because sealed enclosures trap heat; budget for 8-12W typical dissipation in a 60% utilized design.
Recommended
Test and Measurement Instrumentation
The EP1AGX60CF484I8N suits high-end oscilloscopes, logic analyzers, and protocol testers that require deep acquisition memory and parallel DSP. The 2,528,640 bits of embedded RAM serve as sample memory while 229 user I/Os drive parallel ADC/DAC buses at hundreds of MHz. Transceivers interface to external trigger systems. Quartus II allows rapid design iteration. The industrial temp grade supports lab and field-deployed instruments. Plan a 6-8 layer PCB with matched-length differential pairs for the ADC interface.
Recommended
Industrial Control / Machine Vision
The Arria GX EP1AGX60CF484I8N drives multi-camera machine-vision pipelines with hardware-accelerated image preprocessing, GigE Vision aggregation, and deterministic real-time control logic. 60,100 LEs fit a 4-camera pre-processor plus EtherCAT or PROFINET master. The industrial temperature range is mandatory for factory-floor deployment. The 484-BGA fan-out requires 4-6 layer PCB with 0.1 mm microvias. Typical utilization: 50-60% logic, 30% DSP blocks for Sobel and threshold filters.
Recommended
Medical Imaging / Ultrasound Beamforming
The EP1AGX60CF484I8N supports ultrasound beamforming and CT/MRI image reconstruction through its parallel DSP blocks and embedded transceivers. Beamforming a 128-channel probe requires tight time-domain synchronization; the Arria GX fabric meets this with deterministic routing. Industrial temp grade allows portable cart-based systems. Plan for noise-isolated analog supplies, since the FPGA's switching noise couples into sensitive receive paths. Typical power: 6-10W at 60% utilization with full DSP activity.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60CF484I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60CF484I7N | EP1AGX60CF484I6N | EP1AGX60CF484C8N | EP1AGX60CF484C7N | EP1AGX60CF484C6N |
|---|---|---|---|---|---|---|
| Package | 484-ball FineLine BGA (FBGA-484) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 |
| Embedded RAM (bits) | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 |
| User I/O | 229 | 229 | 229 | 229 | 229 | 229 |
| Speed Grade | -8 (fastest) | -7 (about 15% slower Fmax) | -6 (about 25% slower Fmax) | -8 (same Fmax) | -7 | -6 |
| Temperature Grade | Industrial (-40C to +100C case) | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Approx. Unit Price (qty 1) | USD 1850 (as of 2026-09-06) | USD 1700 (est.) | USD 1550 (est.) | USD 1700 (est.) | USD 1500 (est.) | USD 1400 (est.) |
Key Differentiators
- Highest Fmax in the Arria GX family (vs EP1AGX60CF484I7N)
- Industrial temperature range (vs EP1AGX60CF484C8N)
- Largest logic and memory in the Arria GX family (vs EP1AGX50CF484I6N)
Design Notes
The 484-ball FineLine BGA uses a 1.0 mm ball pitch with a 22x22 ball perimeter array. A 4-layer PCB with 0.1 mm laser-drilled microvias is the minimum recommended stack-up; 6-8 layers ease transceiver impedance control. Use a full ground plane under the BGA and stitched GND vias around the perimeter to control return paths for the multi-gigabit transceivers. Decoupling: place 0.1 uF MLCCs within 100 mils of every Vccint and Vccio ball group, plus bulk 10 uF tantalum caps at each power rail entry point.
Estimated at 60% logic utilization and 50% transceiver utilization, the EP1AGX60CF484I8N dissipates 6-10W on the industrial junction envelope. With the FBGA-484 thermal pad, theta_JA is roughly 12 C/W on a 6-layer PCB with thermal vias, so a 8W load yields a junction rise of about 96C above ambient. For sealed enclosures, design with 2 m/s forced airflow or a small heatsink stamped to the package lid. Keep thermocouple access on the lid for production screening.
The Arria GX transceivers require 100-ohm differential routing on the top microvia layer with reference ground on layer 2; keep transceiver traces length-matched to within 5 mils intra-pair and 50 mils inter-pair. AC-coupling capacitors of 100 nF must be placed within 250 mils of the transmitter ball. Avoid routing any other high-speed signal across the transceiver area, and stitch GND vias every lambda/4 along the differential pair edges to suppress common-mode resonances.
Do not mix Vccio bank voltages - each bank supports either 1.5V/1.8V/2.5V/3.3V but configuration must be programmed before I/O operation begins via the MSEL pins. Do not omit the configuration flash or JTAG header - in-field updates require a programming path. Do not exceed the in-rush current spec during power-up; sequence Vccint before Vccio to avoid partial-configuration latch-up.
Compliance Information
RoHS compliance and lead-free packaging indicated by the 'N' suffix in the part number per Altera/Intel FPGA product marking convention. AEC-Q100 is not applicable for FPGAs; this is not an automotive-qualified part - refer to the device handbook for qualification reports.
