EP1AGX60CF484I7N - 60K LE Arria GX FPGA 484-BGA | Altera
MPN: EP1AGX60CF484I7N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $251 | $25,100.00 |
| 500 | $234.5 | $117,250.00 |
| 1,000 | $218.75 | $218,750.00 |
Drop-in alternatives for EP1AGX60CF484I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1AGX60CF484C7N
β Drop-Inβ In Stock
$185 / Unit
View Datasheet βEP1AGX60CF484C8N
β Drop-Inβ In Stock
$195 / Unit
View Datasheet βEP1AGX60CF484C6N
β Drop-Inβ In Stock
$294.4 / Unit
View Datasheet βEP1AGX60CF484I6N
β Drop-Inβ In Stock
$485.25 / Unit
View Datasheet βEP1AGX50CF484I6N
β Drop-Inβ In Stock
$504.158 / Unit
View Datasheet βEP1AGX50CF484C6N
β Drop-Inβ In Stock
$198 / Unit
View Datasheet βEP1AGX60CF484I7N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory | 2,528,640 bits |
| Maximum User I/O Pins | 229 |
| Transceiver Channels | Up to 12 high-speed SERDES channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PLLs | 4 |
| Package | 484-ball FineLine BGA (1.0 mm pitch) |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| Core Voltage | 1.2 V typical |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X, LVTTL, LVCMOS |
| Configuration Modes | Passive Serial, JTAG, Fast Passive Parallel |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FineLine BGA) |
EP1AGX60CF484I7N Pin Configuration
| Pin A1 | I/O β General-purpose user I/O (bank dependent) |
| Pin A2 | I/O β General-purpose user I/O |
| Pin B1 | I/O β General-purpose user I/O |
| Pin B2 | GND β Ground reference |
| Pin C1 | VCCIO β I/O bank supply voltage |
| Pin C2 | VCC β Core supply voltage (1.2 V typical) |
| Pin D1 | I/O β General-purpose user I/O |
| Pin D2 | I/O β General-purpose user I/O |
| Pin REFCLK0_P | REFCLK0_P β Transceiver reference clock positive (differential) |
| Pin REFCLK0_N | REFCLK0_N β Transceiver reference clock negative (differential) |
| Pin TX_CH0_P | TX_CH0_P β Transceiver channel 0 transmit positive |
| Pin TX_CH0_N | TX_CH0_N β Transceiver channel 0 transmit negative |
| Pin RX_CH0_P | RX_CH0_P β Transceiver channel 0 receive positive |
| Pin RX_CH0_N | RX_CH0_N β Transceiver channel 0 receive negative |
| Pin nCONFIG | nCONFIG β Configuration control (active low) |
| Pin nSTATUS | nSTATUS β Configuration status (active low) |
| Pin TCK | TCK β JTAG test clock |
| Pin TMS | TMS β JTAG test mode select |
| Pin TDI | TDI β JTAG test data in |
| Pin TDO | TDO β JTAG test data out |
| Pin MSEL0 | MSEL0 β Configuration mode select 0 |
| Pin MSEL1 | MSEL1 β Configuration mode select 1 |
| Pin MSEL2 | MSEL2 β Configuration mode select 2 |
| Pin DATA0 | DATA0 β Configuration data input 0 |
| Pin DCLK | DCLK β Configuration clock |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60CF484I7N is suitable for 6 applications: Telecom Line Card / Serial Protocol Bridge, Video Broadcast / Studio Signal Processing, Test and Measurement Instrumentation, Industrial Control / Motion Controller, Military/Aerospace Signal Processing, Medical Imaging / Ultrasound Beamformer.
Telecom Line Card / Serial Protocol Bridge
The EP1AGX60CF484I7N's integrated 12-channel 3.125 Gbps transceiver array, combined with 60,100 logic elements and 2.5 Mbit embedded memory, makes it ideal for telecom line cards that need to bridge between backplane SERDES, tributary interfaces, and legacy parallel buses. Designers can implement XAUI, Serial RapidIO, PCI Express Gen1, or custom 8b/10b protocols directly in the FPGA fabric without external PHY chips, reducing board area and BOM cost. The industrial -40C to +100C temperature grade meets NEBS-style outdoor cabinet requirements, and Quartus II's built-in transceiver toolkit provides eye-diagram pre-emphasis and equalization tuning. Use case: bridging a backplane XAUI link to four SFP+ ports while aggregating Ethernet traffic in the FPGA logic. Companion parts: clock synthesizer, DDR2 SDRAM, flash for configuration.
Recommended
Video Broadcast / Studio Signal Processing
Studio video broadcast equipment requires multi-channel SDI/HD-SDI/3G-SDI handling, frame buffering, and audio embedding - a perfect match for the EP1AGX60CF484I7N. The 12 transceiver channels can be configured as SDI transceivers with external cable equalizers, while the 2.5 Mbit embedded memory provides line-store and frame-store buffers for up/down/cross-conversion. The 240 18x18 multipliers enable real-time proc-amp, color-space conversion, and scaling filters, all running deterministically thanks to the FPGA's hard PLLs and global clock network. Industrial temperature grade supports fan-less broadcast racks and outdoor event production trucks. Pair with SDRAM for frame buffering and an external SDI cable equalizer to complete the receive path.
Recommended
Test and Measurement Instrumentation
High-speed logic analyzers, protocol analyzers, and digitizers benefit from the EP1AGX60CF484I7N's combination of 60,100 logic elements for state-machine and trigger logic, 2.5 Mbit embedded memory for trace buffering, and 3.125 Gbps transceivers for protocol capture. The industrial temperature rating supports bench and field-deployed test equipment. Engineers typically pair the FPGA with high-speed ADCs on LVDS or DDR interfaces, using the FPGA's PLLs to generate the sampling clock and the embedded multipliers for FIR decimation filters. The 229 user I/O pins provide ample connectivity for front-panel connectors and parallel data acquisition buses, all within a single 484-BGA package that simplifies mechanical integration into modular instruments.
Recommended
Industrial Control / Motion Controller
Industrial motion controllers and high-end PLCs leverage the EP1AGX60CF484I7N for deterministic multi-axis servo loop closure. The 240 DSP multipliers implement PID controllers, state-space observers, and FFT-based vibration analysis at microsecond loop rates, while the 60,100 LEs run the EtherCAT, PROFINET, or SERCOS III slave stack. The transceivers can interface to industrial Ethernet PHYs or to SERCOS III fiber-optic rings directly. The industrial -40C to +100C temperature range suits factory-floor cabinets, and Quartus II's Safety Critical design flow supports IEC 61508 SIL-2/3 documentation when paired with Altera's functional-safety data package. Use the 2.5 Mbit embedded memory for axis trajectory tables.
Recommended
Military/Aerospace Signal Processing
Defense and aerospace platforms that have not yet migrated to the latest space-grade FPGAs continue to use the EP1AGX60CF484I7N for radar, EW, and SIGINT subsystems. The integrated transceivers enable direct conversion IF sampling, while 60,100 logic elements implement pulse compression, MTI filtering, and direction-finding algorithms. Industrial temperature rating supports most ground-mobile and naval environments; aerospace flight applications typically require a higher-grade screened part, so consult Altera/Intel's military product listing. The 484-BGA package is well-suited to ruggedized modules with thermal management via cold plates. Pair with high-speed ADC/DAC companion parts and a rad-tolerant configuration flash.
Recommended
Medical Imaging / Ultrasound Beamformer
Ultrasound beamformers and other medical imaging systems use the EP1AGX60CF484I7N for channel summation, beam steering, and image reconstruction. The 240 DSP multipliers compute complex multiplications for phase rotation per channel, while the 2.5 Mbit embedded memory buffers raw RF channel data before summation. The transceivers connect to high-channel-count ADC front-ends via LVDS or serial JESD204-style links. The industrial temperature grade suits cart-based ultrasound systems, and the deterministic FPGA fabric meets medical timing budgets for real-time imaging. Pair with a companion processor running the user interface and image post-processing, and with high-speed ADC parts for the analog front-end.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60CF484I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60CF484C7N | EP1AGX60CF484I6N | EP1AGX50CF484I6N |
|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 484-ball FineLine BGA (1.0 mm pitch) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Logic Elements | 60,100 | 60,100 | 60,100 | 50,600 |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,303,616 bits |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Temperature Grade | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C7) | Industrial -40C to +100C (I6) | Industrial -40C to +100C (I6) |
| Speed Grade | I7 | C7 | I6 (faster) | I6 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Industry-grade (I7) temperature bin (vs EP1AGX60CF484C7N)
- Faster speed grade (I7 to I6 down-bin) (vs EP1AGX60CF484I6N)
- Full 60,100 LE density vs 50,600 LE down-bin (vs EP1AGX50CF484I6N)
Design Notes
The 484-ball FineLine BGA at 1.0 mm pitch requires microvia-compatible PCB stack-up (e.g. 4-6-4 build-up with 1 mil dielectric). Use via-in-pad for inner balls to escape cleanly, and follow Altera's recommended footprint and thermal pad pattern from the Arria GX handbook. Provide a continuous ground plane under the BGA for both reference and thermal dissipation; pair with thermal vias under the center thermal balls to the inner ground plane.
Route the multi-gigabit transceiver channels as 100-ohm differential pairs with controlled impedance (typically 5 mil trace width on a 1.2 mil dielectric for the top microvia layer). Keep transceiver reference clocks (REFCLK) within 50 mils of the dedicated clock input pins and isolate them from switching signals. Use the Quartus II transceiver toolkit to tune pre-emphasis, equalization, and VOD settings per channel after PCB fab.
Estimated: a fully utilized Arria GX EP1AGX60 with all 12 transceivers active and ~80% logic utilization draws approximately 5-8 W from the 1.2 V core rail, plus I/O current on the 2.5 V/3.3 V rails. Provide a low-ESR decoupling network of 0.1 uF and 10 uF ceramic capacitors on every VCC pin within 100 mils of the ball, plus bulk decoupling at the voltage regulator output. Run Quartus PowerPlay early in the design cycle to confirm thermal budget before board layout.
Do not confuse the EP1AGX60 (Arria GX, 3.125 Gbps) with the EP1AGX60E (Arria II GX, 6.375 Gbps) - the latter is a different silicon die and uses different pinouts even in the same 484-FBGA package. Also avoid mixing EP1AGX (Arria GX) with EP2AGX (Arria II GX) or EP3C/EP4C (Cyclone III/IV) parts, as I/O standards and configuration schemes differ. Verify the silicon revision in Quartus II before committing layout.
The FineLine BGA relies on PCB copper and airflow for cooling, since the package itself has no integrated heatsink. For continuous operation near full transceiver and logic utilization, design for at least 1 oz copper on outer layers with a thermal via array (0.3 mm pitch) under the central ground balls. At ambient temperatures above 60C, consider forced-air cooling or a heat-spreader lid to keep junction below 100C for the I7 grade.
Compliance Information
Lead-free per N suffix in MPN. RoHS compliance declared on Altera/Intel product page. Not AEC-Q100 qualified (FPGA, not automotive-grade IC). For halogen-free status consult the specific MDDS document for the date code.
