EP1AGX60EF1152C6N - Arria GX FPGA, 60K LE, 3.125Gbps | Intel
MPN: EP1AGX60EF1152C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for EP1AGX60EF1152C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX60EF1152C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX60EF1152I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$142 / Unit
View Datasheet →EP1AGX60EF1152I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX50DF1152C6N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP1AGX50DF1152I6N
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View Datasheet →EP1AGX60EF1152C6N Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Family | Arria GX |
| Logic Elements (LE) | 60,100 |
| Total RAM Bits | 2,528,640 |
| User I/O Count | 514 |
| Number of Transceivers | 4 channels |
| Max Transceiver Data Rate | 3.125 Gbps |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Operating Temperature | 0C to +85C (Commercial) |
| Package Type | 1152-ball FC-FBGA |
| Speed Grade | 6 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Altera/Intel product page) |
EP1AGX60EF1152C6N 1152-ball fc-fbga Pin Configuration Guide
Complete pinout information for EP1AGX60EF1152C6N (1152-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60EF1152C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60EF1152C6N is suitable for 6 applications: Telecom Backplane Interface, PCI Express Endpoint Card, Broadcast Video Processing, Industrial Imaging System, Protocol Bridge (Custom Serial to Parallel), Test and Measurement Instrumentation.
Telecom Backplane Interface
The EP1AGX60EF1152C6N's 3.125 Gbps transceivers and 60,100 logic elements make it well-suited for telecom backplane applications requiring serial link aggregation. Placed as a framer/serializer between line cards and a switch fabric, the FPGA can implement up to four multi-gigabit links for Serial RapidIO or proprietary backplane protocols. The 2,528,640 RAM bits provide packet buffering, while 514 user I/O allow direct interface to parallel bus backplanes. Engineers typically pair the EP1AGX60 with external clock-cleaning PLLs and SFP/SFP+ optical modules; PCB trace length matching within ±150 mil across the transceiver pairs is required to maintain signal integrity at 3.125 Gbps.
Recommended
PCI Express Endpoint Card
The Arria GX family integrates a hard PCI Express IP core supporting x1, x4, and x8 Gen1 configurations, making the EP1AGX60EF1152C6N ideal for PCIe endpoint cards such as data acquisition boards, DSP accelerators, or industrial controllers. The hard PCIe block saves logic elements and provides proven compliance with the PCI Express Base Specification 1.1. With 60K LE remaining after PCIe implementation, designers can implement application logic, DMA engines, or signal processing pipelines. The 1152-ball FC-FBGA package exposes the PCIe reference clock input and dedicated transceiver channels required for x4 Gen1 operation.
Recommended
Broadcast Video Processing
The combination of 60K logic elements, 2,528,640 RAM bits, and four 3.125 Gbps transceivers makes the EP1AGX60EF1152C6N a strong fit for broadcast video processing applications such as HD-SDI embedders/de-embedders, video format converters, and multiviewers. The transceivers can directly receive SMPTE 424M (3G-SDI) and SMPTE 292M (HD-SDI) signals, while the fabric handles color space conversion, scaling, and overlay generation. The 514 user I/O accommodate parallel video bus interfaces (BT.1120, DVI, HDMI bridges), and the M9K memory blocks implement line buffers and frame stores for video pipelines.
Recommended
Industrial Imaging System
The EP1AGX60EF1152C6N's commercial temperature grade and abundant logic resources suit industrial imaging systems including machine vision cameras, frame grabbers, and image-processing pipelines. Designers can implement Camera Link, CoaXPress, or GigE Vision interfaces using the multi-gigabit transceivers, then process pixel data through custom DSP pipelines in the fabric. With 60K LE available, complex algorithms such as Bayer demosaicing, color correction, and JPEG/H.264 encoding fit within the device. The 1152-ball FC-FBGA package provides 514 user I/O for parallel sensor interfaces and external memory (DDR2/QDRII) connections.
Recommended
Protocol Bridge (Custom Serial to Parallel)
The EP1AGX60EF1152C6N excels at protocol bridging between serial interfaces (Serial RapidIO, Aurora, custom LVDS) and parallel buses (PCI, local bus, memory-mapped I/O). The four transceivers handle the serial side at up to 3.125 Gbps, while the 514 user I/O and on-chip RAM provide ample resources for protocol state machines, packet buffering, and DMA. Engineers commonly use the EP1AGX60 to bridge legacy parallel interfaces to modern serial backplanes, or to aggregate multiple slower links into a single high-speed uplink. Quartus II IP catalog provides Aurora and Serial RapidIO cores ready for instantiation.
Recommended
Test and Measurement Instrumentation
Test equipment manufacturers leverage the EP1AGX60EF1152C6N's 3.125 Gbps transceivers, 60K logic elements, and 2,528,640 RAM bits to build protocol analyzers, logic analyzers, and bit-error-rate testers. The FPGA ingests high-speed serial streams, decodes protocols in real time, and buffers data into external memory for analysis. The 514 user I/O allow direct connection to test probes and front-panel displays, while the transceivers handle serial data capture at rates unattainable with parallel-only FPGAs. Industrial temperature variants (I6N/I7N) extend the part into lab and field-test environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60EF1152C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60EF1152C7N | EP1AGX60EF1152I6N | EP1AGX60EF1152I7N | EP1AGX50DF1152C6N | EP1AGX50DF1152I6N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Arria II GX | Arria II GX |
| Logic Elements | 60,100 | 60,100 | 60,100 | 60,100 | 50,160 | 50,160 |
| Max Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 6.375 Gbps | 6.375 Gbps |
| User I/O | 514 | 514 | 514 | 514 | [DATA_NEEDED] | [DATA_NEEDED] |
| Total RAM Bits | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial | Industrial |
| Speed Grade | 6 | 7 | 6 | 7 | 6 | 6 |
Key Differentiators
- Higher logic density than Cyclone V alternatives while retaining the same 1152-ball FC-FBGA footprint (vs EP1AGX50DF1152C6N)
- Long-standing ecosystem support with mature Quartus II toolchain and IP library (vs Newer Arria 10 family)
- Combined PCI Express hard IP and 3.125 Gbps transceivers in a single device (vs EP1AGX35DF780C6N)
Design Notes
The 1152-ball FC-FBGA package requires at least a 6-layer PCB with 1.0 mm ball pitch and microvia-in-pad technology for fanout. According to Altera's package specifications, the FC-FBGA body is 35 x 35 mm with 1.0 mm pitch. Use 0.4 mm laser-drilled microvias, 0.2 mm line/space on inner layers, and a continuous ground plane beneath the package for controlled-impedance reference. Power islands should be split into core (1.2 V), I/O bank supplies, PLL analog, and transceiver supplies with ferrite-bead isolation.
Transceiver channels at 3.125 Gbps require controlled differential impedance of 100 ohms ±10% with intra-pair skew under 5 mil and inter-pair length matching within 150 mil. Use an FR-4 stackup with low-loss material (Df < 0.02 at 1 GHz) for the transceiver breakout region. Place AC-coupling capacitors (0.1 uF X7R) close to the transmit pins; for receiver channels, the capacitors must be within 1 cm of the FPGA pin. Reference Altera's AN 532: Transceiver Signal Integrity Guidelines for full layout rules.
Estimated: at typical utilization (60% LE, 100% transceivers at 3.125 Gbps), the EP1AGX60EF1152C6N dissipates approximately 8-12 W. The FC-FBGA package requires a thermal pad or heatsink attached directly to the die backside. Junction-to-ambient thermal resistance is approximately 8 C/W with a 100 CFM heatsink and 14 C/W without active airflow. For enclosed industrial cabinets, ensure chassis temperature does not exceed 70C to keep the junction under 100C at 12 W dissipation.
Compliance Information
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable (industrial/commercial grade only). Halogen-free status not stated in verified data - marked unknown.
