EP1C12F324C7 - Cyclone FPGA, 12,060 LEs, 324-BGA | Altera | Intel
MPN: EP1C12F324C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $67.1 | $67.10 |
| 10 | $60.39 | $603.90 |
| 100 | $53.68 | $5,368.00 |
| 500 | $46.97 | $23,485.00 |
| 1,000 | $40.26 | $40,260.00 |
Drop-in alternatives for EP1C12F324C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C12F324C7N
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View Datasheet →EP1C12F324C6N
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View Datasheet →EP1C12F324I7
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View Datasheet →EP1C12F324I7N
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View Datasheet →EP1C12F324C6AA
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View Datasheet →EP1C12F324C8N
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View Datasheet →EP1C12F324I7N
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View Datasheet →EP1C12F324C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone |
| Logic Elements (LEs) | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Total RAM Bits | 239,616 |
| Number of CLBs / LABs | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | 12,060 cells (Cyclone Family) |
| User I/Os | 249 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Operating Frequency (max) | 320.1 MHz |
| Number of PLLs | 2 |
| Package | 324-ball FineLine BGA (FBGA-324) |
| Package Dimensions | 19 x 19 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) |
| Configuration Mode | Passive Serial (PS) / Active Serial (AS) / JTAG |
EP1C12F324C7 Pin Configuration
| Pin A1 | IO — General-purpose user I/O (bank 1) |
| Pin A2 | IO — General-purpose user I/O (bank 1) |
| Pin B1 | IO — General-purpose user I/O (bank 1) |
| Pin B2 | IO — General-purpose user I/O (bank 1) |
| Pin C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin C2 | GND — Ground |
| Pin D1 | IO — General-purpose user I/O (bank 2) |
| Pin D2 | IO — General-purpose user I/O (bank 2) |
| Pin E1 | VCCINT — Core supply voltage (1.5 V) |
| Pin E2 | GND — Ground |
| Pin F1 | IO — General-purpose user I/O (bank 3) |
| Pin F2 | IO — General-purpose user I/O (bank 3) |
| Pin G1 | VCCIO3 — I/O bank 3 supply voltage |
| Pin G2 | TMS — JTAG test mode select |
| Pin H1 | TCK — JTAG test clock |
| Pin H2 | TDO — JTAG test data out |
| Pin J1 | TDI — JTAG test data in |
| Pin J2 | nCONFIG — Configuration control (active low) |
| Pin K1 | nSTATUS — Configuration status (active low) |
| Pin K2 | CONF_DONE — Configuration done indicator |
| Pin L1 | DCLK — Configuration clock (PS mode) |
| Pin L2 | DATA0 — Configuration data (PS mode) |
| Pin M1 | nCE — Chip enable (active low) |
| Pin M2 | nCEO — Chip enable out (for multi-device config) |
| Pin N1 | CLK0 — PLL clock input 0 |
| Pin N2 | CLK1 — PLL clock input 1 |
| Pin P1 | VCCA_PLL — PLL analog supply voltage |
| Pin P2 | GNDA_PLL — PLL analog ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F324C7 is suitable for 7 applications: Industrial Control and Factory Automation, Video Processing Bridge, Telecommunications Line-Card Glue Logic, Custom Audio Pipeline Processor, FPGA Educational Prototyping Platform, Test and Measurement Instrumentation, Consumer Electronics Custom Logic.
Industrial Control and Factory Automation
The EP1C12F324C7 fits industrial control applications because its 12,060 logic elements and 249 user I/Os provide enough capacity to implement multi-protocol glue logic, motor-control state machines, and HMI bridge interfaces in a single device. With 320 MHz internal frequency it handles real-time deterministic logic at typical PLC scan rates of a few kHz to MHz, well below the device's capability. Its 324-FBGA package supports dense PCB layouts common in factory-floor backplanes, and the four PLL outputs handle multiple clock domains required for isolated industrial Ethernet or fieldbus interfaces. Compared to a CPLD solution, the FPGA offers far more design flexibility and re-programmability, supporting field upgrades via JTAG without board removal.
Recommended
Video Processing Bridge
The EP1C12F324C7 suits video bridge applications because its 12,060 LEs can implement color-space conversion, deinterlacing, and frame-buffer arbitration logic for mid-resolution video streams. The 239,616 bits of embedded RAM (M4K blocks) provide line-buffer storage for several scanlines of standard-definition video, eliminating the need for external SRAM in many designs. Its 249 user I/Os comfortably handle parallel RGB, ITU-R BT.656, or LVDS video interfaces, while the two PLLs generate pixel clocks from incoming video timing references. Designers typically pair this FPGA with an external video DAC or HDMI transmitter, using the FPGA as the timing-and-format bridge between sensor/processor and display.
Recommended
Telecommunications Line-Card Glue Logic
The EP1C12F324C7 is well-suited for telecom line-card glue logic because 12,060 LEs provide ample capacity for TDM bus multiplexing, framer interfacing, and protocol-conversion state machines commonly found between PHY devices and network processors. The 1.5 V core supply and multi-voltage I/O standards (LVTTL, LVCMOS, SSTL) allow direct connection to legacy 3.3 V and 2.5 V telecom ASICs without level shifters. The two PLLs can derive multiple clock domains for E1/T1, IMA, or Ethernet PHYs from a single backplane clock reference. Its BGA-324 package also fits the high-density backplane cards typical in central-office equipment.
Recommended
Custom Audio Pipeline Processor
Audio engineers use the EP1C12F324C7 to build custom audio sample-rate converters, multi-channel mixers, and DSP pre-processing blocks because 12,060 LEs can host multiple parallel FIR filters and I2S/TDM channel multiplexers. The M4K memory blocks are sized appropriately for audio delay lines and small coefficient buffers. With 249 user I/Os, the device can interface multiple I2S, TDM, or S/PDIF streams simultaneously, making it useful in mixing consoles and AV receivers. Designers can update DSP coefficients in real time via JTAG or external SPI flash, supporting rapid tuning of filter responses without hardware changes.
Recommended
FPGA Educational Prototyping Platform
Universities and training organizations use the EP1C12F324C7 as a teaching platform because 12,060 LEs is large enough for student projects involving CPU cores, video controllers, and signal-processing pipelines, yet small enough to fit in a lab budget. The 324-BGA package supports breakout boards exposing GPIO, pushbuttons, LEDs, and common peripheral headers used in introductory courses. The mature Quartus II Web Edition toolchain (free of charge) supports the device fully, including ModelSim-Altera Starter Edition simulation, and extensive IP libraries. Its documented reference designs and educational lab manuals have been published for over two decades.
Recommended
Test and Measurement Instrumentation
Test and measurement designers use the EP1C12F324C7 for protocol-analyzer, logic-analyzer, and pattern-generator front ends because 12,060 LEs can implement multiple protocol decoders in parallel and the 249 user I/Os provide direct probing of high-pin-count buses. The two PLLs synthesize arbitrary reference clocks needed for jitter-injection and clock-recovery tests. With 239,616 bits of RAM, the device can buffer captured frames before transferring to host software over USB or Ethernet. Its commercial temperature range is sufficient for benchtop use, and the BGA package enables compact probe-head assemblies that sit close to the device under test.
Recommended
Consumer Electronics Custom Logic
Consumer products such as set-top boxes, gaming peripherals, and home appliances integrate the EP1C12F324C7 to add custom user-interface logic, LED-control drivers, and protocol glue between application processors and peripheral chips. Its 12,060 LEs handle multi-zone LED control, capacitive-touch decoding, and low-resolution video overlay without exhausting capacity. The 324-BGA package supports the miniaturized PCBs common in consumer devices, and the commercial temperature range covers indoor use. Because the part is NRND, new consumer designs should evaluate Cyclone IV or Cyclone 10 LP equivalents, but existing designs can continue to source the EP1C12F324C7 from distributor stock.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F324C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F324C7N | EP1C12F324I7 | EP1C12F324C6N | EP1C12F324I7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-324 (F324) 19x19 mm | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same |
| Logic Elements | 12,060 LEs | 12,060 LEs | 12,060 LEs | 12,060 LEs | 12,060 LEs |
| User I/Os | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | C7 (commercial) | C7 (commercial) | I7 (industrial) | C6 (slower) | I7 (industrial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Lead-Free Finish | Standard (non-Pb-free) | Lead-free (Pb-free) | Standard | Lead-free | Lead-free |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Lower-cost lead-free option available in identical footprint (vs EP1C12F324C7N)
- Industrial-temperature variant for harsh environments (vs EP1C12F324I7)
- Slower speed grade available for cost-sensitive designs (vs EP1C12F324C6N)
- Same-package option with combined industrial temp + lead-free (vs EP1C12F324I7N)
Design Notes
The EP1C12F324C7 requires a 1.5 V core supply (VCCINT) and separate VCCIO bank supplies (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V per bank) for I/O flexibility. Decoupling must include at least one 100 uF bulk capacitor near the package plus 0.1 uF and 0.01 uF ceramics on every VCCINT/VCCIO pin pair. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and decoupled separately from VCCINT to avoid jitter from digital noise coupling into the PLL. Estimated power consumption for a fully-utilized design is approximately 1-3 W depending on toggle rate and I/O activity; budget thermal management accordingly. The device does not have a heat-spreader, so adequate PCB copper pour is the primary cooling path.
The 324-ball FineLine BGA at 1.0 mm pitch requires PCB fabrication with 0.4 mm via-in-pad or dog-bone fanout, 4-6 layer stack-up with continuous GND planes under the BGA, and ENIG or OSP surface finish for reliable solder joints. Place the configuration ROM (EPCS4 or EPCS16) within 50 mm of the FPGA and route the DCLK/DATA0/nCONFIG/nSTATUS/CONF_DONE signals with matched lengths (within 25 mm) to avoid configuration failures. Bring out all four JTAG pins (TCK, TMS, TDI, TDO) plus GND to a 0.1 inch header for board-level programming. Power-rail sequencing is not strictly required but VCCINT should rise before or simultaneously with VCCIO for reliable cold-start configuration.
Common pitfalls when designing with the EP1C12F324C7 include: (1) forgetting the configuration ROM - the Cyclone FPGA is volatile and loses its bitstream on every power-down, so an EPCS device or external microcontroller is mandatory; (2) mis-assigning JTAG pin directionality - TCK and TMS are inputs to the FPGA while TDO is an output, and TMS/TDI have internal weak pull-ups that can mask board-level issues; (3) assuming I/O banks are independent for VCCIO - mixing 1.5 V and 3.3 V on adjacent banks requires careful reference-voltage planning; (4) over-constraining fitter timing - 320 MHz is achievable but only with register-to-register paths inside LABs, not across chip-level routing; (5) ignoring MSL3 moisture sensitivity - BGA packages absorb moisture and require dry-pack baking before reflow.
For high-speed LVDS or SSTL interfaces, follow Altera application note AN224 (High-Speed Board Design) and use 100 ohm differential impedance with matched-length traces within 5 mils. Place series-matching resistors within 5 mm of the FPGA pin to dampen reflections. For clock-distribution networks, route each PLL output to a clock tree buffer (clocken) before fanning out, and avoid using the same PLL output for both internal logic and external clock-out simultaneously, as this degrades jitter. When interfacing DDR memories, place the FPGA on the same board layer as the memory and minimize via count on address/command traces.
FPGA pin assignment should prioritize placing high-fanout signals (clocks, resets, JTAG, configuration) first, then group high-speed differential pairs into a single I/O bank with matched VCCIO. Reserve four I/O pins near the configuration bank as general-purpose user I/Os only if they are not needed for configuration mode selection (MSEL pins). Place decoupling capacitors on the opposite side of the BGA, directly under their corresponding power balls, using via-in-pad if allowed by fabrication. Keep the PLL power island (VCCA_PLL/GNDA) isolated by an inner GND ring to prevent digital switching noise from coupling into the analog PLL supply.
Compliance Information
EP1C12F324C7 (non-N suffix) is not lead-free per Altera/Intel ordering guide conventions. RoHS, REACH, and halogen-free status were not explicitly stated in the verified web data; refer to the manufacturer datasheet ordering information section for definitive compliance statements. AEC-Q100 is not applicable for this commercial-grade FPGA; the EP1C12F324I7 industrial variant is not automotive-qualified either.
