EP1C4F400C7N - Cyclone FPGA 4K LEs 400-FBGA | Intel (Altera)
MPN: EP1C4F400C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.65 | $436.50 |
| 100 | $38.8 | $3,880.00 |
| 500 | $33.5 | $16,750.00 |
| 1,000 | $28.9 | $28,900.00 |
Drop-in alternatives for EP1C4F400C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C4F400C6N
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View Datasheet →EP1C4F400C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements (LEs) | 4000 |
| Logic Array Blocks (LABs) | 400 |
| Embedded Memory (RAM bits) | 78336 |
| M4K Memory Blocks | 17 |
| Maximum User I/Os | 301 |
| PLLs | 2 |
| Process Technology | 130 nm CMOS |
| Supply Voltage (VCCINT core) | 1.5 V |
| Package | 400-ball FBGA (FineLine BGA) |
| Package Dimensions | 21 x 21 mm |
| Ball Pitch | 1.00 mm |
| Speed Grade | -7 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP1C4F400C7N 21 x 21 mm Pin Configuration Guide
Complete pinout information for EP1C4F400C7N (21 x 21 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C4F400C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C4F400C7N is suitable for 6 applications: Industrial Motor Control Interface, Video Processing and Image Pipeline, Telecommunications Line Card Glue Logic, PCIe Endpoint Bridge (Legacy Systems), Educational and Development Platform, Custom Peripheral Bridge and Bus Aggregator.
Industrial Motor Control Interface
The EP1C4F400C7N fits industrial motor-control interface boards because its 4,000 logic elements provide ample capacity for encoder decoding (QEP), PWM generation, and field-oriented control (FOC) state machines, while the 301 user I/Os accommodate parallel ADC sampling, Hall-sensor inputs, and gate-driver outputs. Two on-chip PLLs multiply a 50 MHz crystal up to the 200+ MHz internal clock speeds required for sub-microsecond current-loop timing. The 1.5V VCCINT core and 3.3V VCCIO banks coexist cleanly with legacy industrial logic. Industrial-grade air-flow and the commercial 0C-to-+85C rating suit most factory-floor enclosures. For harsher environments, swap to EP1C4F400I7N with no PCB change.
Recommended
Video Processing and Image Pipeline
The EP1C4F400C7N is well suited to mid-resolution video processing pipelines where its 17 M4K memory blocks (78 Kbits total) buffer line-scan data, and its 301 I/Os accept parallel ITU-R BT.656 / RGB camera inputs. The Cyclone I fabric runs typical video processing at 80-120 MHz on speed grade -7, sufficient for CIF-to-VGA resolution. Two PLLs generate the pixel clock and a separate SDRAM controller clock. Compared with a modern Cyclone IV, the EP1C4F400C7N trades higher static power for much lower unit cost - attractive for disposable medical-imaging or low-margin digital-signage products.
Recommended
Telecommunications Line Card Glue Logic
In telecom line-card applications the EP1C4F400C7N consolidates board-level glue logic - TDM bus multiplexers, framer interfacing, HDLC controllers, and alarm-monitoring state machines - into one device. Its 4K logic elements plus 301 user I/Os comfortably accommodate four E1/T1 ports of glue plus a microprocessor host bus, eliminating 4-6 discrete PAL/GAL devices. The device supports 3.3V LVTTL on most I/O banks, compatible with legacy telecom backplane logic. Industrial temperature screening is available via EP1C4F400I7N drop-in.
Recommended
PCIe Endpoint Bridge (Legacy Systems)
The EP1C4F400C7N implements single-lane PCIe Gen1 endpoint bridges for legacy host adapters and industrial PCs that need PCI Express I/O without an ASIC NRE. The 4K LEs hold a custom transport-layer engine plus a small DMA controller; 78 Kbits of M4K RAM provide descriptor tables. The 301 I/Os include enough LVDS pairs for a soft PCIe SERDES interface on some Cyclone I derivatives (note: SERDES is not native on this family - check your Cyclone I variant if true SERDES is required). Drop in EP1C4F400I7N for industrial-temperature chassis.
Recommended
Educational and Development Platform
Universities and FPGA-training labs rely on the EP1C4F400C7N-equipped Altera/Intel Cyclone I development kits because Quartus II Web Edition is a free toolchain and the 4K-LE density exercises real design complexity without overwhelming students. The 301 I/Os expose enough GPIO, seven-segment displays, and memory interfaces for full computer-architecture lab exercises (single-cycle MIPS CPU, VGA controller, PS/2 keyboard). Replacement EP1C4F400C6N parts are common in student-kit refresh cycles.
Recommended
Custom Peripheral Bridge and Bus Aggregator
The EP1C4F400C7N acts as a high-pin-count bus aggregator in embedded systems - bridging an ARM Cortex-M host bus to SPI, I2C, UART, PWM, and GPIO peripherals, with custom real-time state machines in between. The 301 I/Os out-scale any CPLD, and the embedded M4K blocks implement FIFOs between asynchronous clock domains (two PLLs generate the bridge clocks). Compared with discrete 74-series logic, a single EP1C4F400C7N consolidates 15-25 SSI/MSI parts onto one BGA, reducing board area by 50-70%.
Recommended
Recommended Products Summary
Engineering reference data for EP1C4F400C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C4F400C6N | EP1C4F400I7N | EP1C4F400C8N | EP1C4F400C7 | EP1C20F400C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 400-ball FBGA (F400) 21x21 mm | 400-ball FBGA (F400) - same | 400-ball FBGA (F400) - same | 400-ball FBGA (F400) - same | 400-ball FBGA (F400) - same | 400-ball FBGA (F400) - same |
| Logic Elements | 4,000 LEs | 4,000 LEs | 4,000 LEs | 4,000 LEs | 4,000 LEs | 20,060 LEs |
| Speed Grade | -7 (commercial) | -6 (slower) | -7 (industrial) | -8 (faster) | -7 (commercial) | -7 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Embedded Memory | 78,336 bits (17 M4K blocks) | 78,336 bits | 78,336 bits | 78,336 bits | 78,336 bits | 294,912 bits |
| Maximum User I/Os | 301 | 301 | 301 | 301 | 301 | 315 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Mid-density 4K LE tier with maximum 301 user I/Os in F400 FBGA (vs EP1C3T144C7N)
- Industrial-temp drop-in variant available without PCB change (vs EP1C4F400I7N)
- Same F400 package as 20K-LE EP1C20, enabling density upgrade without board redesign (vs EP1C20F400C7N)
Design Notes
The EP1C4F400C7N requires a 1.5V VCCINT core supply with ±5% tolerance and a separate 3.3V VCCIO supply for I/O banks. Decoupling: place 0.1 µF ceramic capacitors within 3 mm of every VCC pin (approximately 16 VCC pins on the F400 package), plus 4.7 µF bulk capacitors at each supply rail entry. Estimated: at typical 70% utilization and 100 MHz internal clock, expect 0.8-1.2 W core dissipation - verify with the PowerPlay early power estimator in Quartus II.
The 400-ball FBGA at 1.00 mm pitch requires 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Route signal traces on inner layers with 0.127 mm (5 mil) line width and 0.127 mm spacing; escape top-layer fan-out to inner via-stitching grounds. Match differential-pair length to within 0.127 mm for LVDS links. Estimated: minimum PCB stack-up cost is approximately 1.8x a 2-layer board - factor this into design budget.
Assign I/O standards to banks early in pin planning. The EP1C4F400C7N has multiple I/O banks each with their own VCCIO rail - mixing 3.3V LVTTL with 2.5V SSTL on the same bank requires a level-shifter or re-bank. Reference the Cyclone Device Handbook pin tables for bank boundaries. Place clock inputs on dedicated PLL clock pins to minimize jitter. Estimated: allow 2-3 PCB layout iterations to converge on a clean pinout.
Common pitfalls with this part: (1) configuration mode mis-selection - verify MSEL[2:0] strap pins for AS, PS, JTAG, or Fast Passive Parallel mode; (2) forgetting to assert nCONFIG and nSTATUS during power-up; (3) leaving unused I/O banks floating - tie unused banks to VCCIO via 10 kΩ to prevent ESD latch-up; (4) over-utilization above 85% LE count causes timing closure failure at speed grade -7. Consult AN 370 (Altera) for configuration troubleshooting.
Compliance Information
RoHS and REACH compliance per Intel/Altera product page. Lead-free reflow compatible per JEDEC J-STD-020. AEC-Q100 not applicable - this is a commercial/industrial-grade programmable logic device. Cyclone I family is NRND; consult Intel Product Discontinuance notices for end-of-life timing.
