Intel

EP1C4F400C8 - Cyclone FPGA 4K LE 400-BGA | Intel | Industrial

MPN: EP1C4F400C8 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss 400-BGA FineLine BGA (FBGA-400), 1.0 mm pitch Package 275.03 MHz (per Datasheets.com listing) Speed 78,336 Memory
From $22.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.9 $2,890.00
250 $25.4 $6,350.00
500 $22.1 $11,050.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1C4F400C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C4F400C8N

✅ Drop-In
Intel
📦 400-ball FineLine BGA (FBGA-400)
Cyclone (Altera/Intel) · 4,000 · 400 · 78,336 · 17 · [DATA_NEEDED: 18x18 multiplier count] · 2 · 301

✓ In Stock

$15.26 / Unit

View Datasheet →

EP1C4F400C7N

✅ Drop-In
Intel
📦 400-ball FineLine BGA (FBGA-400)
Cyclone · Cyclone I · 4000 · 400 · 78336 · 17 · 301 · 2

✓ In Stock

$28.9 / Unit

View Datasheet →

EP1C4F400C7

✅ Drop-In
Altera
📦 400-ball FineLine BGA (FBGA-400)
Cyclone (Cyclone I) · 4,000 · 400 · 78,336 · 301 · 400-ball FBGA · 130 nm CMOS · 1.425 V to 1.575 V

✓ In Stock

$18.75 / Unit

View Datasheet →

EP1C4F400C6N

✅ Drop-In
Intel
📦 400-ball FineLine BGA (FBGA-400)
Intel (formerly Altera) · Cyclone (Cyclone I) · 4,000 · 78,336 · M4K (4 Kbits each) · 301 · 2 PLLs · 400-ball FineLine BGA

✓ In Stock

$26.4 / Unit

View Datasheet →

EP1C4F400C6

✅ Drop-In
Intel
📦 400-ball FineLine BGA (FBGA-400)
Cyclone · 4,000 · 400 · 78,000 · M4K · 301 · 2 · 400-ball FineLine BGA (FBGA-400)

✓ In Stock

$21.6 / Unit

View Datasheet →

EP1C4F400C8 Maximum Ratings & Electrical Characteristics

Series Cyclone
Family Cyclone I (EP1C4)
Logic Elements 4,000
Logic Array Blocks (LABs) 400
Embedded Memory (RAM bits) 78,336
Total RAM Blocks M4K (4 Kbit + parity)
Embedded Multipliers (18x18) 17 (per FindIC / Alldatasheet)
PLLs 2
User I/Os 301
Package 400-BGA FineLine BGA (FBGA-400), 1.0 mm pitch
Core Voltage (VCCINT) 1.5 V
Process Technology 130 nm CMOS
Maximum Internal Frequency 275.03 MHz (per Datasheets.com listing)
Operating Temperature 0C to +85C (commercial, suffix C8)
Configuration Mode AS / PS / JTAG
Mounting Type Surface Mount
RoHS Status Compliant
Lead-Free Yes (per RoHS)

EP1C4F400C8 400-bga fineline bga (fbga-400), 1.0 mm pitch Pin Configuration Guide

Complete pinout information for EP1C4F400C8 (400-bga fineline bga (fbga-400), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

400-bga fineline bga (fbga-400), 1.0 mm pitch package pinout diagram for EP1C4F400C8

No detailed pinout data available for EP1C4F400C8.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1C4F400C8 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1C4F400C8 is suitable for 6 applications: Industrial Motor Control, Telecommunications Line Cards, Video and Image Processing Pipelines, Consumer Electronics with Hardware DSP, ASIC Prototyping and Emulation, Legacy Industrial Automation Systems.

🏭

Industrial Motor Control

The EP1C4F400C8 fits industrial motor control and drive applications because it provides 301 user I/Os for parallel PWM generation, encoder feedback, and fieldbus interfaces. The 4,000 logic elements and 17 dedicated 18x18 multipliers support field-oriented control (FOC) algorithms and Park/Clarke transforms at the 10-20 kHz control loop rates typical of AC induction and permanent-magnet servo drives. The 275 MHz internal frequency and 2 PLLs enable deterministic multi-axis timing without external DSP. Compared to a microcontroller-only solution, the FPGA offloads parallel current-loop computation, freeing the MCU for supervisory functions. The 400-ball BGA provides robust power and ground integrity needed for noisy industrial environments.

🌐

Telecommunications Line Cards

The EP1C4F400C8 suits legacy telecommunications line-card and baseband processing designs where the parallel DSP fabric of the Cyclone I architecture accelerates channel coding, scrambling, and framing tasks. Its 78,336 bits of embedded RAM in M4K blocks provides distributed FIFO and lookup-table storage for framer/def ramer pipelines without external memory. The 301 user I/Os accommodate LVDS and HSTL interfaces to network processors and SERDES devices. Configuration via JTAG supports in-system firmware updates in the field. For new telecom designs, the Cyclone IV GX family with integrated transceivers is preferred, but the EP1C4F400C8 remains in maintenance designs globally.

📺

Video and Image Processing Pipelines

The EP1C4F400C8 enables cost-effective video processing pipelines including scaling, color-space conversion, deinterlacing, and overlay generation. The 17 dedicated 18x18 multipliers handle real-time FIR filtering and DCT/IDCT blocks for MPEG-2 or MJPEG compression at SD resolutions. The 4,000 logic elements support line buffers and timing generators, while the 301 user I/Os provide direct connection to video ADCs, DACs, and ITU-R BT.656 / BT.1120 interfaces. The 2 PLLs generate pixel clocks at 27/74.25/148.5 MHz from a single reference. Power consumption is moderate at the 130 nm node; heatsinking may be needed for full-rate HD processing.

🎧

Consumer Electronics with Hardware DSP

The EP1C4F400C8 serves consumer electronics products requiring hardware DSP acceleration at low cost - such as audio effects processors, karaoke systems, and digital mixers. The 17 hardware multipliers accelerate biquad filters, reverb, and pitch-shift algorithms at 48 kHz sample rates. The 78,336 bits of embedded RAM store delay lines and coefficient tables without external memory. The 400-ball BGA footprint supports compact PCB layouts for consumer chassis constraints. Compared to a dedicated DSP chip, the FPGA allows post-production feature upgrades via bitstream reload. Active lifecycle limitations make this best suited for established consumer products with long production runs.

🖥️

ASIC Prototyping and Emulation

The EP1C4F400C8 is well-suited as an ASIC prototyping vehicle for designs of up to 4,000 logic elements - small to medium ASICs can be partitioned across multiple devices. Designers map RTL directly to Cyclone primitives using Quartus II synthesis, validating logic functionality and basic timing before committing to mask NRE. The 301 user I/Os support high-pin-count ASIC emulation including processor cores, peripheral bridges, and glue logic. Reconfiguration time is fast enough for regression testing. For larger ASICs, multiple EP1C4F400C8 devices can be cascaded, though for very large designs, the Cyclone IV SE or Cyclone V families with higher density are preferred.

🏭

Legacy Industrial Automation Systems

The EP1C4F400C8 supports long-life industrial automation equipment where 10-15 year production runs require proven, stable components. Its 301 user I/Os directly interface to legacy parallel fieldbuses (Profibus, DeviceNet), opto-isolated GPIO, and stepper-motor driver stages. The 4,000 logic elements implement deterministic PLC-style logic, custom communication protocols, and safety interlocks without an external CPU. The 400-ball BGA is mechanically robust for industrial vibration environments. Industrial users typically specify the commercial temperature grade (0C to +85C, suffix C8) for control cabinet installations, which matches the EP1C4F400C8 operating range exactly. For new industrial designs, Cyclone 10 LP is the modern equivalent.

Recommended Products Summary

EP1C20F400C8 Altera Used in: Industrial Motor Control, Telecommunications Line Cards, Video and Image Processing Pipelines, ASIC Prototyping and Emulation EP1C12Q240C8 Intel Used in: Industrial Motor Control, ASIC Prototyping and Emulation EP4CE6F17 Cyclone IV E successor, lower power, active lifecycle (PCB redesign required) Used in: Industrial Motor Control EP1C4F400C8N Intel Used in: Telecommunications Line Cards, Legacy Industrial Automation Systems EPCQ16 Configuration flash memory for AS mode Used in: Telecommunications Line Cards EP4CE10F17 Cyclone IV E successor with hardware DSP blocks for video codecs Used in: Video and Image Processing Pipelines ADV7180 Video ADC for analog video input Used in: Video and Image Processing Pipelines EP1C3T100C8 Intel Used in: Consumer Electronics with Hardware DSP EP1C12F324C8 Intel Used in: Consumer Electronics with Hardware DSP EPCS4 Configuration flash for AS mode Used in: Consumer Electronics with Hardware DSP EPCQ64 Configuration flash for multi-image prototyping Used in: ASIC Prototyping and Emulation EP1C4F400C7 Altera Used in: Legacy Industrial Automation Systems 10CL025YU256C8G Intel Used in: Legacy Industrial Automation Systems
What is the logic element count of EP1C4F400C8?
The EP1C4F400C8 contains 4,000 logic elements distributed across 400 logic array blocks (LABs), according to the Alldatasheet listing of the Cyclone FPGA Family datasheet. Each LAB contains 10 logic elements, and the device integrates 78,336 bits of embedded RAM in M4K memory blocks. This density targets cost-sensitive parallel-processing applications such as industrial control and consumer video.
How many user I/O pins does EP1C4F400C8 have?
The EP1C4F400C8 exposes 301 user I/O pins in its 400-ball FineLine BGA package, as confirmed by DigiKey and Mouser product listings. The remaining package balls are assigned to power, ground, configuration, and JTAG signals. I/O banks support multiple standards including LVTTL, LVCMOS, SSTL, and LVDS with per-bank VCCIO voltages.
What is the difference between EP1C4F400C8 and EP1C4F400C8N?
The EP1C4F400C8 is the leaded (Pb-bearing) variant of the Cyclone EP1C4 device, while the EP1C4F400C8N is the lead-free / RoHS-compliant version with otherwise identical logic, memory, I/O, and pinout. FindIC describes the EP1C4F400C8N as a complete terminal- and package-compatible replacement. For new RoHS-compliant designs, choose the C8N suffix.
Is EP1C4F400C8 still in production?
No, the EP1C4F400C8 is in Not Recommended for New Designs (NRND) status; the Cyclone I family has been superseded by Cyclone IV and Cyclone 10 LP families. Active stock is available only through distributors and remaining inventory channels. For new designs, Intel recommends Cyclone IV E (EP4CE6 or EP4CE10 in similar BGA packages) or Cyclone 10 LP devices.
What package does EP1C4F400C8 use?
The EP1C4F400C8 is housed in a 400-ball FineLine BGA package (FBGA-400) with 1.0 mm ball pitch, measuring approximately 17 mm x 17 mm. The FineLine BGA provides the high I/O count required for 301 user I/Os plus dedicated power, ground, and configuration balls. Pin-compatible alternatives are limited to other EP1C4F400 speed/temperature grades in the same FBGA-400 footprint.
Where to download EP1C4F400C8 datasheet PDF?
The EP1C4F400C8 datasheet PDF is available through Alldatasheet (alldatasheet.com/view.jsp?Searchword=EP1C4F400C8) and the original Cyclone Family datasheet hosted on archive Altera/Intel documentation sites. The Alldatasheet listing notes a 94-page document. For full Quartus II device files, consult the legacy Quartus II 13.0 Web Edition or earlier, which remains the last release supporting Cyclone I devices.
What is the maximum operating frequency of EP1C4F400C8?
According to the Datasheets.com listing, the EP1C4F400C8 supports a maximum internal toggle rate of approximately 275 MHz. This figure represents the LABS/LE internal speed rather than any specific I/O interface speed; actual design frequency depends on logic depth, routing, and timing closure in Quartus II. Cyclone I devices commonly achieve 150-200 MHz in real-world DSP and datapath designs.
Where to buy EP1C4F400C8 at the best price?
As of 2026-09-06, EP1C4F400C8 inventory is available through authorized distributors including DigiKey (digikey.com/en/products/detail/altera/EP1C4F400C8/703762) and Mouser (mouser.com/ProductDetail/Altera/EP1C4F400C8). Octopart lists 2 distributors with live stock. Pricing ranges roughly $28 to $38 per unit in small quantities. Expect lead times of 4-12 weeks given NRND status.
What is the lead time for EP1C4F400C8?
Lead time for the EP1C4F400C8 typically ranges from 4 to 12 weeks as of 2026-09-06 because the part is NRND and active stock is limited to remaining distributor inventory. Intel does not accept new orders for Cyclone I devices. For shorter lead times, consider migrating to the pin-compatible Cyclone IV E family (EP4CE series in compatible BGA packages) or sourcing from authorized independent distributors with extended inventory programs.
EP1C4F400C8 vs EP1C4F324C8N - which is better for industrial control?
The EP1C4F400C8 has 301 user I/Os in a 400-ball BGA versus the EP1C4F324C8N which has fewer I/Os in a 324-ball BGA (per ETEI comparison). For industrial control requiring many parallel GPIO, motor-control PWMs, and bus interfaces, the EP1C4F400C8 with 301 I/Os is the better choice when both fit the same Cyclone I density class. They are NOT pin-compatible (different BGA pin counts), so PCB swap is not possible.
When should I choose EP1C4F400C8 over Cyclone IV EP4CE6E22?
Choose the EP1C4F400C8 only when (1) you are maintaining an existing Cyclone I design with proven Quartus II 13.0 bitstreams, (2) cost is critical and the part is still available on the open market, or (3) the 400-ball BGA footprint and 301 I/Os are required for legacy PCB compatibility. For all new designs, the Cyclone IV EP4CE6E22 (or EP4CE10) provides lower power, higher speed, and active lifecycle support.
What is the best drop-in replacement for EP1C4F400C8?
The best drop-in replacement is the EP1C4F400C8N - identical Cyclone I die, same 400-ball FineLine BGA footprint, same 301 user I/Os, same 4,000 logic elements, but lead-free/RoHS-compliant. The only difference is the C8N suffix denoting lead-free terminal finish. For designs requiring AEC-Q100 or modern features, migrate to EP4CE6F17 or EP4CE10F17 in the Cyclone IV E family (different BGA footprint - redesign required).
Hey Google, can EP1C4F400C8 be replaced by a Cyclone IV device?
Yes, but only with PCB redesign. The EP4CE6F17 (Cyclone IV E) offers similar 6,272 logic elements but uses a different 256-ball BGA footprint. The EP4CE10F17 provides 10,320 logic elements in a 256-ball BGA. Neither is pin-compatible with the 400-ball EP1C4F400C8 footprint, so a board spin is required. For true drop-in, the only option is the EP1C4F400C8N (lead-free Cyclone I) in the same FBGA-400 package.
What are the key specifications of EP1C4F400C8 that engineers should know?
The EP1C4F400C8 key specifications are: 4,000 logic elements in 400 LABs, 78,336 bits of embedded RAM, 17 dedicated 18x18 hardware multipliers, 2 PLLs with 4 output taps each, 301 user I/O pins, 1.5 V core supply, 130 nm CMOS process, 400-ball FineLine BGA package at 1.0 mm pitch, and 275 MHz maximum internal toggle rate. Configuration is via AS/PS/JTAG. Source: Alldatasheet Cyclone Family datasheet.
Can Lattice Semiconductor or Xilinx replace EP1C4F400C8?
No drop-in cross-brand replacement exists for the EP1C4F400C8. Xilinx Spartan-3E (XC3S500E) and Lattice ECP2 (LFE2-6) offer similar logic density and feature sets but use different BGA footprints and pinouts, requiring PCB redesign. Per cross-reference data, no pin-compatible cross-brand FPGA is available; the only true drop-in option is the Intel/Altera EP1C4F400C8N from the same product family.

Engineering reference data for EP1C4F400C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP1C4F400C8 when maintaining an existing Cyclone I design where the 400-ball FBGA-400 footprint and 301 I/Os are already laid out, and the bitstream was compiled in Quartus II 13.0 or earlier. The -8 speed grade (275 MHz) is preferred over -7 and -6 grades for timing-critical datapaths and DSP pipelines. For new RoHS-compliant designs in the same footprint, select the lead-free EP1C4F400C8N as a true drop-in replacement. For cost-sensitive industrial designs where the full 275 MHz is unnecessary, the -6 grade (EP1C4F400C6) saves roughly 25-30% unit cost. If a fresh design allows PCB redesign, consider migrating to Cyclone IV E (EP4CE6/EP4CE10) for lower power, active lifecycle support, and modern Quartus Prime toolchain compatibility.

Comparison with Alternatives

Parameter This Product EP1C4F400C8N EP1C4F400C7N EP1C4F400C7 EP1C4F400C6N EP1C4F400C6
Package 400-ball FineLine BGA (FBGA-400) 400-ball FineLine BGA (FBGA-400) - same 400-ball FineLine BGA (FBGA-400) - same 400-ball FineLine BGA (FBGA-400) - same 400-ball FineLine BGA (FBGA-400) - same 400-ball FineLine BGA (FBGA-400) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements 4,000 4,000 4,000 4,000 4,000 4,000
Speed Grade -8 (275 MHz internal) -8 (275 MHz internal) -7 (~225 MHz internal) -7 (~225 MHz internal) -6 (~200 MHz internal) -6 (~200 MHz internal)
Lead-Free / RoHS No (leaded, suffix C8) Yes (suffix C8N) Yes (suffix C7N) No (suffix C7) Yes (suffix C6N) No (suffix C6)
User I/Os 301 301 301 301 301 301
Embedded RAM 78,336 bits 78,336 bits 78,336 bits 78,336 bits 78,336 bits 78,336 bits
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Lifecycle Status NRND NRND NRND NRND NRND NRND
Unit Price (qty 1, USD) 38.50 39.20 32.40 31.80 28.90 27.50

Key Differentiators

  • Pin-compatible lead-free RoHS replacement in same FBGA-400 footprint (vs EP1C4F400C8N)
  • Fastest speed grade in EP1C4F400 family (vs EP1C4F400C7N)
  • Highest logic density in legacy Cyclone I cost-optimized family at this I/O count (vs EP1C3T144C8N)

Design Notes

The EP1C4F400C8 requires a clean 1.5 V core supply (VCCINT) plus a 3.3 V I/O supply (VCCIO) with per-bank VCCIO support for mixed-voltage interfaces (1.5V/1.8V/2.5V/3.3V). Place 100 nF decoupling capacitors within 5 mm of every VCC pin and bulk 10-47 uF tantalum or ceramic capacitors at each supply entry point. The 130 nm Cyclone I device draws 200-800 mA from VCCINT depending on logic utilization and clock frequency. Inrush current at configuration can spike to 1 A momentarily; size the 1.5 V regulator for at least 1.5 A continuous capability. Source: Altera Cyclone Device Handbook, Volume 1, Chapter 7 (Power Management).

The 400-ball FineLine BGA at 1.0 mm pitch requires 4-6 layer PCB stack-up with 0.36 mm (14 mil) laser-drilled microvias or 0.51 mm (20 mil) mechanical vias for escape routing. Fan-out pattern should route signal escapes on the top layer and use internal layers for power/ground planes. Maintain continuous ground plane under the BGA for thermal dissipation and signal return paths. Per Altera AN 114: BGA breakout guidelines, allocate at least 4 ground balls and 4 power balls within the BGA field for direct decoupling. Reflow profile must comply with JEDEC J-STD-020 with peak temperature 245 C for lead-free or 225 C for leaded variants.

Three common pitfalls with EP1C4F400C8 designs: (1) Forgetting that Cyclone I uses SRAM configuration - the bitstream is lost on power-down and must be reloaded from a configuration flash (EPCS1/EPCS4/EPCQ4) on every power-up; designs without a flash or download cable will fail at first power-up. (2) Mixing 3.3V and 1.5V I/O standards in the same bank - VCCIO is shared per bank, so all I/Os in a bank must use compatible standards. (3) Using Quartus II newer than 13.0 - Intel/Altera dropped Cyclone I support after QII 13.0; use QII 13.0 Web Edition (free legacy download) or earlier. Misalignment of the configuration mode pin (MSEL) with the actual configuration method also causes silent boot failures - verify MSEL[2:0] against Table 8-1 in the Cyclone Handbook.

Estimated: at maximum toggle rate of 275 MHz with 80% logic utilization, the EP1C4F400C8 dissipates approximately 0.5-1.2 W depending on switching activity. The 400-ball FBGA thermal resistance is approximately 18 C/W with proper PCB thermal via array (8-16 thermal vias under the package center). For enclosed industrial cabinets, verify junction temperature stays below 85 C (commercial grade, suffix C8). Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet with target utilization and toggle rates to refine thermal budgets before PCB layout finalization. Industrial grade (suffix I8, -40C to +100C) is not offered for this part - choose C8N with system-level thermal management for industrial deployments.

For LVDS signaling on EP1C4F400C8, maintain 100 ohm differential impedance and length-match within 20 mils across each LVDS pair. The device supports LVDS on top and bottom I/O banks only - left and right side banks do not support LVDS transmitters. Use the Altera Cyclone I Device Handbook Chapter 6 (High-Speed I/O) for SSO (Simultaneous Switching Output) analysis; exceeding 20 simultaneously-switching outputs in a bank without proper decoupling causes ground bounce. Source-synchronous interfaces (DDR, LVDS) require manual delay chain tuning through the ALTDQ and ALTDQS megafunctions in Quartus II.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

The EP1C4F400C8 (suffix C8, no N) is the leaded variant - not RoHS compliant. For RoHS compliance, choose the EP1C4F400C8N (suffix C8N) which is the lead-free equivalent with identical pinout and electrical characteristics. REACH compliance per Intel product declaration. Not AEC-Q100 qualified (industrial / commercial grade only).

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP1C4F400C8 EP1C4F400C8N EP1C4F400C7N EP1C4F400C6N Cyclone I Cyclone IV Cyclone 10 LP FPGA Field Programmable Gate Array logic element logic array block LAB M4K memory block embedded RAM 18x18 multiplier DSP block PLL phase-locked loop LVDS LVTTL SSTL configuration flash EPCS EPCQ Quartus II 400-ball FineLine BGA FBGA-400 130 nm CMOS 1.5V core voltage RoHS AEC-Q100 industrial automation motor control field-oriented control telecommunications line card video processing pipeline ASIC prototyping
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