EP1C4F400I7 - Cyclone FPGA 4000 LE, 301 I/O | Altera
MPN: EP1C4F400I7 ✗ End of Life| Qty | Unit Price | Extended |
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Drop-in alternatives for EP1C4F400I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C4F400I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$26.75 / Unit
View Datasheet →EP1C4F400C7N
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$28.9 / Unit
View Datasheet →EP1C4F400C6N
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$26.4 / Unit
View Datasheet →EP1C4F400C8N
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$15.26 / Unit
View Datasheet →EP1C4F400C8
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$22.1 / Unit
View Datasheet →EP1C4F400C7
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$18.75 / Unit
View Datasheet →EP1C4F400I7 Maximum Ratings & Electrical Characteristics
| Product Type | FPGA - Field Programmable Gate Array |
| Series | Cyclone |
| Number of Logic Cells / Elements | 4000 |
| Number of LABs | 400 |
| Number of User I/Os | 301 |
| Total RAM Bits | 78336 |
| Core Supply Voltage | 1.5 V |
| Process Technology | CMOS 130 nm |
| Maximum Internal Frequency | 320 MHz (family level) |
| Package / Case | 400-BGA (FBGA/PBGA), 21 x 21 mm, 1.0 mm pitch |
| Number of Terminals | 400 |
| Mounting Style | Surface Mount (BGA) |
| Speed Grade | -7 |
| Temperature Grade | Industrial (I7 suffix) |
EP1C4F400I7 400-bga (fbga/pbga), 21 x 21 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1C4F400I7 (400-bga (fbga/pbga), 21 x 21 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C4F400I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C4F400I7 is suitable for 6 applications: Industrial Motor Control, Video and Imaging Front End, Communication Protocol Bridge, Legacy ASIC and Glue-Logic Replacement, Test and Measurement Instruments, IoT and Edge Data Concentrator.
Industrial Motor Control
The EP1C4F400I7 can implement compact multi-axis motor-control logic using 4,000 logic elements and 301 user I/Os. Its industrial I7 temperature option permits operation inside variable-frequency drives and servo controllers, while the FBGA-400 package provides enough pins to interface current-sense ADCs, encoder inputs, and gate-driver signals. The 78,336 RAM bits can store commutation tables or diagnostic buffers, and the programmable fabric can generate PWM waveforms with deterministic timing. Because the device has a 1.5 V core and mature Cyclone I architecture, designers should verify I/O banks and generate a clean core-power supply. Using the -7 speed grade is acceptable for most motor-loop state machines; for higher timing margins, the -6 variant may be considered, but commercial C6N cannot replace the industrial I7 temperature option in this application.
Recommended
Video and Imaging Front End
EP1C4F400I7 has enough I/O to capture parallel CMOS sensor data and feed processed pixels to a memory or display interface. The 301 user I/O pins allow multiple 8/10/16-bit buses, while the 78,336 RAM bits can act as line buffers and FIFOs for row/column processing. With 4,000 logic elements, designers can implement sensor timing, Bayer/color preprocessing, frame-differencing, and simple filters. The industrial I7 grade is appropriate for machine-vision cameras on production lines where ambient temperature may rise. For a real-time video pipeline, an external SDRAM or SRAM is usually needed because the on-chip RAM is modest by today's standards. Power sequencing of the 1.5 V core and I/O bank voltages are important to prevent latch-up or unreliable I/O states during start-up.
Recommended
Communication Protocol Bridge
The EP1C4F400I7 can serve as a deterministic bridge among UART, SPI, I2C, and parallel memory buses. Its 301 user I/Os permit multiple voltage banks, and 4,000 logic elements can contain several serial controllers plus a small state-machine processor. In an industrial setting, the I7 suffix makes the FPGA suitable for switching cabinets and machine-side communication nodes. Distributor data places the family in the 320 MHz class, which is ample for protocol engines operating below 100 MHz. The on-chip 78,336 RAM bits buffer packets and mailbox messages. A practical design tip is to allocate clock constraints carefully and use CDC (clock domain crossing) synchronizers between independent serial clocks. If the protocol includes a fieldbus controller, integrating it inside the FPGA reduces system chip count but requires careful licensing and verification.
Recommended
Legacy ASIC and Glue-Logic Replacement
Many mature designs use EP1C4F400I7 to consolidate ASIC-like state machines and multiple 74-series glue logic devices. A single 4,000-logic-element Cyclone FPGA can absorb address decoding, bus arbitration, timing generation, status registers, and byte-lane logic. The 301 I/Os allow connection to multiple processor buses at different voltage levels, reducing total package count and easing PCB layout when compared with a drawer of CPLDs. The industrial I7 option is valuable in legacy industrial boards that may be subjected to elevated thermal stress. Because the Cyclone I family is no longer a new FPGA architecture, this replacement path is most appropriate for extending the life of an existing product. New designs should evaluate newer Cyclone/MAX families or lower-power alternatives, but existing EP1C4F400 footprints can also move among I7, C7, C6, and C8 order-code variants with timing review.
Recommended
Test and Measurement Instruments
The EP1C4F400I7 is suitable for digitizer front ends and bench instruments where 4,000 logic elements can manage ADC clocking, sample storage, trigger logic, and host interfaces. Its 301 user I/O pins make it possible to connect parallel ADCs/DACs and communicate with an embedded processor or USB bridge. The 78,336 RAM bits can buffer short acquisition bursts before host transfer. Because instruments often operate in warm enclosures, the I7 suffix is a safer choice than the commercial C-suffix alternative. The FPGA's 1.5 V core must be powered by a clean low-noise rail, especially when FPGA switching noise could affect the analog front end. Dedicated high-speed clocks should be routed with controlled impedance, and each ADC clock should be attached to a clock-capable pin after checking the Cyclone pin file.
Recommended
IoT and Edge Data Concentrator
At the edge, EP1C4F400I7 can aggregate sensor reads, quadrature decoders, camera lines, or custom parallel buses before handing processed data to an application processor. The 301 user I/Os support flexible connection to wireless-module host interfaces and industrial sensor connectors. Its 4,000 logic elements can perform CRC checking, data formatting, time stamping, and short FIFO buffering without loading the main CPU. The 78,336 bits of embedded RAM help with packet staging between asynchronous clock domains. The industrial I7 temperature option fits outdoor gateways and smart electric meters. A four-layer or higher PCB is recommended for the FBGA-400 package so the 1.5 V core supply has a dedicated plane and all ball rows can be efficiently fanned out. Level shifters should be used when connecting 5 V legacy sensors to the FPGA I/O banks.
Recommended
Recommended Products Summary
Engineering reference data for EP1C4F400I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C4F400I7N | EP1C4F400C7N | EP1C4F400C6N | EP1C4F400C8N |
|---|---|---|---|---|---|
| Package | FBGA-400 (400-BGA) | FBGA-400 | FBGA-400 | FBGA-400 | FBGA-400 |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 4000 | 4000 | 4000 | 4000 | 4000 |
| User I/O | 301 | 301 | 301 | 301 | 301 |
| Total RAM Bits | 78336 | 78336 | 78336 | 78336 | 78336 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -7 (I7, industrial) | -7 (I7N, industrial) | -7 (commercial) | -6 (commercial, faster) | -8 (commercial, slower) |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Commercial |
| Lead-Free N Finish | No (non-N target) | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial-temperature designation for demanding environments (vs EP1C4F400C7N)
- Speed grade -7 provides a balanced timing and procurement position (vs EP1C4F400C8N)
- Non-N finish can suit legacy tin-lead assembly processes (vs EP1C4F400I7N)
Design Notes
This FPGA uses a 1.5 V core supply. Estimated: place a low-ESR bulk capacitor, for example 10 uF, and additional 100 nF ceramic capacitors around the FBGA-400 power balls. The exact decoupling count depends on switching activity and cannot be specified without a board-level simulation; Intel/Altera Cyclone power guidelines should be followed. A clean core rail is critical because the device is CMOS and dynamic current changes with clock activity.
The 400-ball FineLine BGA has 1.0 mm pitch. A four-layer or higher PCB is strongly recommended so every power and ground ball can connect through vias to internal planes. Estimated: for complete fan-out, use 0.25 mm or smaller drilled vias and 0.15 mm trace widths, depending on PCB capability. Do not route high-speed signals across a split plane under the FPGA. Verify each ball assignment with the Cyclone pin file before releasing layout, because the FBGA-400 pinout is not reproduced in this summary.
When selecting an EP1C4F400 alternative, do not assume the speed-grade suffix is interchangeable without retiming. The -6, -7, and -8 grades have different Fmax bins; moving from -7 to -8 may cause timing failures. Likewise, C-suffix alternatives are commercial-temperature parts and should not be used in industrial nor extended-temperature products. If lead-free assembly is required, the non-N EP1C4F400I7 may not be suitable; use the N-suffix version instead.
At 130 nm and 1.5 V, the EP1C4F400I7 is not a high-power FPGA in modern terms, but the FBGA package relies on the PCB for heat spreading. Estimated: a small device with 4,000 LEs switching at 100 MHz may dissipate well under 1 W, but continuous I/O toggling and enabled embedded RAM can increase dissipation. Provide thermal vias beneath the package if the board will be used in a warm industrial enclosure.
The user I/O count of 301 allows many bus signals; simultaneously switching outputs can create ground bounce if slew rates are too high and decoupling is inadequate. Use FPGA output slew-rate settings and place series resistors on fast interfaces when driving long traces. Keep each I/O bank's supply separate to the recommended voltage and bypass each bank on the PCB.
Compliance Information
RoHS, REACH, lead-free, and conflict-mineral status were not provided in the verified web data. The target part does not have an N suffix; N-suffix order-code variants are typically used to indicate lead-free finish in Altera/Intel FPGA part numbers.
