EP1C6F256C7NAB - Cyclone FPGA, 6K LEs, 256-BGA | Intel/Altera
MPN: EP1C6F256C7NAB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $26.9 | $2,690.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.8 | $19,800.00 |
Drop-in alternatives for EP1C6F256C7NAB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C6F256C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1C6F256C7
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View Datasheet →EP1C6F256C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1C6F256C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1C6F256C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1C6F256C7NAB Maximum Ratings & Electrical Characteristics
| Family | Cyclone |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| User I/Os | 185 |
| Number of I/O Banks | 8 |
| Package | 256-BGA (FineLine) |
| Package Pin Count | 256 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (per bank) |
| Speed Grade | C7 |
| Operating Temperature | 0C to +85C (Commercial) |
| Number of PLLs | 2 |
| Embedded Multipliers (18x18) | 20 |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| RoHS Status | Unknown (legacy family, pre-RoHS-era variants exist) |
EP1C6F256C7NAB 256 Pin Configuration Guide
Complete pinout information for EP1C6F256C7NAB (256 package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C6F256C7NAB.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C6F256C7NAB is suitable for 7 applications: Industrial Control Logic and Glue Logic, Digital Signal Processing (DSP) Front-End, Communications Protocol Bridging, Video and Image Processing Pipelines, Legacy Board Sustainment and Obsolete-Component Replacement, Consumer Electronics Display Controllers, Educational and Prototyping FPGA Boards.
Industrial Control Logic and Glue Logic
The EP1C6F256C7NAB replaces multiple discrete CPLDs and 74-series logic ICs in industrial control boards with a single programmable device. The 5,980 logic elements and 185 user I/Os are sufficient to integrate motor-control glue logic, button debouncing, encoder decoding, and fieldbus protocol bridging (Modbus, CAN, RS-485). With 1.5V core and 3.3V-capable I/O banks, it interfaces directly to industrial sensors and 24V opto-isolated signals via external buffers. The 256-FBGA footprint keeps the design compact while providing enough I/O for multi-axis motion-control PCBs. Designers benefit from hardware re-programmability that supports late-stage firmware changes during production.
Recommended
Digital Signal Processing (DSP) Front-End
The 20 embedded 18×18 multipliers and M4K block RAM in the EP1C6F256C7NAB implement FIR filters, FFT stages, and digital up/down-converters in DSP front-end boards. The multipliers deliver up to 250 MHz operation, sufficient for audio-bandwidth and baseband signal processing in software-defined radio and instrumentation. Designers can build 16-tap FIR filters in a single LAB and chain stages for higher-order filters. The 92,160 RAM bits act as coefficient and data buffers, eliminating external SRAM in compact DSP boards. The Cyclone I DSP block architecture is supported by Altera LPM_MULT and DSP Builder IP libraries.
Recommended
Communications Protocol Bridging
The EP1C6F256C7NAB bridges legacy and modern communications protocols (UART, SPI, I2C, PCIe PIPE, SGMII, GMII) on telecom and networking line cards. With 185 I/Os and 8 banks, the device routes multiple LVDS pairs and single-ended buses simultaneously while the two PLLs generate the required reference clocks. The 256-FBGA package supports controlled-impedance routing for 1 Gbps signals. Legacy protocol stacks (HDLC, frame relay, ATM) can be implemented in soft logic, while a microcontroller offloads management-plane tasks. Designers configure the bridge via JTAG during board bring-up and re-program in-system for firmware updates.
Recommended
Video and Image Processing Pipelines
In video processing, the EP1C6F256C7NAB drives LVDS-based display interfaces, performs color-space conversion, and applies real-time image filters in surveillance and broadcast equipment. The 5,980 LEs handle 720p and 1080i pixel-clock rates comfortably when configured for pipelined processing. The 185 I/Os accommodate 24-bit parallel video buses plus timing-control signals. Embedded multipliers accelerate edge-detection and motion-estimation kernels. Industrial camera and frame-grabber boards benefit from the Cyclone I's deterministic timing and 3.3V-tolerant I/O banks for direct connection to image sensors and HDMI transmitters.
Recommended
Legacy Board Sustainment and Obsolete-Component Replacement
Many OEM and military customers use the EP1C6F256C7NAB as a sustainment FPGA to extend the lifecycle of legacy boards where original Cyclone I silicon has been discontinued. The C7 commercial speed grade matches the original factory timing, allowing pin-to-pin replacement on existing 256-FBGA PCBs without redesign. Industrial, medical, and aerospace sustainment programs use this part to keep deployed equipment operational. With the part now obsolete, buyers rely on remaining factory inventory and authorized distributors for support; the 256-FBGA footprint remains stable across Cyclone I variants, easing last-time-buy planning.
Recommended
Consumer Electronics Display Controllers
Consumer electronics such as digital photo frames, in-flight entertainment seat-back displays, and point-of-sale terminals use the EP1C6F256C7NAB as a low-cost display controller. The 185 user I/Os drive TFT LCD panels with RGB interfaces, handle touch-panel scanning, and execute on-screen display (OSD) overlays. The two PLLs generate pixel clocks and backlight-PWM frequencies, while embedded multipliers scale and rotate image data in real time. The 256-FBGA footprint and 1.5V core keep power consumption low enough for fanless consumer enclosures. Designers use Quartus II IP cores for HDMI, DVI, and LVDS transmit interfaces.
Recommended
Educational and Prototyping FPGA Boards
Universities and FPGA-training labs favor the EP1C6F256C7NAB as a teaching platform because it is supported by the legacy Quartus II toolchain (free Web Edition) and has a manageable logic capacity for student projects. The 256-FBGA development boards expose 100+ I/Os for breadboard prototyping via header pins and include LEDs, switches, and SDRAM. Course labs cover VHDL/Verilog design, state-machine implementation, and basic DSP pipelines. The Cyclone I architecture introduces students to PLLs, embedded multipliers, and configuration memory without overwhelming complexity. Replacement boards are easy to assemble thanks to the part's broad 256-FBGA toolchain support.
Recommended
Recommended Products Summary
Engineering reference data for EP1C6F256C7NAB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C6F256C7N | EP1C6F256C7 | EP1C6F256C8N | EP1C6F256C6N | EP1C6F256C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 256-FBGA (FineLine) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 5,980 | 5,980 - same | 5,980 - same | 5,980 - same | 5,980 - same | 5,980 - same |
| RAM Bits | 92,160 | 92,160 - same | 92,160 - same | 92,160 - same | 92,160 - same | 92,160 - same |
| User I/Os | 185 | 185 - same | 185 - same | 185 - same | 185 - same | 185 - same |
| Speed Grade | C7 | C7 - same | C7 - same | C8 - faster | C6 - slower | C6 - slower |
| Operating Temperature | 0C to +85C (Commercial) | Commercial - same | Commercial - same | Commercial - same | Commercial - same | Commercial - same |
| Trailing Suffix | NAB | N - standard ordering code | (no suffix) - tray option | N - standard, C8 speed | N - standard, C6 speed | (no suffix) - C6, tray option |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Identical Cyclone I silicon - true drop-in on existing 256-FBGA PCBs (vs EP1C6Q240C6 (240-pin PQFP))
- C7 speed grade offers balanced timing and power for commercial designs (vs EP1C6F256C8N (C8 speed grade))
- Backward-compatible Quartus II toolchain support (vs Lattice ECP5 (cross-vendor comparison))
Design Notes
The EP1C6F256C7NAB requires separate VCCINT (1.5V core) and VCCIO (per-bank 1.5V/1.8V/2.5V/3.3V) supply rails. Use a low-dropout regulator such as a 1.5V LDO for VCCINT capable of delivering 500 mA peak with adequate thermal headroom. Place a 100 nF decoupling capacitor on every VCC pin and at least one 10 µF bulk capacitor per supply rail. Estimated: at 100% resource utilization and 250 MHz toggle rate, VCCINT current draw can reach 250-400 mA; design the regulator for at least 2× margin to avoid inrush droop during configuration.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, requiring PCB microvia or via-in-pad technology. The escape routing should use 4-6 mil trace-and-space with controlled impedance for high-speed I/O. Place configuration memory (EPCS4SI8N or compatible) within 50 mm of the FPGA's dedicated configuration pins to minimize signal-integrity risk. The exposed die-pad underneath the BGA must be soldered to the PCB ground plane for thermal dissipation - do not leave it floating.
LVDS signaling on the EP1C6F256C7NAB requires external 100 Ω differential termination resistors placed within 7 mm of the FPGA receive pins. Match intra-pair trace lengths to within 150 mil (3.8 mm) and pair-to-pair within 250 mil (6.4 mm) for jitter control. Use the Quartus II pin-planner to assign LVDS pairs and verify with the Cyclone I board-design guidelines. Single-ended I/O should use 50 Ω series termination at the driver end for clock rates above 100 MHz.
Always configure the EP1C6F256C7NAB via Active Serial mode with a configuration memory such as the EPCS4SI8N to allow in-system re-programming via JTAG. Active Serial mode supports a multi-stage bootloader flow. Verify that the configuration memory size is at least 1.5× the bitstream size; typical Cyclone I 6K-LE designs compile to ~1.0-1.2 Mbit bitstreams, so EPCS4 (4 Mbit) is sufficient. Add a 1 ms reset delay after power-up for stable configuration.
Although the EP1C6F256C7NAB has a typical power dissipation below 1 W at moderate toggle rates, the BGA package requires attention to thermal management. Solder the central BGA ground balls and the die-pad to a continuous PCB ground pour to spread heat across the board. Estimated: at room temperature and 50% utilization, junction-to-ambient thermal resistance (θJA) for a properly designed 256-FBGA board is around 30 C/W. Do not use thermal vias under signal balls; only under ground balls and the die-pad.
Compliance Information
EP1C6F256C7NAB belongs to the legacy Altera Cyclone I family (introduced 2003) before widespread RoHS adoption. Compliance status varies by manufacturing lot. AEC-Q100 is not applicable for FPGAs as they are not automotive-qualified discrete components. Customers should request specific lot compliance documentation from their distributor when needed.
