EP1K30QI208-2N - 30K-Gate ACEX 1K FPGA, 147 I/O, 208-PQFP | Intel
MPN: EP1K30QI208-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $33.7356 | $33.74 |
| 10 | $30.36 | $303.60 |
| 100 | $26.99 | $2,699.00 |
| 500 | $23.61 | $11,805.00 |
| 1,000 | $20.24 | $20,240.00 |
EP1K30QI208-2N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing channels, and programmable I/O cells that allow the hardware function to be defined after manufacturing. FPGAs sit in the programmable-logic tier of the digital-logic hierarchy, above fixed-function ASICs and below microcontrollers in flexibility, and are widely used for glue logic, bus bridging, DSP datapaths, and prototyping of ASIC designs. The ACEX 1K family specifically targets high-volume, cost-sensitive applications that previously would have required gate-array or standard-cell ASICs.
Key features of the EP1K30QI208-2N include 1728 logic elements organized into a 4-input LUT-based fabric, 24576 bits of embedded dual-port RAM distributed across nine Embedded Array Blocks (EABs), six Clock Lock Loops (PLLs) for clock conditioning, and JTAG-compliant IEEE 1149.1 boundary-scan support. The 'Q' in the part number indicates the PQFP package style, 'I' indicates the Industrial temperature grade (-40C to +85C), '208' is the pin count, and the speed grade '-2N' places it in the mid-speed tier of the ACEX 1K family.
The device architecture uses a hierarchical interconnect with FastTrack continuous routing channels, providing predictable timing and fast compile times in the legacy MAX+PLUS II and Quartus design flows. Per-row dual-port EABs allow efficient implementation of RAM, ROM, FIFO, and multiplier megafunctions without sacrificing logic capacity.
Typical applications include industrial control glue logic, telecommunication line-card interfaces, low-cost prototyping bridges, and bus-interface conversion where the 147 user I/Os and the industrial temperature range are sufficient. The wide I/O count supports parallel buses, video pixel interfaces, and multi-channel peripheral aggregation in a single chip.
When designing with this part, verify power sequencing on the 2.5 V VCCINT and 3.3 V VCCIO rails, provide bulk decoupling at every supply pin, and confirm that the chosen speed grade closes timing on the longest combinational path. Designers migrating to the EP1K30QI208-2N from a smaller ACEX 1K device should re-check the I/O bank assignments because the 208-pin PQFP offers the largest I/O count of the family.
This page synthesizes distributor pricing, verified same-package drop-in alternatives in the same ACEX 1K family, and practical design notes that go beyond the manufacturer datasheet's nominal specifications.
Drop-in alternatives for EP1K30QI208-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K30QI208-2N (same form factor and footprint) — differing in Speed Grade, Total RAM Bits, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30QI208-3
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K30QI208-1
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K30QI208-2
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1K30QC208-2N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EP1K30QC208-1N
✅ Drop-In✓ In Stock
$29.88 / Unit
View Datasheet →EP1K30QC208-3N
✅ Drop-In✓ In Stock
$15.9 / Unit
View Datasheet →EP1K30QI208-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Device Logic Elements | 1728 |
| Typical Gate Count | 30000 |
| Embedded Memory (EAB RAM) | 24576 bit |
| Logic Array Blocks (LABs) | 216 |
| User I/O Pins | 147 |
| Process Technology | 0.22 um CMOS |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Maximum Internal Frequency | 200 MHz |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Speed Grade | -2 |
| Package | 208-pin PQFP (BFQFP) |
| Mounting Type | Surface Mount |
EP1K30QI208-2N 208-pin pqfp (bfqfp) Pin Configuration Guide
Pin configuration for EP1K30QI208-2N (208-pin pqfp (bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30QI208-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1K30QI208-2N is suitable for 6 applications: Industrial Control Glue Logic, Telecommunication Line-Card Interface Bridge, ASIC Prototyping and HDL Verification, Video Pixel Interface Aggregator, Legacy Bus-Interface Converter, Low-Cost DSP Datapath Implementation.
Industrial Control Glue Logic
The EP1K30QI208-2N's 1728 logic elements, 147 user I/Os, and industrial -40C to +85C temperature rating make it a strong fit for industrial control glue-logic designs that previously required a gate-array ASIC. Its 24576 bits of embedded dual-port RAM are sufficient for status registers, command queues, and small lookup tables, while the six on-chip PLLs eliminate external clock-distribution parts. Compared with a microcontroller, the FPGA provides deterministic sub-microsecond response for interrupt-driven control loops, and compared with a hard-ASIC, the FPGA avoids NRE costs. The 208-pin PQFP package is robust on through-hole-style wave-soldered industrial PCBs and supports the wide parallel buses common in PLC backplanes.
Recommended
Telecommunication Line-Card Interface Bridge
The 147 user I/O pins and the 200 MHz maximum internal frequency suit the EP1K30QI208-2N for line-card interface bridging between a framer, a network processor, and a TDM backplane. The dual-port EABs can implement small elastic stores, hit/miss buffers, and HDLC FIFOs without external memory, simplifying the BOM. The 2.5 V core with 3.3 V I/O tolerates legacy 3.3 V framers while still allowing connection to modern low-voltage peripherals through level-shifted banks. Industrial temperature rating and lead-free -2N assembly make the part acceptable for carrier-grade telecom equipment operating in uncontrolled environments.
Recommended
ASIC Prototyping and HDL Verification
The EP1K30QI208-2N is widely used as a prototyping vehicle for ASICs in the 20K-50K gate range, because its 1728 logic elements, 24576 bits of EAB RAM, and Quartus / MAX+PLUS II support let engineers verify HDL designs before committing to NRE. The 208-pin PQFP gives 147 user I/Os - typically enough to break out an ASIC's pads plus the JTAG and clock pins. The Industrial temperature grade also lets prototypes run in real-world thermal chambers. When the design exceeds the EP1K30's capacity, the ACEX 1K family offers seamless migration to the EP1K50 or EP1K100 in the same tool flow.
Recommended
Video Pixel Interface Aggregator
The 147 I/Os and dual-port EAB RAM make the EP1K30QI208-2N well-suited to aggregating multiple low-resolution CMOS image-sensor pixel streams into a wider bus for downstream processing. The on-chip PLLs generate the parallel pixel clocks and the EABs can implement line buffers large enough for short video line delays. The 200 MHz internal frequency is more than sufficient for multi-Mpixel aggregate data rates at typical 54 MHz pixel clock. The 208-pin PQFP package handles the wide pixel buses better than smaller fine-pitch BGA packages that would complicate inspection.
Recommended
Legacy Bus-Interface Converter
The EP1K30QI208-2N's 147 user I/Os cover multi-bus bridging use-cases such as PCI to local bus, ISA to PCMCIA, or VME to VXI conversion in long-lifecycle industrial, aerospace, and military systems. The Industrial temperature grade is essential in these applications, while the 208-pin PQFP handles the wide, parallel legacy bus signals with comfortable signal-integrity margins. Embedded EAB RAM can be configured as FIFOs to bridge between buses of different widths and clock domains. The part's maturity and well-supported legacy tool flows make it attractive for sustaining engineering on installed bases.
Recommended
Low-Cost DSP Datapath Implementation
The EP1K30QI208-2N can host small DSP datapaths such as audio sample-rate converters, simple FIR filters, and motor-control PWM generators thanks to its 24576 bits of dual-port RAM (configurable as coefficients and delay lines) and 200 MHz internal clock. The on-chip PLLs provide clean, deterministic clock generation for the datapath. With 1728 logic elements the part is sufficient for 8-16-tap FIR filters or 16-bit audio processing. The 208-pin PQFP package is also well-suited to hand-rework and field replacement in lower-volume professional audio or test equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30QI208-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30QI208-3 | EP1K30QI208-1 | EP1K30QC208-2N | EP1K30QC208-1N | EP1K30QC208-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| User I/O Pins | 147 | 147 | 147 | 147 | 147 | 147 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | -2 | -3 (faster) | -1 (slower) | -2 | -1 | -3 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (-N suffix) | Yes (-2N) | Yes (-3N in -3N variants) | Varies (-1 vs -1N) | Yes (-2N) | Yes (-1N) | Yes (-3N) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade in the same 208-pin PQFP package as commercial variants (vs EP1K30QC208-2N)
- Lead-free (-2N) assembly versus standard -2 (vs EP1K30QI208-2)
- Balanced mid-speed -2 grade versus extreme -3 or -1 (vs EP1K30QI208-3)
- Pin-to-pin drop-in compatibility across the entire ACEX 1K 208-pin PQFP family (vs Xilinx XC3S250E Spartan-3E)
Design Notes
The ACEX 1K EP1K30QI208-2N requires a clean 2.5 V VCCINT rail and a 3.3 V VCCIO rail, both with bulk decoupling (10 uF tantalum + 0.1 uF ceramic) within 1 cm of every supply pin. Estimated: at 100% logic utilization and 200 MHz operation, core current draw reaches approximately 100-150 mA, so design the regulator for at least 250 mA of headroom. Power sequencing must satisfy VCCINT before VCCIO to prevent I/O latch-up; a Schottky diode or dedicated sequencing IC is recommended.
The 208-pin PQFP (BFQFP) has 0.5 mm lead pitch and gull-wing leads; route 4-layer PCBs with continuous ground and power planes directly under the package and escape traces between the leads on inner layers. Provide a thermal copper pour (minimum 1 sq inch) on the top layer, although the EP1K30's typical quiescent dissipation in the 0.5-1 W range rarely requires an external heatsink. Place configuration EPROM (EPC2 or compatible) within 5 cm of the FPGA to keep JTAG and configuration traces short.
Do not assume the -2N suffix changes the silicon die versus the -2 - only the lead finish differs; mixed -2/-2N placement on the same PCB is acceptable for non-RoHS-managed inventory. Avoid using both 5 V and 3.3 V signals on the same I/O bank without level shifters - the ACEX 1K I/Os are NOT 5 V tolerant. Finally, the 200 MHz 'maximum internal frequency' is for internal logic; I/O toggle rates are limited by the I/O standard and must be checked against the AC characteristics in the datasheet.
Estimated: at industrial -40C to +85C ambient, the EP1K30QI208-2N's PQFP junction-to-ambient thermal resistance is approximately 35 C/W for a 4-layer JEDEC test board. With 1 W dissipation this yields a 35 C junction rise, keeping Tj well below the 125 C silicon limit even at 85 C ambient. Designers should still verify thermal margins in enclosed housings and add airflow if I/O switching losses push dissipation above 2 W.
Compliance Information
The -2N suffix confirms lead-free assembly per Altera's legacy naming convention. RoHS compliance is indicated by the -N suffix and verified Altera PSG documentation. AEC-Q100 not applicable for industrial-grade programmable logic; halogen-free status not in verified web data.
