EPF6024AQC208-3N - FLEX 6000 FPGA, 24K Gates, 208-PQFP | Intel
MPN: EPF6024AQC208-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.9 | $23,900.00 |
EPF6024AQC208-3N Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells that the designer can wire up after manufacture. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and SPLDs: they offer higher logic density than CPLDs and are SRAM-based, requiring a configuration bitstream at every power-up. The FLEX 6000 family from Altera was the company's low-cost, SRAM-based, 3.3 V family positioned below the APEX and FLEX 10K families, targeting glue logic, bus bridges, and custom state machines where gate-array NRE was uneconomical.
Key features of the EPF6024AQC208-3N include 1,960 logic elements, 196 logic array blocks (LABs), embedded SRAM, JTAG-based IEEE 1149.1 boundary-scan support, in-system programmability via the Altera ByteBlaster or BitBlaster configuration port, and a PCI-compliant I/O option when VCCIO is tied to 3.3 V. The "A" in the part number indicates the standard commercial speed grade, "QC208" denotes the 208-pin PQFP package, and the "3N" suffix indicates speed bin 3 (slower) and lead-free / RoHS assembly. The device is normally delivered in tray packaging and is fully compatible with the MAX+PLUS II and Quartus design flows.
The FLEX 6000 architecture uses a four-input look-up table (LUT) per logic element, fast row and column interconnect, and dedicated carry chains for arithmetic. Each LE also contains a programmable register that can be configured as D, T, JK, or SR flip-flop. The device's 3.3 V supply and PCI-compliant drivers allowed direct connection to PCI bus segments in late-1990s embedded designs without external transceivers.
Typical applications include PCI bridge/logic, industrial control glue logic, telecom line-card interface, low-cost custom state machines, and legacy embedded systems requiring parallel bus arbitration. The wide PQFP form factor and 171 user I/Os make it suitable for designs that must aggregate many parallel signals.
When designing with the EPF6024AQC208-3N, observe SRAM-configuration requirements: the bitstream must be loaded from an external PROM (EPCS) or microcontroller at every power-up, and the CONF_DONE pin must be monitored to verify successful configuration. Decouple VCCINT and VCCIO with 0.1 µF and 10 µF capacitors placed close to the package, and respect the maximum I/O pin current ratings documented in the FLEX 6000 datasheet.
This page synthesizes distributor pricing from DigiKey, Mouser, Arrow, Octopart and Heisener, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving an engineer a single consolidated reference for legacy FLEX 6000 designs.
Drop-in alternatives for EPF6024AQC208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC208-3N (same form factor and footprint) — differing in Package, Configuration Method, Process Technology, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC208-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.4 / Unit
View Datasheet →EPF6024AQC208-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.85 / Unit
View Datasheet →EPF6024AQC208-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.85 / Unit
View Datasheet →EPF6024AQC208-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.75 / Unit
View Datasheet →EPF6016AQC208-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$31.2 / Unit
View Datasheet →EPF6024AQC208-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Usable Gates | 19,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Maximum Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 3.3 V |
| Package | 208-pin PQFP (BFQFP) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM (serial ByteBlaster / BitBlaster) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Speed Grade | -3 (slower) |
| Lead-Free / RoHS | Yes (N suffix) |
EPF6024AQC208-3N 208-pin pqfp (bfqfp) Pin Configuration Guide
Pin configuration for EPF6024AQC208-3N (208-pin pqfp (bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC208-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC208-3N is suitable for 6 applications: PCI Bridge and Bus Interface Logic, Industrial Control and Glue Logic, Telecom Line-Card Interface, Legacy Embedded System Replacement, Custom State-Machine and Control Plane, Design Prototyping and Educational Use.
PCI Bridge and Bus Interface Logic
The EPF6024AQC208-3N's 171 user I/Os and 3.3 V PCI-compliant drivers make it well suited to PCI bridge and bus-interface glue logic. Its 24K-gate density is enough to implement a custom PCI target/state machine plus parity and interrupt handling, while the 208-pin PQFP exposes 32-bit data plus control on a single device. With 1,960 LEs the part handles protocol conversion between legacy ISA and PCI busses at 33 MHz, and the JTAG port simplifies production board test. Compared to a discrete gate-array NRE path, the FLEX 6000 lowers prototyping cost and supports post-silicon ECO via bitstream reload.
Recommended
Industrial Control and Glue Logic
The EPF6024AQC208-3N delivers 1,960 LEs of reconfigurable logic for custom state machines, motor-control sequencers, and protocol converters in 24 V industrial environments (with external transceivers). Its 0 to 85 °C commercial operating range and 3.3 V core simplify integration with 3.3 V microcontrollers, while the 171 I/Os aggregate many parallel sensor and actuator lines. The FLEX 6000 four-input LUTs and dedicated carry chains allow counters, PWM generation, and encoder decoding without external logic ICs. Designers appreciate in-system reprogrammability for late-stage field updates on production lines.
Recommended
Telecom Line-Card Interface
The EPF6024AQC208-3N is a common choice in legacy T1/E1 and DSLAM line-card interface designs, where it implements HDLC framing, time-slot switching, and alarm scanning across multiple E1 spans. Its 1,960 LEs and 196 LABs comfortably handle 8 to 16 channels of framed data with 8-bit HDLC controllers, and the 171 I/Os accept parallel backplane buses. The 142.86 MHz internal fMAX is sufficient for 2.048 MHz E1 bit-rate processing plus overhead. The 208-pin PQFP exposes sufficient pins for serial framers, LIUs, and a local 8-bit microprocessor bus.
Recommended
Legacy Embedded System Replacement
The EPF6024AQC208-3N is frequently specified in maintenance and lifecycle-extension programs for legacy embedded systems (avionics, medical imaging, factory automation controllers) where the original Altera bitstream must be reproduced or replaced. Its 24K-gate capacity matches the logic that was typically implemented with multiple 22V10 / GAL22V10 SPLDs plus discrete MSI in early-1990s designs, allowing board consolidation. Designers can recompile existing MAX+PLUS II schematics into the same die, preserving the system's behavior. The 208-pin PQFP footprint is widely second-sourced through distributors carrying obsolete stock.
Recommended
Custom State-Machine and Control Plane
The EPF6024AQC208-3N's four-input LUTs, programmable registers (D/T/JK/SR), and fast carry chains make it a strong fit for complex multi-state control-plane sequencers in storage, networking, and instrumentation products. A single 24K-gate FLEX 6000 can replace 8 to 12 discrete 22V10 SPLDs plus latches, simplifying board layout. The 142.86 MHz fMAX supports high-speed state transitions, and the JTAG port provides BIST-style visibility into internal state. In-system programmability lets the same PCB serve multiple product SKUs by reloading different bitstreams at production.
Recommended
Design Prototyping and Educational Use
The EPF6024AQC208-3N remains popular in university digital-logic labs and in-house FPGA-training programs because FLEX 6000 reference designs and textbooks from the late 1990s are still widely available. Its 1,960 LEs and 142.86 MHz fMAX are enough to demonstrate CPU cores, simple VGA controllers, UART peripherals, and bus arbiters in a single device. Quartus II 9.0sp2 (the last version to support FLEX 6000) runs on modern Windows/Linux hosts, so students can still compile and program the part. The PQFP package is hand-solderable with practice, making it suitable for student-built PCBs.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC208-2N | EPF6024AQC208-3 | EPF6024AQC208-2 | EPF6024AQC208-1N | EPF6016AQC208-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-pin PQFP (QC208) | 208-pin PQFP (QC208) - same | 208-pin PQFP (QC208) - same | 208-pin PQFP (QC208) - same | 208-pin PQFP (QC208) - same | 208-pin PQFP (QC208) - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 (-33%) |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free / RoHS | Yes (N suffix) | Yes (N suffix) | No (SnPb) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| Speed Grade | -3 | -2 | -3 | -2 | -1 | -3 |
Key Differentiators
- Highest available speed grade in the FLEX 6000 family at this density (vs EPF6024AQC208-2N)
- Lead-free RoHS assembly (vs EPF6024AQC208-3)
- Maximum density in the FLEX 6000 family (vs EPF6016AQC208-3N)
Design Notes
The EPF6024AQC208-3N requires two 3.3 V rails: VCCINT for the core logic and VCCIO for the I/O banks. Decouple each pin with 0.1 µF ceramic placed within 3 mm of the package, and add four bulk 10 µF tantalum or polymer capacitors distributed around the PQFP perimeter. Estimated: at 100% toggle rate and typical utilization, ICCINT is roughly 200-300 mA; budget 1.5 A on VCCINT to handle worst-case configuration inrush. The CONF_DONE pin should be pulled to VCCIO through a 10 kΩ resistor to keep the device in user mode after configuration.
Because the FLEX 6000 is SRAM-based, the bitstream must be reloaded at every power-up. A common pitfall is leaving nCONFIG floating, which causes intermittent configuration failure; tie nCONFIG to VCCIO through a 10 kΩ pull-up and to a push-button or microcontroller GPIO for reconfiguration. The MSEL[2:0] pins select configuration mode (AS, PS, JTAG) and must match the chosen EPCS / EPC PROM interface. Do not drive DATA0 and DCLK before VCCINT and VCCIO have stabilized, or the configuration controller may latch into an unknown state requiring power-cycle recovery.
The 208-pin PQFP at 0.5 mm pitch requires careful PCB layout: use 0.15 mm (6 mil) traces between pads, a 0.4 mm via-in-pad or microvia escape for inner pads, and a 4-layer stack-up with continuous ground plane beneath the device. Estimated: with 1 oz copper outer layers, keep the VCCINT and VCCIO planes unbroken; route all 171 user I/Os in two fan-out layers to keep the breakout symmetrical. Add a ground ring stitched every 50 mil around the device to control return paths for the high-edge-rate I/O signals.
The PQFP-208 has a typical θJA of about 25-30 °C/W with 0 LFM airflow on a 4-layer JEDEC test board. Estimated: at 1.5 W total dissipation, the junction will rise 45 °C above ambient. Provide a 25 mm × 25 mm copper pour directly under the package on the top layer, and consider a small clip-on heatsink if the device dissipates above 2 W in a sealed enclosure. Avoid placing the FPGA next to high-current switching regulators; cross-coupling can corrupt configuration if the local VCCIO droops more than 200 mV during power-up.
Compliance Information
N suffix indicates lead-free / RoHS assembly per Altera / Intel PSG part-number convention. REACH, halogen-free, and conflict-minerals declarations are not in the verified web data - mark as unknown.
