EP1K50F256-2N - ACEX 1K FPGA, 50K Gates, 256-BGA | Altera
MPN: EP1K50F256-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.75 | $387.50 |
| 100 | $32.9 | $3,290.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $21.8 | $21,800.00 |
EP1K50F256-2N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined after manufacturing by the end user, as opposed to an ASIC whose function is fixed at fabrication. FPGAs sit in the programmable logic hierarchy: programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> LUT-based FPGA. The ACEX 1K series uses SRAM configuration cells, meaning the device is volatile and must be configured at every power-up from an external configuration memory (typically a serial configuration device such as the Altera EPC family).
Key features of the EP1K50F256-2N include 50,000 typical gates, 2,880 logic elements, 40,960 bits of embedded memory organized in EABs, 360 LABs (Logic Array Blocks), and 186 usable I/O pins. The device supports multi-volt I/O (3.3 V, 2.5 V, 1.8 V, 1.5 V LVTTL/LVCMOS), in-system programmability via JTAG, and JTAG-based boundary-scan test. The -2 speed grade places it in the mid-performance tier of the ACEX 1K family, suitable for designs clocked up to approximately 100 MHz internally depending on routing and logic utilization.
From an architectural perspective, the ACEX 1K combines a continuous routing network of FastRow and FastColumn interconnects with 360 LABs, each containing 8 logic elements (LEs). The 5 embedded array blocks (EABs) provide dual-port RAM, ROM, or FIFO functions, supporting 4,096-bit blocks that can be cascaded to 16,384 bits per EAB. The device is fabricated on a 0.22 µm SRAM process and operates from a 3.3 V core supply with separate VCCIO banks.
Typical applications include glue logic replacement, bus interface bridging (e.g., PCI to local bus), low-volume ASIC prototyping, communications protocol conversion, industrial automation controllers, and DSP co-processing front-ends. The 256-pin BGA package supports high I/O density required for parallel memory and bus interfaces.
When designing with this part, plan a configuration scheme (serial or parallel) and allocate board space for the configuration PROM. Signal integrity on the 1.0 mm-pitch BGA requires controlled-impedance PCB stack-up and proper decoupling; place 0.1 µF and 10 µF capacitors within 5 mm of every VCC pin.
This page synthesizes distributor pricing, ACEX 1K family drop-in alternatives, and practical design considerations not found in the original manufacturer datasheet.
Drop-in alternatives for EP1K50F256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K50F256-2N (same form factor and footprint) — differing in Process Technology, Configuration Method, Package, Family, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-2N
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EP1K100FC256-2N
✅ Drop-In✓ In Stock
$78.1951 / Unit
View Datasheet →EP1K30FC256-2N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP1K50F256-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K50FI256-2N
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →EP1K50F256-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Total RAM Bits | 40,960 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 5 |
| Maximum User I/O | 186 |
| Package | 256-ball FineLine BGA (F256), 1.0 mm pitch |
| Speed Grade | -2 |
| Operating Temperature | 0C to +70C (commercial) |
| Core Voltage | 3.3 V |
| I/O Standards | LVTTL, LVCMOS, 3.3 V / 2.5 V / 1.8 V / 1.5 V |
| Configuration Method | SRAM, serial or parallel via Altera EPC devices |
| Process Technology | 0.22 µm SRAM |
| Programming Interface | JTAG (IEEE 1149.1) / in-system programmable |
EP1K50F256-2N 256-ball fineline bga (f256), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP1K50F256-2N (256-ball fineline bga (f256), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50F256-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1K50F256-2N is suitable for 6 applications: Bus Interface Bridging (PCI to Local Bus), ASIC Prototyping and Emulation, Communications Protocol Conversion, Industrial Automation Controllers, DSP Co-Processing Front-Ends, Legacy System Maintenance and Field Replacement.
Bus Interface Bridging (PCI to Local Bus)
The EP1K50F256-2N is well-suited for PCI-to-local-bus bridging applications where its 50,000 typical gates and 186 user I/O pins provide enough logic and connectivity to implement 32-bit PCI target or master interfaces alongside custom local bus protocols. The 5 embedded array blocks (EABs) offer 40 Kbits of dual-port RAM for FIFO buffering between the two clock domains, and the 3.3 V LVTTL I/O standard directly matches PCI signaling. Designers typically instantiate the PCI IP core in 25-30% of the available logic elements, leaving ample headroom for the local bus state machine and DMA engine. The 256-ball BGA supports the high trace density required to fan out 32-bit PCI plus address/data buses.
Recommended
ASIC Prototyping and Emulation
Engineers commonly use the EP1K50F256-2N for low-volume ASIC prototyping because its 2,880 logic elements map cleanly to gate-level netlists of moderate-complexity ASICs. The ACEX 1K LUT-based architecture combined with abundant interconnect enables accurate timing and area emulation, while the SRAM-based configuration allows rapid design iteration via JTAG. The 256-ball BGA with 1.0 mm pitch supports the high I/O count required to break out ASIC pads for prototype validation. Typical designs include custom microcontroller peripherals, glue-logic consolidation, and signal-processing front-ends before committing to mask charges for ASIC fabrication.
Recommended
Communications Protocol Conversion
The EP1K50F256-2N fits communications protocol-conversion bridges such as UART-to-SPI, I2C-to-parallel, or HDLC-to-Ethernet adapters because its multi-volt I/O banks (3.3 V, 2.5 V, 1.8 V, 1.5 V) connect directly to mixed-voltage buses without external level shifters. The 50,000 gates comfortably accommodate state machines for both protocols plus packet buffering in EAB-based FIFOs. The device supports JTAG-based in-system programming, enabling field upgrades of the protocol firmware. Industrial automation gateways and legacy equipment adapters commonly deploy the EP1K50F256-2N as a flexible protocol translator with 186 I/Os to expose to multiple bus segments.
Recommended
Industrial Automation Controllers
Industrial PLC and motion-control subsystems use the EP1K50F256-2N for custom logic functions that do not fit standard microcontrollers, such as multi-axis encoder counters, PWM generators, and custom deterministic state machines. Its 360 LABs and 5 EABs provide the deterministic timing required for real-time control loops, and the commercial 0C-70C temperature range is adequate for most factory-floor enclosures. The 186 I/Os handle digital I/O, encoder inputs, and fieldbus transceivers in parallel. Designers pair the FPGA with optocouplers for isolation and EEPROM configuration memory for unattended field deployment.
Recommended
DSP Co-Processing Front-Ends
The EP1K50F256-2N serves as a DSP co-processor front-end by implementing custom FIR/IIR filters, FFT pre-processors, and data-rate converters that offload real-time DSP tasks from a host processor. Its EABs can be configured as coefficient tables or shift-register delay lines for high-speed multiply-accumulate chains, and the LUT-based logic elements implement distributed arithmetic at clock rates up to 100 MHz. The 186 user I/Os accept parallel ADC data and emit pre-processed streams to a host DSP. Typical deployments include vibration analysis, audio processing front-ends, and radar signal pre-conditioning in cost-sensitive embedded systems.
Recommended
Legacy System Maintenance and Field Replacement
The EP1K50F256-2N is most commonly deployed in long-lifecycle industrial, aerospace, and military programs where original ACEX 1K designs must be maintained for 15-25 years without full PCB redesign. The part supports 186 user I/Os and 50,000 gates in a familiar 256-ball BGA footprint that matches existing board layouts, so field replacements use the exact same footprint without respinning the PCB. Distributors such as Jotrin and Brilltron stock the obsolete part specifically for these legacy maintenance programs. Designers verifying obsolescence strategies should plan dual-sourcing with the EP1K50FC256-2N and validate any silicon revision differences via bench characterization.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50F256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-2N | EP1K100FC256-2N | EP1K30FC256-2N | EP1K50F256-3N | EP1K50FI256-2N |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (F256), 1.0 mm pitch | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Typical Gates | 50,000 | 50,000 | 100,000 (+100%) | 30,000 (-40%) | 50,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 4,992 (+73%) | 1,728 (-40%) | 2,880 | 2,880 |
| Total RAM Bits | 40,960 | 40,960 | 49,920 (+22%) | 24,576 (-40%) | 40,960 | 40,960 |
| LABs | 360 | 360 | 624 (+73%) | 216 (-40%) | 360 | 360 |
| EABs | 5 | 5 | 6 (+20%) | 3 (-40%) | 5 | 5 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (slower) | -2 |
| Temperature Grade | Commercial (0C to +70C) | Commercial or lead-free | Commercial | Commercial | Commercial | Industrial (-40C to +85C) |
Key Differentiators
- Mid-density ACEX 1K device in F256 BGA (vs EP1K30FC256-2N)
- Lower-density upgrade path via same package (vs EP1K100FC256-2N)
- Multi-volt I/O support without external level shifters (vs EP1K50FI256-2N)
Design Notes
The EP1K50F256-2N is obsolete and no longer in production. New designs should select the Cyclone II EP2C20F256C8N or Cyclone III EP3C10F256C8N instead - these are pin-similar in a larger 256-ball BGA but require PCB re-layout due to different ball assignments. For legacy maintenance, plan dual-sourcing with EP1K50FC256-2N to mitigate single-supplier risk. Always validate silicon revision and date code against your existing inventory before commissioning production.
BGA fanout for the 1.0 mm pitch F256 package requires a 4-layer PCB with microvia technology or 6-layer PCB with through-hole vias. Place 0.1 uF decoupling capacitors within 5 mm of every VCC pin and bulk 10 uF capacitors near each power pin group. Use a continuous ground plane on layer 2 directly beneath the BGA to provide a low-impedance return path and reduce simultaneous switching noise on the 186 I/O lines.
ACEX 1K devices are SRAM-based and volatile - they lose configuration when power is removed. A serial configuration device (EPC2, EPC4, EPC8, or EPC16 depending on bitstream size) is required for stand-alone operation. For JTAG-only programming during development, ensure MSEL[1:0] pins are pulled correctly and the nCONFIG line is properly debounced. Verify configuration timing against the EPC device datasheet before board bring-up.
With 186 user I/Os simultaneously switching, ground bounce and VCC sag can cause logic errors. Use series resistors (22-33 ohm) on clock outputs to dampen reflections, and avoid driving more than 24 outputs simultaneously without staggered switching. For LVDS or SSTL signaling, follow the ACEX 1K handbook guidelines on differential pair routing - 100 ohm differential impedance with matched lengths to within 0.5 mm.
The FineLine BGA package has a thermal resistance of approximately 15 C/W with proper PCB thermal via array (a 4x4 grid of 0.3 mm thermal vias under the die). At typical commercial operating conditions (0C to 70C), the device dissipates up to 1.5 W worst case, requiring no additional heatsinking. For industrial temperature (-40C to 85C) or sealed enclosures, place thermal vias directly under the BGA and provide adequate airflow.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not present in the Verified Web Data and are marked as unknown. The EP1K50F256-2N is obsolete as of 2026-09-07. AEC-Q100 is not applicable since this is an FPGA, not an automotive-qualified IC.
