EP1M350F780C8 - Mercury PLD FPGA 350K Gates 780-BGA | Altera
MPN: EP1M350F780C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $198 | $19,800.00 |
| 500 | $175 | $87,500.00 |
EP1M350F780C8 Overview
What is a Mercury PLD? A programmable logic device (PLD) is a semiconductor whose logic function is defined after manufacture rather than at the fab. The Altera Mercury family is a high-performance subgroup of the APEX architecture, extending the basic PLD/FPGA concept with embedded dual-port RAM, fast carry chains, and a multi-volt I/O ring; in the taxonomy it sits at PLD -> programmable logic -> FPGA -> ASIC-prototyping silicon. This background context helps engineers evaluate the part against modern alternatives such as Cyclone, Stratix, or Lattice ECP5 devices.
Key differentiating features include up to 12,160 logic elements (LEs), 4 embedded dual-port RAM blocks for on-chip memory, 8 global clock networks with up to 20 I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and in-system programmability via the IEEE 1532 / passive serial configuration interface. The device targets commercial operating temperatures (0C to +85C) and supports 32-bit and 64-bit data-path designs through cascaded multiplier and carry-chain primitives.
Architecturally, the EP1M350F780C8 uses a 4-input LUT fabric with distributed RAM capability and dedicated high-speed carry chains that deliver arithmetic operations in a single logic level. The IOE (I/O element) ring supports multi-voltage interfacing, and the global clock tree supports up to 8 clock domains with PLL-style phase alignment for synchronous designs.
Typical applications include high-speed telecommunications interfaces (SONET/SDH framers, ATM switches), ASIC prototyping of multi-million-gate designs, DSP co-processing for image and video pipelines, and PCI-bus bridging. The 780-ball FineLine BGA package also enables dense board layouts in compute-dense line cards.
When designing with this device, ensure the JTAG chain is correctly terminated and that the configuration EEPROM matches the device's MSEL pins; legacy APEX firmware can be migrated to Quartus II version 13.1 or earlier. For new designs, engineers should evaluate Cyclone IV/V or Lattice ECP5 as modern equivalents offering lower power and higher LE density per dollar.
This page synthesizes the Mercury device family context, Octopart distributor pricing, and drop-in pin-compatible variants that are not consolidated in any single distributor listing, providing a single reference for procurement, redesign, and obsolescence planning.
Drop-in alternatives for EP1M350F780C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1M350F780C8 (same form factor and footprint) — differing in Package, Operating Temperature, Family, Speed Grade, Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780C7N
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →EP1M350F780C7ES
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Contact for price
View Datasheet →EP1M350F780C7
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP1M350F780C6N
✅ Drop-In✓ In Stock
$219.4 / Unit
View Datasheet →EP1M350F780C6
✅ Drop-In✓ In Stock
$905 / Unit
View Datasheet →EP1M350F780C5N
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP1M350F780C5ES
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1M350F780C5
✅ Drop-In✓ In Stock
$1303 / Unit
View Datasheet →EP1M350F780C8 Maximum Ratings & Electrical Characteristics
| Device Family | Altera APEX Mercury (EP1M) |
| Typical Gates | 350,000 |
| Maximum Logic Elements (LEs) | 12,160 |
| Embedded RAM Blocks | 4 dual-port RAM blocks |
| Package | 780-ball FineLine BGA |
| Speed Grade | C8 (commercial, speed bin 8) |
| Operating Temperature | 0C to +85C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (up to 20 standards) |
| Global Clock Networks | 8 |
| Configuration Interface | IEEE 1532 / passive serial / JTAG |
| In-System Programmability | Yes (ISP via JTAG) |
| RoHS Status | unknown (legacy device) |
| Mounting Type | Surface Mount (BGA) |
EP1M350F780C8 780-ball fineline bga Pin Configuration Guide
Pin configuration for EP1M350F780C8 (780-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1M350F780C8 is suitable for 6 applications: Telecom Line-Card Interface (SONET/SDH Framer), ASIC Prototyping of Multi-Million Gate Designs, DSP Co-Processing for Image and Video Pipelines, PCI Bus Bridge and Legacy Peripheral Aggregation, Industrial Control and Factory Automation Backplanes, Legacy Test and Measurement Instrumentation.
Telecom Line-Card Interface (SONET/SDH Framer)
The EP1M350F780C8 fits telecom line-card framer applications because the 780-ball FineLine BGA package exposes the high pin count needed for parallel STS-1/STM-1 tributary interfaces, and the 8 global clock networks plus LVDS I/O support OC-3/STM-1 line rates. With 12,160 LEs the device absorbs both the framer state machine and the overhead-processing FIFO without external glue logic. The IEEE 1532 ISP allows field upgrades via JTAG during commissioning.
Recommended
ASIC Prototyping of Multi-Million Gate Designs
Engineers use the EP1M350F780C8 for ASIC prototyping because 350K typical gates and 12,160 LEs provide enough capacity to map representative sub-modules of a multi-million gate ASIC for at-speed verification. The C8 speed grade is conservative but predictable, simplifying timing closure against the target ASIC. The 780-ball FineLine BGA exposes dedicated JTAG and configuration pins that map cleanly to standard prototype daughter-cards.
Recommended
DSP Co-Processing for Image and Video Pipelines
The EP1M350F780C8 supports DSP co-processing because its 4 dual-port RAM blocks provide fast on-chip memory for line buffers and coefficient storage, while cascaded carry chains implement add-multiply trees in a single logic level. The 20 supported I/O standards including LVDS pair cleanly with external video ADCs and DACs. At 350K gates, the device hosts medium-complexity kernels such as 2D-DCT, motion estimation, and color-space conversion.
Recommended
PCI Bus Bridge and Legacy Peripheral Aggregation
The EP1M350F780C8 is a strong fit for PCI bus bridging because it natively supports the PCI I/O standard with the 33 MHz/66 MHz signaling required by the PCI Local Bus Specification, and the 8 global clock networks simplify the PCI clock-domain crossing. The 12,160 LEs implement the transaction layer, arbiter, and interrupt logic for legacy peripheral aggregation in industrial PCs. The 780-ball BGA package supports the high pin count for a 32-bit PCI bus plus side-band signals.
Recommended
Industrial Control and Factory Automation Backplanes
The EP1M350F780C8 fits industrial backplane aggregation because its commercial 0C to +85C temperature range covers most factory-floor environments, the 780-ball BGA supports dense backplane pin-out, and the LVDS I/O standards enable long backplane traces with strong EMI immunity. Engineers use the device to aggregate multiple fieldbus segments (PROFIBUS, DeviceNet) onto an industrial Ethernet backbone with deterministic latency.
Recommended
Legacy Test and Measurement Instrumentation
The EP1M350F780C8 serves in legacy test and measurement equipment where the same Mercury design IP must be preserved across product generations, and where in-system programmability allows field firmware updates to instrument calibration constants. The 350K-gate capacity is sufficient to host custom DSP measurement kernels, real-time signal-trigger state machines, and front-panel display controllers, while the LVDS I/O supports high-speed ADC capture front-ends.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780C6 | EP1M350F780C5 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Device Family | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) | APEX Mercury (EP1M) |
| Typical Gates | 350,000 | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) | 350,000 (same die) |
| Speed Grade | C8 (slowest commercial) | C7N (1 grade faster + N-screening) | C7 (1 grade faster) | C6 (2 grades faster) | C5 (3 grades faster) |
| Operating Temperature | 0C to +85C (commercial) | N-screening variant (may extend range) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same die, multiple speed grades provide at-speed ASIC prototyping flexibility (vs EP1M350F780C5)
- Pin-compatible across full Mercury 350K-gate family (vs EP1M350F672C7)
- 12,160 LEs vs lower-density EP1M120 family (vs EP1M120F484C7)
Design Notes
The 780-ball FineLine BGA package requires a multi-layer PCB with at least 4 routing layers and microvia or via-in-pad technology to fan out the 1.0 mm ball pitch. Decoupling capacitors (0.1 uF and 0.01 uF) must be placed as close as practical to each VCC and GND ball pair to limit transient current demand from the internal logic. According to Altera APEX Mercury design guidelines, leave at least 4 ball-pitch clearance around the BGA for escape routing and place at least one 4.7 uF bulk capacitor near the package corner.
Estimated: at typical Mercury PLD core utilization of 60% and 100 MHz internal clock, total power dissipation is approximately 1.5 W. With the FineLine BGA theta_JA of approximately 18 C/W, junction temperature rises about 27C above ambient. Ensure adequate airflow or attach a small heatsink if the design operates at >85% utilization or higher clock rates, especially in sealed industrial enclosures.
Do not confuse the EP1M350F780C8 (Mercury family, 780-ball BGA) with the EP1M120F484C8 (Mercury family, 484-ball BGA, lower density) or with the ACEX EP1K50 family which shares the speed-grade suffix but a different die. JTAG chain termination (VIO pull-up on TCK/TMS/TDO) must be present or ISP programming will fail intermittently. When migrating from Quartus II version 13.1 or earlier, confirm that all Mercury PLD IP cores are still supported before recompiling the design.
Use LVDS pairs matched within 1 mm of trace length and route them over a continuous ground plane to maintain the 100 ohm differential impedance required by the Mercury IOE. Source-synchronous clock and data traces should be length-matched within 150 ps for interfaces running above 100 MHz. Place a 100 ohm differential termination resistor near the receiver end of each LVDS pair to suppress reflections.
Compliance Information
Compliance status not stated in Verified Web Data. EP1M350F780C8 is a legacy Altera PLD introduced before RoHS compliance was mandatory for many FPGA packages; the original FineLine BGA likely contains lead-based solder balls. Engineers should verify RoHS compliance with the distributor before designing into a RoHS-restricted product.
