EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel
MPN: EP1S30F1020C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 5 | $1380 | $6,900.00 |
| 10 | $1310 | $13,100.00 |
| 25 | $1235 | $30,875.00 |
| 100 | $1095 | $109,500.00 |
EP1S30F1020C5N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to configure digital logic at the design bench rather than at the semiconductor fab. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Within that hierarchy, the Stratix family targets high-end, logic-, memory-, and DSP-intensive applications where ASIC NRE costs or time-to-market pressures make custom silicon unattractive. The EP1S30 is positioned as a mid-density member of the family, balancing logic capacity, block RAM, and I/O bandwidth for telecom, networking, and DSP prototyping systems.
Key features include 32,470 logic elements arranged in 3,247 LABs, 3,317,184 bits of embedded TriMatrix memory (the largest density at launch for this family tier), up to 726 user I/O pins, dedicated DSP blocks for high-throughput multiplier-accumulators, support for multiple I/O standards including LVDS, and on-chip phase-locked loops for clock management. Per-pin slew-rate and drive-strength control are configurable through the Quartus development tool.
Architecturally, the EP1S30 uses a sea-of-LABs layout with routing channels between rows and columns, dedicated multiplier blocks, and embedded RAM blocks of multiple depths. The 1020-ball FC-FBGA package exposes the full logic/memory/DSP fabric and is suitable for high-density boards with controlled-impedance routing. Configuration is typically via JTAG or a passive serial/parallel EPROM.
Typical applications include high-performance DSP prototyping, telecom line-card processing, military/aerospace signal processing (commercial temp grade limits to benign environments), and test & measurement backplanes. It is also used in legacy industrial controller upgrades where Stratix I designs cannot be re-targeted.
When designing, ensure the 1.5 V core and I/O bank supplies meet the sequencing requirement (VCCINT before VCCIO), use a configuration controller or EPC device for boot, and follow Altera's PCB layout guidelines for FC-FBGA escape routing and thermal pad connection.
This page synthesizes distributor pricing for the EP1S30F1020C5N, drop-in Stratix I siblings in the 1020-BGA footprint, and practical design notes not found in the original datasheet.
Drop-in alternatives for EP1S30F1020C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S30F1020C5N (same form factor and footprint) β differing in Speed Grade, Operating Temperature, Package, Package Type, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1S30F1020C5
β Drop-Inβ In Stock
$99 / Unit
View Datasheet βEP1S30F1020C6N
β Drop-Inβ In Stock
$1015 / Unit
View Datasheet βEP1S25F1020C5N
β Drop-Inβ In Stock
$640 / Unit
View Datasheet βEP1S25F1020C5
β Drop-Inβ In Stock
$650 / Unit
View Datasheet βEP1S25F1020C6N
β Drop-Inβ In Stock
$450 / Unit
View Datasheet βEP1S30F1020C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Embedded Memory (bits) | 3,317,184 |
| Maximum User I/O | 726 |
| DSP Blocks | Yes (integrated multiplier blocks, count per datasheet) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | 5 (C5) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Maximum Internal Frequency | 500 MHz |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
EP1S30F1020C5N 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP1S30F1020C5N (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S30F1020C5N is suitable for 6 applications: High-Performance DSP Prototyping, Telecom Line-Card Processing, Industrial Control and Motion Systems, Test and Measurement Backplanes, Legacy Military/Aerospace Signal Processing, Broadcast Video Processing.
High-Performance DSP Prototyping
The EP1S30F1020C5N is well-suited to DSP prototyping because its 32,470 logic elements, integrated multiplier blocks, and 3.3 Mbit of embedded memory give designers enough headroom to implement multi-channel FIR filters, FFT pipelines, and radar baseband algorithms on a single die. The C5 speed grade's 500 MHz fabric fMAX lets the prototype match near-ASIC throughput while keeping design iteration in Quartus II. With 726 user I/O, the device fans out to external ADC/DAC banks without multiplexer logic. Trade-off: at 130 nm and 1.5 V core, dynamic power is non-trivial - active thermal management is required.
Recommended
Telecom Line-Card Processing
In telecom line-card designs, the EP1S30F1020C5N has historically been used to perform packet classification, traffic shaping, and SERDES aggregation. Its 726 user I/O accommodate backplane connections and multi-gigabit LVDS lanes, while the TriMatrix memory holds routing tables and statistics counters in tightly-coupled block RAM. The 1020-BGA package supports the controlled-impedance board stack-ups required for telecom PCBs. Operating at 0-85 C commercial temperature, the device fits Climate-Controlled central-office environments; for outdoor or hardened cabinets the EP1S30F1020I6N variant is preferred.
Recommended
Industrial Control and Motion Systems
Engineers building high-axis-count CNC, robotics, or industrial-motion controllers have long adopted the EP1S30F1020C5N to host multi-axis interpolation, encoder decoding, and safety logic in a single fabric. The 3.3 Mbit embedded memory buffers trajectory data and PID state without external SRAM, while 726 I/O drive stepper/digital servo amplifiers and feedback peripherals in parallel. Industrial enclosures generally stay within the 0-85 C commercial window, but conveyor-side panels can exceed it - designers should default to the EP1S30F1020I6N for those cabinets.
Recommended
Test and Measurement Backplanes
ATE and high-channel-count test equipment leverage the EP1S30F1020C5N's 726 I/O to scan many DUTs in parallel, with the fabric implementing per-pin pattern generators, comparators, and timing sequencers. The 3.3 Mbit block RAM stores stimulus vectors locally, avoiding the latency of fetching from external memory during tight loopback tests. With C5 speed grade, edge-placement resolution supports sub-ns timing on LVDS paths. Designers must budget 130 nm dynamic power carefully, since continuous toggling of 700+ I/O at 100 MHz produces substantial dissipation.
Recommended
Legacy Military/Aerospace Signal Processing
Although the EP1S30F1020C5N's commercial 0-85 C window limits it to benign aerospace platforms, several legacy avionics and ground-station signal-processing subsystems still rely on it because the Quartus II design flow and Stratix I silicon are well-validated. The 32K LE fabric holds full-channel radar FFTs and beamforming weight generators, and the 1020-BGA package supports the controlled-impedance backplanes common in MIL-spec boards. New designs should migrate to the industrial-grade EP1S30F1020I6N or to a radiation-tolerant Kintex UltraScale equivalent.
Recommended
Broadcast Video Processing
The EP1S30F1020C5N has been used in broadcast video routers, frame synchronizers, and SDI cross-point switches, where 726 user I/O and TriMatrix memory allow several channels of uncompressed SDI to be buffered and routed in real time. Its LVDS support maps cleanly to SDI serializer/deserializer interfaces, and the C5 speed grade provides margin for 270 Mbps SDI throughput. Commercial temperature suffices for studio installations; broadcast trucks and outside-broadcast vans should adopt the EP1S30F1020I6N variant for the wider operating range.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C5 | EP1S30F1020C6N | EP1S25F1020C5N | EP1S25F1020C5 | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same | 1020-ball FC-FBGA (33 x 33 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 32,470 | 32,470 (same) | 32,470 (same) | ~25,000 (~23% lower) | ~25,000 (~23% lower) | ~25,000 (~23% lower) |
| Speed Grade | C5 (fastest) | C5 (same) | C6 (slower) | C5 (same) | C5 (same) | C6 (slower) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) |
| Lead-Free | Yes (N suffix) | No (leaded) | Yes (N suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Typical Unit Price (1 pc) | USD 1,450 | USD 1,450 (similar, as of 2026-09-07) | USD 1,200-1,300 (as of 2026-09-07) | USD 800-950 (as of 2026-09-07) | USD 800-950 (as of 2026-09-07) | USD 700-850 (as of 2026-09-07) |
Key Differentiators
- Highest logic density in Stratix I 1020-BGA family (vs EP1S25F1020C5N)
- C5 speed grade is the fastest Stratix I grade offered (vs EP1S30F1020C6N)
- Lead-free 'N' suffix for RoHS designs (vs EP1S30F1020C5)
Design Notes
Estimated: at 500 MHz internal operation with 50% toggle rate on 32K LE plus 100 LVDS I/O at 200 MHz, the EP1S30F1020C5N typically draws 1.5-2.5 A from the 1.5 V VCCINT rail. Designers must use a low-impedance buck regulator with output voltage accuracy within +/-3% and place decoupling within 5 mm of each VCCINT ball. VCCIO banks must be sequenced AFTER VCCINT per Altera's Stratix power-up requirements.
Estimated: at the worst-case load above and 85 C ambient, junction temperature can approach 110-120 C on the standard FC-FBGA-1020 thermal pad. Use a minimum 6-layer PCB with a continuous inner ground/power plane stitching under the BGA, and connect the center thermal balls through 0.3 mm via-in-pad arrays to internal copper. If the design exceeds 100 C junction, add a heatsink or forced-air cooling.
The 1020-ball FC-FBGA uses 1.0 mm pitch, which requires 0.4-0.5 mm escape traces with 0.2 mm laser-drilled microvias. Per Altera's BGA layout guidelines, use a 6-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers. All signal layers should be referenced to an uninterrupted ground plane; a stitched coplanar waveguide pattern around the BGA periphery is required for impedance-controlled LVDS traces.
Estimated: a common mistake is to omit the EPC configuration EPROM and assume JTAG-only boot - if the on-board JTAG header is unpopulated in production, the board cannot boot. The EP1S30F1020C5N requires MSEL pin settings to select AS, PS, or JTAG configuration mode; check Altera's Stratix configuration user guide. Also ensure I/O bank voltage (VCCIO) is set before driving signals into a bank to avoid CMOS latch-up.
Compliance Information
EP1S30F1020C5N carries Altera's 'N' suffix indicating lead-free packaging per Altera's Stratix ordering scheme. RoHS, REACH, halogen-free, and conflict-minerals compliance statements are not present in the Verified Web Data; they must be confirmed against the original manufacturer documentation before qualifying for restricted-substance programs. AEC-Q100 is not applicable - this is a Stratix I FPGA, not an automotive-grade IC.