EP1S30F1020I6N - Stratix FPGA, 3247 LABs, 726 I/O | Intel
MPN: EP1S30F1020I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2045.97 | $2,045.97 |
| 10 | $1995 | $19,950.00 |
| 100 | $1900 | $190,000.00 |
| 500 | $1820 | $910,000.00 |
| 1,000 | $1750 | $1,750,000.00 |
EP1S30F1020I6N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic devices -> programmable logic -> digital ICs -> semiconductors, and the Stratix family was Altera's flagship high-end family at launch, integrating logic, embedded memory blocks (TriMatrix), DSP blocks, and high-speed transceivers on a single die. Compared with CPLDs and ASICs, FPGAs offer higher logic density and on-chip parallelism while preserving reprogrammability.
Key features of the EP1S30F1020I6N include up to 33,000+ equivalent logic elements organized across 3,247 LABs, embedded TriMatrix memory for distributed and block RAM, dedicated DSP blocks for high-throughput signal processing, and Stratix I/O structures supporting multiple single-ended and differential I/O standards. The 726 user I/O count enables wide parallel buses and rich memory interfaces, while the flip-chip BGA package provides the thermal and electrical headroom required for the high I/O density.
Architecturally, Stratix devices use a 1.5 V core with dedicated PLL-based clock management, on-chip termination, and SerDes-ready I/O. The combination of TriMatrix memory and DSP blocks makes the EP1S30 well suited for DSP pipelines such as video processing, baseband signal processing, and protocol bridging. Industrial-grade (-40C to +85C) screening, indicated by the "I6" suffix, supports deployments outside controlled lab environments.
Typical applications include high-speed data acquisition, telecom baseband processing, industrial imaging, military/aerospace prototyping, network interface cards, and ASIC prototyping platforms. The large logic capacity is particularly attractive for system-on-chip emulation and pre-silicon validation, where the 726 user I/O support wide memory and bus replication.
When designing with the EP1S30F1020I6N, ensure the PCB land pattern strictly follows the 1 mm-pitch FCBGA-1020 footprint and that the supply network delivers the 1.5 V core with adequate decoupling. Thermal dissipation in FCBGA packages is dominated by the PCB; a continuous ground/power plane stack-up with thermal vias under the die is essential. Also note that the Stratix I family has reached End-of-Life for new designs; migration paths include the Stratix II/III/IV families and the Cyclone family for lower-cost replacements.
This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and PCB-layout design notes that complement but do not replace the official Stratix Device Handbook.
Drop-in alternatives for EP1S30F1020I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S30F1020I6N (same form factor and footprint) — differing in Operating Temperature, Family, Package, Logic Elements, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F1020I6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1750 / Unit
View Datasheet →EP1S30F1020C7N
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP1S30F1020C7
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EP1S30F1020C6N
✅ Drop-In✓ In Stock
$1015 / Unit
View Datasheet →EP1S30F1020C6
✅ Drop-In✓ In Stock
$262 / Unit
View Datasheet →EP1S30F1020C5N
✅ Drop-In✓ In Stock
$1095 / Unit
View Datasheet →EP1S30F1020I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix (Stratix I) |
| Logic Elements | 33,000 (approx., per Stratix I family) |
| Logic Array Blocks (LABs) | 3,247 |
| User I/O Count | 726 |
| Core Voltage | 1.5 V |
| Package | 1020-BBGA, FCBGA, 33 x 33 mm, 1 mm pitch |
| Number of Pins | 1020 |
| Operating Temperature | -40C to +85C (Industrial) |
| Speed Grade | 6 |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
EP1S30F1020I6N 1020-bbga, fcbga, 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP1S30F1020I6N (1020-bbga, fcbga, 33 x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S30F1020I6N is suitable for 6 applications: ASIC Prototyping and Pre-Silicon Validation, Telecom Baseband Signal Processing, High-Speed Data Acquisition Systems, Industrial Imaging and Machine Vision, Military and Aerospace Prototyping, Network Interface Cards and Protocol Bridging.
ASIC Prototyping and Pre-Silicon Validation
The EP1S30F1020I6N's 33,000 logic elements and 726 user I/O make it well-suited for prototyping large ASIC designs before tape-out. With 3,247 LABs distributed across the Stratix I fabric and TriMatrix embedded memory, engineers can map multi-million-gate ASICs onto one or two FPGAs in a partitioned flow. The industrial temperature grade allows prototyping in lab and field environments, while the Quartus II toolchain supports industry-standard synthesis and timing closure. Compared with smaller Stratix devices such as EP1S25, the EP1S30F1020I6N adds roughly 30% logic headroom, which is critical for fitting full SoC subsystems including CPUs, memory controllers, and peripheral IP. The 726 user I/O expose wide memory and bus interfaces needed for ASIC bring-up. Companion products include the EP1S25F1020I6N for cost-down prototyping and the EP1S40F1020 for the largest designs.
Recommended
Telecom Baseband Signal Processing
The Stratix I DSP blocks and high I/O bandwidth of the EP1S30F1020I6N make it a strong fit for telecom baseband pipelines, including WCDMA, LTE PHY, and custom air-interface prototyping. Each DSP block delivers dedicated multiply-accumulate hardware, freeing logic for control and channel coding. The 726 user I/O enable multiple parallel ADC/DAC interfaces, antenna-carrier aggregation buses, and CPRI/OBSAI fronthaul links. The 1.5 V core combined with industrial temperature screening allows deployment in outdoor base-station cabinets where ambient temperature swings are common. Compared with the smaller EP1S20, the EP1S30F1020I6N roughly doubles DSP capacity, enabling more simultaneous users or wider carrier bandwidth. Companion parts include the EP1S25F780I6N for cost-optimized base stations.
Recommended
High-Speed Data Acquisition Systems
Data-acquisition systems that stream multi-channel ADC data into memory or processing pipelines benefit from the EP1S30F1020I6N's 726 I/O and TriMatrix block RAM, which together sustain gigabit-per-second aggregate throughput. The Stratix I fabric supports LVDS, LVTTL, SSTL, and HSTL I/O standards, allowing direct connection to industrial ADCs and DACs without external level translators. Embedded PLL-based clock management simplifies multi-domain clocking between ADC sample clocks and FPGA logic clocks. Industrial temperature grade (I6 suffix) suits factory-floor and outdoor test stands. Pair the EP1S30F1020I6N with a TI ADS54J60 ADC and a DDR memory controller implemented in user logic for a complete DAQ platform. Companion options include the EP1S25F672I7N for lower-channel-count systems.
Recommended
Industrial Imaging and Machine Vision
The 726 user I/O of the EP1S30F1020I6N can ingest multiple high-resolution Camera Link, CoaXPress, or parallel LVDS image sensors simultaneously, while on-chip TriMatrix memory holds line buffers and frame statistics. Dedicated DSP blocks accelerate convolutional kernels, color-space conversion, and feature extraction in machine-vision pipelines. The industrial temperature grade (I6) supports deployment in factory automation cells where ambient temperatures reach 60-70 C. The FCBGA-1020 package's 1 mm pitch is compatible with standard high-density PCB stack-ups used in vision systems. Pair with an external DDR2 SDRAM controller for frame buffering. For lower-resolution or single-camera systems, the EP1S20F484I6N offers a smaller, cheaper Stratix I footprint.
Recommended
Military and Aerospace Prototyping
Although the EP1S30F1020I6N is industrial-grade rather than MIL-STD-883, its 3,247 LABs and 726 I/O support prototype and pre-qualification builds for military and aerospace systems, particularly in lab and ground-test roles. The wide operating temperature range (-40C to +85C) covers most benign-avionics environments. The high logic density enables IRIG-106 chapter 10 recorders, software-defined radio front-ends, and synthetic-instrumentation designs. Production deployable variants typically migrate to extended-temperature or rad-hard FPGAs after prototyping. Use the Quartus II design tools with DO-254/ED-80 documentation flows for civil aerospace projects. Companion prototyping parts include the EP1S25F1020I6N for slightly smaller designs.
Recommended
Network Interface Cards and Protocol Bridging
The EP1S30F1020I6N's 726 I/O and high logic capacity enable custom network interface cards that bridge legacy protocols (VME, cPCI, SRIO) to modern Ethernet or PCIe fabrics. The Stratix I fabric supports SGMII, PCIe via soft IP, and various SERDES-friendly I/O standards, while on-chip memory provides packet buffering. Industrial temperature screening makes the part suitable for ruggedized networking equipment deployed in substations and rail signaling. The flip-chip BGA package's thermal headroom supports sustained traffic at full I/O bandwidth. For lower-throughput bridges, the EP1S25F780I6N or EP1S20F780I6N provide cost savings with reduced I/O count. Companion controllers include TI TLK10031 SERDES and Intel 82599 10 GbE.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020I6 | EP1S30F1020C7N | EP1S30F1020C7 | EP1S30F1020C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA, FCBGA, 33 x 33 mm, 1 mm pitch | 1020-BBGA, FCBGA, 33 x 33 mm - same | 1020-BBGA, FCBGA, 33 x 33 mm - same | 1020-BBGA, FCBGA, 33 x 33 mm - same | 1020-BBGA, FCBGA, 33 x 33 mm - same |
| LABs | 3,247 | 3,247 | 3,247 | 3,247 | 3,247 |
| User I/O | 726 | 726 | 726 | 726 | 726 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | 6 | 6 | 7 (faster) | 7 (faster) | 6 (same) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade with same FCBGA-1020 footprint as commercial variants (vs EP1S30F1020C7N)
- Higher speed grade (6) at industrial temperature vs older speed-grade 5 commercial parts (vs EP1S30F1020C5N)
- Same fabric and I/O count as smaller-suffix variants, with full Altera/Intel documentation (vs EP1S30F1020I6GA)
Design Notes
The FCBGA-1020 package of the EP1S30F1020I6N dissipates heat primarily through the PCB. Estimated: at full Stratix I utilization (about 5-10 W typical, up to 15 W worst case), the junction-to-ambient thermal resistance (theta_JA) for a 33 x 33 mm FCBGA is typically 8-15 C/W on a JEDEC 4-layer test board with thermal vias. Designers should place a continuous ground/power plane stack-up directly under the BGA and use an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch) on the central ground balls to keep junction temperature below 100 C in industrial environments at 85 C ambient.
The 1.0 mm-pitch FCBGA-1020 land pattern demands tight PCB manufacturing tolerances: trace width and spacing of 100 um or finer, laser-drilled microvias, and via-in-pad construction for the inner-row balls. Use a high-Tg (>=170 C) FR-4 or low-loss PCB material to survive reflow. Allocate at least 4 PCB layers for power/ground planes to deliver the 1.5 V core and I/O supplies with low inductance. Per the Altera Stratix Hardware Reference, decouple every power pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor within 5 mm of the ball.
Estimated: configuration of Stratix I devices requires a 1.5 V core supply ramp with monotonic rise and a maximum dV/dt of 1 V/ms - violating this can latch-up the FPGA. The EP1S30F1020I6N must be held in reset (nCONFIG low) until all supplies are stable. Configuration data is loaded from a separate flash PROM (e.g. EPC16) over a dedicated parallel or serial interface; verify flash timing margin against the FPGA's data-ready handshake. Also note that the Stratix I family is NRND - new designs should consider Stratix IV/V or Cyclone V with Quartus Prime instead of the legacy Quartus II flow.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not present in the verified web data; set to 'unknown' rather than fabricating values. The EP1S30F1020I6N is not AEC-Q100 qualified - it is an FPGA not an automotive-grade IC. For definitive compliance data, contact Intel directly or check the latest datasheet revision on intel.com.
