EP1SGX25CF672C6N - 25K LE Stratix GX FPGA 672-BGA | Intel / Altera
MPN: EP1SGX25CF672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $225 | $56,250.00 |
| 500 | $210 | $105,000.00 |
EP1SGX25CF672C6N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O resources are user-configurable after manufacture. In the broader IC taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Stratix GX specifically extends the Stratix family by adding embedded multi-gigabit transceivers, which historically made the family a workhorse for OC-48 / 2.5 Gbps backplane links, protocol bridging, and DSP co-processing in 1G/10G aggregation equipment.
Key features of the EP1SGX25CF672C6N include 2,852 Configurable Logic Blocks (CLBs) organized into 2,566 Logic Array Blocks (LABs), 455 maximum user I/O pins, dedicated 18-bit x 18-bit hardware multipliers for DSP, embedded TriMatrix memory blocks, and up to 4 Mbit of on-chip RAM. The 672-pin FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm substrate, providing sufficient I/O density for wide parallel buses plus multiple transceiver differential pairs.
Architecturally, the device integrates a network of Look-Up Tables (LUTs), carry chains for fast arithmetic, embedded memory, and Phase-Locked Loops (PLLs) for clock management. The 130 nm process and 1.5 V core balance cost against speed: faster than the older 0.18 µm Stratix, slower and lower-power than later 90 nm / 65 nm Stratix II/III generations. Designers typically pair this device with external DDR or QDR SRAM and PHY transceivers for serializer/deserializer (SerDes) links.
Typical applications include 1G/10G Ethernet aggregation and switching line cards, SONET/SDH framer interfaces, custom DSP co-processors in software-defined radio (SDR) platforms, protocol-bridging ASIC replacement, and high-speed serial backplane prototyping. Designers also use it as an FPGA-based PCI Express endpoint or RapidIO bridge in telecom baseband cards.
When designing with the EP1SGX25CF672C6N, pay attention to the 1.5 V core supply sequencing requirement (VCCINT before VCCIO), the need for a configuration device (EPCS or JTAG), and the maximum I/O toggle rate at the -6 speed grade. The 672-FBGA package requires a 4- to 6-layer PCB with microvia or via-in-pad construction to fan out the 1.0 mm ball pitch.
This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout considerations not found in the standalone datasheet, providing engineers a single reference for sourcing, replacement, and design-in decisions.
Drop-in alternatives for EP1SGX25CF672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX25CF672C6N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25CF672C6
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25CF672C5
✅ Drop-In✓ In Stock
$1304.99 / Unit
View Datasheet →EP1SGX25DF672I6
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP1SGX25-CF672-I6
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →EP1S25F672C6
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP1SGX25CF672C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Maximum User I/O | 455 |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Speed Grade | -6 (commercial) |
| Operating Temperature | 0 °C to +85 °C |
| Package | 672-ball FBGA (FineLine BGA) |
| Package Size | 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP1SGX25CF672C6N 27 x 27 mm Pin Configuration Guide
Pin configuration for EP1SGX25CF672C6N (27 x 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25CF672C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX25CF672C6N is suitable for 6 applications: 1G/10G Ethernet Aggregation Line Card, SONET/SDH Framer Interface, Software-Defined Radio (SDR) Baseband, PCI Express Endpoint / RapidIO Bridge, High-Speed Serial Backplane Prototyping, Custom DSP Co-Processor.
1G/10G Ethernet Aggregation Line Card
The EP1SGX25CF672C6N integrates multi-gigabit transceivers, 25,660 logic elements, and 455 user I/O - well-matched to 1G/10G Ethernet aggregation line cards. Its on-chip TriMatrix memory buffers packets without external SRAM, while the 1.5 V core and 130 nm process deliver low jitter for serializer/deserializer (SerDes) links. Designers route SGMII or XAUI to PHY transceivers and use dedicated 18x18 multipliers for header parsing and QoS classification. This part obsoletes cleanly into Stratix II GX for new designs but remains drop-in for existing boards.
Recommended
SONET/SDH Framer Interface
Telecom SONET/SDH framers historically paired the Stratix GX family with external PHY ICs to build OC-48 and OC-192 framer blocks. The EP1SGX25CF672C6N provides the logic density, multi-gigabit transceivers, and clock-management PLLs required for STS-1/STM-1 multiplexing and pointer processing. Its 455 user I/O accommodate parallel bus interfaces to network processors, while embedded memory handles framing overhead. This makes it a strong fit for legacy telecom cards that need hardware-backed TDM aggregation.
Recommended
Software-Defined Radio (SDR) Baseband
Software-defined radio platforms use FPGAs as DSP co-processors for baseband modulation, demodulation, and channelization. The EP1SGX25CF672C6N's 25,660 logic elements plus dedicated 18x18 hardware multipliers accelerate FFT and FIR filter blocks at baseband sample rates. The 1.94 Mbit embedded memory caches filter taps, and the 672-FBGA package provides I/O bandwidth for ADC/DAC interfaces at 100-200 MSPS. Designers often pair it with high-speed ADCs like the AD9248 for wideband capture.
Recommended
PCI Express Endpoint / RapidIO Bridge
As an endpoint or bridge IC, the EP1SGX25CF672C6N implements PCI Express x1/x4 or RapidIO links using its embedded transceivers and hard IP blocks. The 25,660 logic elements accommodate a PCIe hard IP core plus application-layer DMA engines, while 455 I/O expose local bus interfaces to ASICs or DSPs. This application typically fits in industrial control cards or telecom baseband boards where deterministic low-latency I/O matters more than raw throughput.
Recommended
High-Speed Serial Backplane Prototyping
Backplane prototyping benefits from the EP1SGX25CF672C6N's multi-gigabit transceivers and 672-ball BGA, which expose sufficient differential pairs for backplane SERDES links at 2.5-3.125 Gbps. The -6 speed grade ensures timing closure at high toggle rates, and Quartus II design tools support backplane reference designs for rapid iteration. Engineers use the part as a development bridge before committing to a custom ASIC.
Recommended
Custom DSP Co-Processor
The EP1SGX25CF672C6N operates as a DSP co-processor alongside a host CPU or DSP chip, accelerating compute-intensive kernels like FFTs, encoders/decoders, and image processing. Its 18x18 hardware multipliers deliver hundreds of GMACs, while embedded RAM serves as coefficient or line buffers. The 672-ball BGA's I/O count supports LVDS links to host processors, and Quartus II supports SystemVerilog / VHDL IP integration with Nios II soft cores for control flow.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25CF672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C6 | EP1SGX25CF672C5 | EP1SGX25DF672I6 | EP1SGX25-CF672-I6 | EP1S25F672C6 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 672-ball FBGA (27x27 mm) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 18,752 (-27%) |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Maximum User I/O | 455 | 455 | 455 | 455 | 455 | 455 |
| Speed Grade | -6 | -6 | -5 (slower) | -6 (industrial) | -6 (industrial) | -6 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C | 0 to +85 °C | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C |
| Integrated Transceivers | Yes (Stratix GX) | Yes | Yes | Yes | Yes | No (Stratix base) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic density in the Stratix GX 25-tier within a 672-FBGA footprint (vs EP1S25F672C6)
- Integrated multi-gigabit transceivers (vs EP1S25F672C6)
- Commercial temperature bin (vs EP1SGX25DF672I6)
- -6 speed grade availability (vs EP1SGX25CF672C5)
Design Notes
The EP1SGX25CF672C6N requires careful power sequencing: VCCINT (1.5 V core) must ramp before VCCIO banks to prevent internal latch-up. Use a sequencer IC such as the LTC2923 or a dedicated Altera-supplied power-tree reference. Decouple each VCCINT pin with a 0.1 µF X7R ceramic + 10 µF bulk capacitor within 5 mm of the BGA pad. Estimated: at full utilization (~25 kLE + transceivers active), the device draws approximately 1.5-2.5 W core power; budget at least 3 W per supply rail in the thermal analysis.
The 672-ball FBGA uses a 1.0 mm ball pitch on a 27 x 27 mm substrate. Breakout requires 4- to 6-layer PCB construction with microvias (0.1 mm drill, 0.25 mm pad) or via-in-pad to escape the dense inner balls. Route differential SerDes pairs with controlled 100 Ω differential impedance and keep lengths matched within 150 mils. Reference the Altera AN 359 or AN 506 for Stratix GX PCB layout guidelines.
Estimated: at 2 W total dissipation and a 672-FBGA with no exposed thermal pad, junction-to-ambient thermal resistance (θJA) on a 4-layer 1 oz copper PCB is approximately 18-22 °C/W. This yields a junction temperature rise of 36-44 °C above ambient at full load. For commercial 0-85 °C operation, ambient must remain below 41-49 °C at peak load - typical for forced-air-cooled chassis but tight for sealed enclosures.
Multi-gigabit transceiver pairs require matched-length routing with 100 Ω differential impedance. Keep the AC-coupling capacitors within 200 mils of the FPGA transmit pins. Reference plane continuity is mandatory under all SerDes traces - never cross a plane split with a high-speed serial link. Use HyperLynx or SiSoft QCD for pre-layout channel simulation per the Stratix GX handbook.
Common mistakes include: (1) failing to use a configuration device (EPCS4/EPCS16 or JTAG download cable), (2) leaving unused LVDS pairs floating instead of biasing per the handbook, (3) ignoring the tRAMP ramp-rate spec for VCCINT (must be monotonic), and (4) assuming bitstream compatibility across speed grades - bitstreams generated for -6 are not guaranteed to work on -5 hardware. Always recompile the Quartus project when switching bins.
Compliance Information
RoHS compliant per DigiKey/Mouser product listings. Not AEC-Q100 qualified - this part targets commercial/industrial non-automotive applications. Lead-free per package markings; halogen-free status not published by manufacturer.
