EP4CGX150DF27C7N - Cyclone IV GX FPGA 149K LE | Intel
MPN: EP4CGX150DF27C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP4CGX150DF27C7N Overview
A Cyclone IV GX FPGA is a low-power, SRAM-based programmable logic device that combines general-purpose fabric (look-up tables, flip-flops, DSP blocks, and embedded memory) with high-speed serial transceiver channels and hard PCIe/Gigabit Ethernet MAC IP. It belongs to the broader category of programmable logic devices (PLDs) within the FPGA hierarchy, which sit alongside microcontrollers and ASICs as the three dominant digital implementation platforms. Compared with ASICs, an FPGA provides reconfigurable hardware with shorter time-to-market and zero NRE cost; compared with microcontrollers, an FPGA offers parallel hardware acceleration for compute-intensive workloads such as signal processing, image processing, and protocol bridging.
Key features include 8 integrated transceivers operating up to 3.125 Gbps, hard PCIe Gen1 x1/x2/x4 IP cores, 720 embedded 18x18 multipliers, 6,635,520 bits of RAM, and a true LVDS serializer/deserializer capability. The device also supports external memory interfaces up to DDR2 SDRAM, QDRII SRAM, and RLDRAM II, enabling high-throughput data buffering in streaming applications. Cyclone IV GX parts cut static power by up to 30 percent relative to Cyclone III devices at the same logic density, which simplifies thermal design in compact enclosures.
Typical applications include industrial vision and machine vision cameras, motor control and factory automation, broadcast video processing, software-defined radio front-ends, medical imaging preprocessing, and PCIe-based add-in cards. The 672-pin FBGA package offers ample signal integrity margin for parallel DDR2 interfaces and provides the routing headroom needed for eight transceiver channels plus their reference clocks and bias networks.
When designing with this device, pay close attention to transceiver channel placement and reference-clock distribution: each quad requires a dedicated PLL and a precision external reference clock with sub-500 ppm accuracy. Use the Quartus II design suite (or the current Intel Quartus Prime release that retains Cyclone IV support) for synthesis, place-and-route, and signal-integrity-aware board-level IBIS-AMI simulation.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design notes drawn from the manufacturer Cyclone IV device handbook to help engineers select the right FPGA for cost-sensitive high-volume designs.
Drop-in alternatives for EP4CGX150DF27C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX150DF27C7N (same form factor and footprint) β differing in Package, Speed Grade, Transceivers, Operating Temperature, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX150DF27C7
β Drop-Inβ In Stock
$390 / Unit
View Datasheet βEP4CGX150DF27C6N
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP4CGX150DF27C7N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone IV GX |
| Series | EP4CGX150 |
| Logic Elements | 149,760 |
| Embedded Memory Bits | 6,635,520 |
| Maximum User I/O Pins | 393 |
| Embedded 18x18 Multipliers | 720 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Hard PCIe Gen1 IP | Yes (x1, x2, x4) |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Package | 672-ball FBGA (FineLine BGA) |
| Speed Grade | C7 (commercial, fastest) |
| Temperature Grade | Commercial (0C to +85C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4CGX150DF27C7N 672-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP4CGX150DF27C7N (672-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX150DF27C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX150DF27C7N is suitable for 6 applications: Industrial Machine Vision Cameras, Industrial Motor Control and Factory Automation, Broadcast Video Processing and Format Conversion, Software Defined Radio Front-End Processing, Medical Imaging Preprocessing, PCIe-Based Add-In Cards.
Industrial Machine Vision Cameras
The EP4CGX150DF27C7N fits machine vision pipelines where 393 user I/O pins can drive multi-lane MIPI-CSI or LVDS image sensor arrays while its eight 3.125 Gbps transceivers aggregate processed frames to a host PC over Gigabit Ethernet. With 720 embedded 18x18 multipliers, the FPGA can run real-time Bayer demosaic, lens distortion correction, and edge detection in parallel hardware, offloading the host CPU. The 6,635,520 bits of embedded memory buffer full-HD lines for line-scan processing, and the 1.2 V core keeps thermal output low enough for sealed IP67 camera housings.
Recommended
Industrial Motor Control and Factory Automation
For multi-axis servo drives and EtherCAT/SERCOS III masters, the EP4CGX150DF27C7N delivers the parallel PWM channels and encoder interfaces demanded by 16-axis control loops. Its hard PCIe Gen1 IP provides direct host coupling for PC-based CNC controllers, while the eight transceivers drive deterministic industrial Ethernet links. The 720 DSP blocks accelerate Park/Clarke transforms and SVPWM modulation in microsecond loops. Industrial temperature screening is met by the commercial grade (0-85C) when paired with adequate enclosure airflow.
Recommended
Broadcast Video Processing and Format Conversion
The 6,635,520 bits of embedded RAM and 393 I/O count make the EP4CGX150DF27C7N well suited to SDI/HDMI aggregation, color-space conversion, and frame-rate conversion in broadcast studio equipment. Each quad transceiver can receive 3G-SDI streams at 2.97 Gbps, with four transceivers supporting quad-link 12G-SDI or 4K transport over four 3G-SDI cables. The 720 DSP blocks run real-time scaling and deinterlacing algorithms; the FBGA-672 package provides the signal-integrity margin required for parallel DDR2 line buffers.
Recommended
Software Defined Radio Front-End Processing
In SDR systems the EP4CGX150DF27C7N functions as the digital down-conversion and channelization engine after the ADC. Its eight 3.125 Gbps transceivers accept JESD204B-class ADC data at sub-3 Gbps lane rates, while 720 DSP blocks implement digital down-conversion, decimation, and pulse shaping in real time. The hard PCIe Gen1 IP streams baseband I/Q to a host DSP card for higher-layer demodulation. Logic density of 149,760 LEs supports 8-16 simultaneous narrowband channels in a single chip.
Recommended
Medical Imaging Preprocessing
For ultrasound beamforming and endoscopy preprocessing, the EP4CGX150DF27C7N's 720 18x18 multipliers implement real-time delay-and-sum beamforming across 64-128 channels with sub-microsecond latency. Its eight transceivers carry raw RF data from probe heads at lane rates of 2.5 Gbps, while embedded memory buffers full frame captures before compression. The 1.2 V core plus 30 percent lower static power than Cyclone III keeps thermal output acceptable for cart-based portable ultrasound units. Commercial temperature grade suffices for clinical environments with controlled HVAC.
Recommended
PCIe-Based Add-In Cards
With hard PCIe Gen1 x1/x2/x4 IP cores, the EP4CGX150DF27C7N enables drop-in PCIe endpoint cards for protocol analyzers, data-acquisition boards, and FPGA accelerator cards. The eight transceivers double as upstream links to companion FPGAs or as external 10G-style aggregation channels. The FBGA-672 package footprint is compatible with standard PCIe x4/x8 card edge keep-outs, while the 393 I/O pins drive high-density backplane connectors. Quartus II PCIe hard IP reduces soft-logic overhead by approximately 25,000 LEs versus soft PCIe implementations.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX150DF27C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150DF27C7 | EP4CGX150DF27C6N | EP4CGX110DF27C7N |
|---|---|---|---|---|
| Package | FBGA-672 (F27) | FBGA-672 (F27) - same | FBGA-672 (F27) - same | FBGA-672 (F27) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 149,760 | 149,760 | 149,760 | 109,424 |
| Transceivers | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps |
| Embedded Memory | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 4,860,000 bits |
| Speed Grade | C7 (fastest commercial) | C7 | C6 | C7 |
| Hard PCIe Gen1 IP | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) |
| DSP 18x18 Multipliers | 720 | 720 | 720 | 420 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest-density Cyclone IV GX part in the 672-ball F27 package (vs EP4CGX110DF27C7N)
- Faster speed grade than C6 variant (vs EP4CGX150DF27C6N)
- Includes integrated 3.125 Gbps transceivers (vs EP4CE115F29C8N (Cyclone IV E))
Design Notes
Estimated: At typical utilization (~70% LEs, 100% transceivers, 100% memory) the EP4CGX150DF27C7N draws approximately 3-4 W dynamic plus up to 1 W static, requiring a 1.2 V regulator rated at least 4 A continuous. Each transceiver channel adds roughly 100 mA on the 1.2 V VCCH rail and 50 mA on the 2.5 V VCCA when active. Decouple all eight VCCH balls with 0.1 uF MLCCs in parallel with 10 uF bulk capacitors placed within 5 mm of the balls.
Each transceiver quad (four channels) requires its own dedicated reference clock with sub-500 ppm accuracy and a board-level impedance of 100 ohm differential. Trace length matching for the PCIe Gen1 lanes must remain within 150 mil of the 672-ball FBGA's transceiver balls. Use Intel/Altera's Cyclone IV GX board design guidelines for stack-up recommendations: at least 6 PCB layers with stripline routing for high-speed serial lanes.
Do not confuse the F27 package (FBGA-672, 27 mm body, 8 transceivers) with the F23 package (FBGA-484, 23 mm body, no transceivers) - the F23 part lacks the transceiver balls entirely. When migrating from EP4CGX150DF27C7N to EP4CGX150CF23C7N for cost savings, the PCB must be redesigned because the F23 footprint is not pin-compatible. Always confirm the package code in the ordering string before board spin.
Route JTAG, MSEL[2:0], nCE, nCONFIG, and CONF_DONE through 10 kohm pull-ups to 3.3 V to ensure proper configuration from EPCS flash. Provide a clean 100 MHz clock to the CLK0 dedicated pin for transceiver PLLs and use a precision crystal with 50 ppm stability to keep PCIe Gen1 link training reliable across industrial temperature range.
Compliance Information
RoHS compliant per Intel/Altera product page ordering-code suffix 'N'. AEC-Q100 not applicable - this is a commercial-grade FPGA; industrial temperature variants exist in the same EP4CGX150 family (e.g. EP4CGX150DF27I7N).