Intel

EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

Name: EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
Brand: Intel
SKU: EP1SGX25CF672I6N
Price: 171 USD
Availability: InStock

MPN: EP1SGX25CF672I6N ⚠ Last Time Buy

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1.5 V Vdss 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch Package 6 Speed

From $171 USD / Unit

MOQ: 1 |

Price updated: 2026-09-07

Volume Pricing

Qty	Unit Price	Extended
1	$285	$285.00
10	$256.5	$2,565.00
100	$228	$22,800.00
500	$199.5	$99,750.00
1,000	$171	$171,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP1SGX25CF672I6N Overview

The Intel (Altera) EP1SGX25CF672I6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements and 2,852 Configurable Logic Blocks (CLBs) into a 672-ball FineLine BGA package (27 mm x 27 mm, 1 mm pitch). The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and provides 455 user I/O pins along with up to 20 dedicated high-speed transceivers for serial interconnect.

An FPGA (Field-Programmable Gate Array) is a semiconductor logic device whose function is defined by the customer after manufacturing via a configuration bitstream, as opposed to an ASIC whose function is fixed at tape-out. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD) -> logic IC -> integrated circuit. The Stratix GX sub-family extends the general-purpose Stratix architecture with embedded multi-gigabit transceivers, targeting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI. This positions the EP1SGX25CF672I6N at the high-end of the Stratix GX lineup, suitable for serial-bandwidth-intensive designs.

Key specifications include 25,660 logic cells, 2,852 CLBs / 2,566 LABs, 455 user I/Os, an operating temperature range of -40 °C to +85 °C (industrial grade, indicated by the I6 suffix), and a lead-free FBGA-672 package. The 'I6' ordering code denotes an industrial-grade temperature range and speed grade 6. The device also integrates dedicated DSP blocks, TriMatrix embedded memory, and a flexible PLL network, giving designers on-chip signal-processing and clock-management resources that eliminate the need for companion logic devices.

Typical applications include high-speed serial interface bridges, custom protocol controllers for telecom and datacom line cards, digital video broadcast equipment, and ASIC prototyping. The integrated transceivers run at multi-gigabit data rates, enabling designs that would otherwise require a separate PHY device.

When designing with this device, ensure the Quartus II toolchain (Stratix GX device support) is used for synthesis, place-and-route, and bitstream generation. Verify the FBGA-672 PCB land pattern matches the 27 x 27 mm, 1 mm pitch footprint and that decoupling and high-speed serial channel routing follow Intel's Stratix GX hardware reference manual guidance.

This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP1SGX25CF672I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP1SGX25CF672I6N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Process Technology, Logic Elements.

EP1SGX10CF672C7N

Intel

Operating Temperature: 0 °C to 85 °C

Logic Elements: 10,570