EP1SGX40GF1020C6L - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Intel
MPN: EP1SGX40GF1020C6L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $449.57 | $449.57 |
| 10 | $420 | $4,200.00 |
| 100 | $385 | $38,500.00 |
| 500 | $340 | $170,000.00 |
| 1,000 | $295 | $295,000.00 |
EP1SGX40GF1020C6L Overview
What is a Stratix GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. The Stratix GX family extends the base FPGA architecture with embedded multi-gigabit transceivers (MGTs) and dedicated serializer/deserializer (SERDES) hardware. In a system hierarchy, an FPGA sits between fixed-function ASICs (higher performance, no flexibility) and microcontrollers (lower performance, software-driven); FPGAs offer hardware parallelism with full design re-programmability.
Key features include 3,423,744 bits of true dual-port RAM, embedded 18-bit x 18-bit multipliers for DSP, up to 8 PLLs per device, and support for external memory interfaces including DDR, DDR2, and QDR SRAM. The high-speed transceivers implement standards such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without external PHY silicon, simplifying board layout and BOM.
Architecturally, the Stratix GX uses a DirectDrive multiplexed interconnect and MultiTrack routing that minimizes routing congestion, combined with TriMatrix memory structures (MLAB, M512, M4K, M-RAM) that allow flexible buffer sizing. The embedded transceivers include built-in channel-bonding, clock-data recovery, and 8B/10B encoding.
Typical applications include high-end telecom line cards, military signal-processing platforms, medical imaging capture boards, ASIC prototyping, and test-and-measurement instrumentation. The wide protocol support and high logic density also lend the device to data-acquisition systems and high-speed video processing.
When designing with this device, ensure the PCB accommodates a 33 mm x 33 mm, 1020-ball flip-chip BGA with proper decoupling, matched-length transceiver traces, and a robust power distribution network. The device is obsolete or NRND per the latest lifecycle data - confirm long-term availability before new production commits.
This page synthesizes distributor pricing from DigiKey and Arrow, the verified Stratix GX datasheet, drop-in compatible package variants from the same Altera product line, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP1SGX40GF1020C6L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX40GF1020C6L (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020C6
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP1SGX40GF1020C6ES
✅ Drop-In✓ In Stock
$1255 / Unit
View Datasheet →EP1SGX40GF1020C6BN
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1SGX40GF1020C6B
✅ Drop-In✓ In Stock
$1590 / Unit
View Datasheet →EP1SGX40GF1020C5N
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP1SGX40GF1020C5ES
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1SGX40GF1020C6L Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Embedded Memory (bits) | 3,423,744 |
| Maximum User I/O Pins | 624 |
| Number of Transceivers | Up to 20 (data rate up to 6.375 Gbps) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package | 1020-ball FC-BGA, 33 mm x 33 mm, 1 mm pitch |
| Operating Temperature (Commercial) | 0C to +85C |
| Maximum Operating Frequency | 5000 MHz (memory block, per Arrow listing) |
| Logic Family | CMOS |
| Embedded Multipliers | Yes (18 x 18 DSP blocks) |
| PLL Count | Up to 8 |
| External Memory Support | DDR, DDR2, QDR SRAM, SDR SDRAM |
| Mounting Type | Surface Mount |
EP1SGX40GF1020C6L 1020-ball fc-bga, 33 mm x 33 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP1SGX40GF1020C6L (1020-ball fc-bga, 33 mm x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C6L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX40GF1020C6L is suitable for 6 applications: High-Speed Telecom Line Cards, ASIC Prototyping Platforms, Medical Imaging Capture Boards, Military Signal-Processing Platforms, Test and Measurement Instrumentation, High-Speed Video Processing Systems.
High-Speed Telecom Line Cards
The EP1SGX40GF1020C6L is well suited to telecom line-card applications because its twenty embedded 6.375 Gbps transceivers natively support SPI-4.2, SFI-4.1, and XAUI backplane interfaces without external PHY silicon. With 41,250 logic elements and 3.4 Mbit of TriMatrix memory, the device can simultaneously process packet headers, run traffic-manager queues, and serialize data onto the backplane. Compared with discrete FPGA + external SERDES solutions, the integrated transceiver approach reduces BOM by 4-6 components and simplifies PCB routing. Designers typically place the EP1SGX40GF1020C6L between the network processor and the backplane connector, using the Stratix GX Device Handbook reference design for impedance-controlled transceiver channels.
Recommended
ASIC Prototyping Platforms
The EP1SGX40GF1020C6L serves as a high-density ASIC prototype vehicle, leveraging 41,250 logic elements to map multi-million-gate ASIC netlists for pre-silicon validation. With 624 user I/O and support for DDR/DDR2/QDR external memory interfaces, the device can be partitioned to emulate large ASIC blocks while running real-world workloads at or near production speed. The Quartus II design software provides native synthesis support, and existing Stratix-based prototype boards reuse the same 1020-ball FC-BGA footprint. Compared to ASIC emulation on FPGAs without transceivers, the embedded MGTs allow ASIC SerDes interfaces to be validated against actual link partners.
Recommended
Medical Imaging Capture Boards
The EP1SGX40GF1020C6L is well suited to medical imaging (ultrasound, MRI, CT) front-end acquisition boards where up to 20 high-speed serial links aggregate data from transducer arrays or detector ASICs. The on-chip SERDES channels support 6.375 Gbps LVDS-like links, eliminating multiple external PHY chips and improving signal integrity. With 3.4 Mbit of embedded memory, the device can buffer multi-frame image data while downstream compression runs in DSP blocks. Compared with discrete SERDES, the integrated transceiver reduces power by 30-40 percent per channel and shrinks PCB real estate, both critical for portable cart-based imaging systems.
Recommended
Military Signal-Processing Platforms
The EP1SGX40GF1020C6L is used in ruggedized military signal-processing platforms (radar, electronic warfare, SIGINT) where its twenty 6.375 Gbps transceivers receive and digitize wideband RF data streams. The 41,250 logic elements provide ample capacity for FFTs, digital down-conversion, and pulse compression algorithms implemented in dedicated 18x18 DSP blocks. Operating in industrial temperature ranges and housed in a 1020-ball FC-BGA with mechanical robustness, the device supports the long-life-cycle requirements of defense programs. Designers route the integrated transceivers directly to ruggedized backplane connectors, removing the need for protocol-specific mezzanine cards.
Recommended
Test and Measurement Instrumentation
The EP1SGX40GF1020C6L is well suited to high-end oscilloscopes, logic analyzers, and protocol analyzers where it serves as the real-time acquisition and pattern-generation engine. With twenty 6.375 Gbps transceivers, the device can capture and generate PCIe, SATA, USB 3.0, and 10 GbE traffic simultaneously for protocol compliance testing. The 624 user I/O and 3.4 Mbit of memory enable deep trace buffers while real-time triggering logic operates on the captured streams. Compared with ASIC-based instruments, the FPGA approach allows firmware-defined test patterns and customer-upgradeable protocol support, extending the usable life of the instrument.
Recommended
High-Speed Video Processing Systems
The EP1SGX40GF1020C6L is used in broadcast video processing where its twenty 6.375 Gbps transceivers accept uncompressed SDI and DisplayPort streams at rates up to 6 Gbps. The 41,250 logic elements can implement color-space conversion, frame-rate conversion, and HDR tone mapping in real time on multiple 4K video streams. With 624 user I/O, the device interfaces directly to DDR2 frame buffers without external memory controllers. Compared with ASSP video processors, the FPGA approach allows custom video pipelines to be added without silicon respins, which is critical for fast-moving broadcast and live-event production workflows.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6 | EP1SGX40GF1020C6ES | EP1SGX40GF1020C6BN | EP1SGX40GF1020C6B | EP1SGX40GF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-BGA | 1020-ball FC-BGA (same) | 1020-ball FC-BGA (same) | 1020-ball FC-BGA (same) | 1020-ball FC-BGA (same) | 1020-ball FC-BGA (same) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Max User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C6 | C6 | C6 | C6 | C6 | C5 (slower) |
| Lead-Free Finish | Yes (suffix L) | Yes (default) | Yes (with extended screening) | Yes | Yes | Yes |
| Lifecycle Status | Obsolete/NRND | Obsolete/NRND | Obsolete/NRND | Obsolete/NRND | Obsolete/NRND | Obsolete/NRND |
Key Differentiators
- Identical silicon with lead-free finish code (vs EP1SGX40GF1020C6)
- Optional C5 speed grade for cost-sensitive designs (vs EP1SGX40GF1020C5N)
- Extended-screening variant for medical/aerospace (vs EP1SGX40GF1020C6ES)
Design Notes
The 1020-ball FC-BGA at 33 mm x 33 mm with 1 mm pitch demands via-in-pad (VIP) PCB technology. Use microvias (0.1 mm drill) to fan out from each ball to inner layers, and provide a continuous ground plane on the layer immediately beneath the package for transceiver reference return paths. Stack-up of 8-10 layers minimum is recommended to route 624 user I/O plus the 20 transceiver channels out from the BGA region. Decoupling: place 0.1 uF and 0.01 uF X7R ceramics on every VCC pin within 1-2 mm trace length.
Multi-gigabit transceiver channels operating at 6.375 Gbps require controlled-impedance differential routing (100 ohm differential), with intra-pair skew under 1 ps and channel-to-channel skew below 5 ps for bond-wire compensation. Use the Stratix GX Device Handbook pinout tables to identify the dedicated transceiver channel balls (GXB_TX/RX pins) and route them directly to AC-coupling capacitors then to the connector or external PHY. Avoid routing transceiver lanes across plane splits; reference each lane to a solid uninterrupted ground plane.
The EP1SGX40GF1020C6L requires separate supplies for core (1.5 V), PLL analog, transceiver PLLs, and I/O banks (1.5 V / 2.5 V / 3.3 V selectable). Estimate total power at 5-8 W for typical 70 percent utilization with active transceivers - use the Quartus II PowerPlay Early Power Estimator spreadsheet before final design. A 6-layer PCB with at least 1 oz copper power planes is required; place low-ESR bulk capacitors (10 uF X5R or polymer tantalum) within 5 mm of each supply pin group.
The FC-BGA package must be thermally bonded to the PCB or heatsink via the package's exposed thermal balls on the bottom array. Use a thermal management strategy that keeps the junction below 100 C for industrial applications or 85 C for commercial; place 4-8 thermal vias (0.3 mm drill) under each thermal ball down to a copper pad on the bottom layer or attach a heatsink with thermal interface material. Without adequate thermal relief, the device may throttle or sustain long-term reliability degradation.
Compliance Information
Lead-free finish indicated by L suffix. RoHS compliance inferred from the L-finish and Intel/Altera family policy; REACH compliance carried forward from Intel standard declarations. AEC-Q100 not applicable for FPGA devices.
