EP20K1500CF33C9 - APEX 20K 1.5M Gates FPGA | Intel (Altera) | 1020-FBGA
MPN: EP20K1500CF33C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $89.5 | $895.00 |
| 100 | $82 | $8,200.00 |
| 500 | $75 | $37,500.00 |
| 1,000 | $68.5 | $68,500.00 |
EP20K1500CF33C9 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM and high-speed transceivers. APEX 20K belongs to the early-2000s multi-domain programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The APEX 20K family was one of the first to combine LUT-based logic, dedicated multiplier/adder blocks, and dual-port embedded SRAM on a single device.
Key features include up to 1.5M system gates, embedded system blocks (ESBs) supporting dual-port RAM, ROM, CAM, and FIFO functions, multi-voltage I/O support (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL), in-system programmability via JTAG, and built-in Boundary-Scan (IEEE 1149.1). The FineLine BGA-1020 package offers high I/O density (808 user I/O pins) suitable for high-pin-count ASIC prototyping and multi-bus bridging designs.
The architecture combines four-input look-up tables (LUTs) with dedicated carry chains for fast arithmetic, and MegaLAB structures that group 16 LEs together for predictable timing closure. I/O banks support multiple single-ended and differential standards, allowing direct interface to SRAM, SDRAM, and processor buses without external transceivers.
Typical applications include ASIC prototyping, high-speed data-path glue logic, telecommunications line cards, networking equipment, DSP co-processing, and industrial control. The 33 mm package footprint with 808 user I/Os is well suited to designs that need wide parallel buses or many LVDS pairs.
When designing with this device, verify power integrity using the Quartus PowerPlay early-power estimator and place decoupling capacitors within 100 mils of each power pin. Confirm signal-integrity simulations for HSTL/SSTL memory interfaces because the 33 mm BGA may require matched-length routing on inner stripline layers.
This page synthesizes distributor stock and pricing data, drop-in alternatives from the APEX 20K and Stratix families, and practical design notes not collected on any single manufacturer page.
Drop-in alternatives for EP20K1500CF33C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K1500CF33C9 (same form factor and footprint) — differing in Series, Family, Operating Temperature, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1500CF33C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1090 / Unit
View Datasheet →EP20K1500CF33C8ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$288 / Unit
View Datasheet →EP20K1500CF33C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$205 / Unit
View Datasheet →EP20K1500CF33C7ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138 / Unit
View Datasheet →EP20K1500CF33C9
✅ Drop-In✓ In Stock
$68.5 / Unit
View Datasheet →EP20K1500CF33C9 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | EP20K1500 |
| Device Type | FPGA (SRAM-based, in-system programmable) |
| Approximate System Gates | 1,500,000 |
| Logic Elements (max, family) | 212,992 |
| Embedded Memory (ESB, max, family) | 432 Kbit |
| Package Code | HBGA / FineLine BGA |
| Pin / Ball Count | 1020 |
| Package Size | 33 x 33 mm |
| User I/O Count (family) | 808 |
| Operating Temperature | 0C to +85C (Commercial, C grade) |
| Speed Grade | -9 (fastest commercial) |
| Supply Voltage (core) | 1.8 V typical |
| Configuration Mode | SRAM / JTAG (in-system) |
| Mounting Type | Surface Mount |
| RoHS Status | Unknown (legacy family) |
| Lifecycle Status | Obsolete / Last-time-buy (per Intel PDN) |
EP20K1500CF33C9 33 x 33 mm Pin Configuration Guide
Pin configuration for EP20K1500CF33C9 (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1500CF33C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K1500CF33C9 is suitable for 6 applications: ASIC Prototyping, Telecommunications Line Cards, Networking Equipment Routers and Switches, DSP Co-Processing, Industrial Control Systems, Test and Measurement Instrumentation.
ASIC Prototyping
The EP20K1500CF33C9's 1.5M system gates, 432 Kbit embedded memory, and 808 user I/Os make it well suited for ASIC prototyping of large multi-million-gate designs. Engineers can map multiple clock domains and instantiate realistic memory subsystems (SRAM, dual-port RAM) in the ESBs while preserving pin-level timing of the target ASIC. The 1020-ball FineLine BGA package supports up to 808 I/O for high-fanout buses.
Recommended
Telecommunications Line Cards
The EP20K1500CF33C9 provides the glue logic, framing buffers, and protocol bridging required in legacy telecom line cards (T1/E1, TDM, ATM). Its embedded system blocks can implement dual-port FIFO and CAM lookups, while multi-voltage I/O (LVTTL, HSTL, SSTL) directly interfaces to network processors and PHY chips. The commercial temperature range (0C to +85C) is acceptable for climate-controlled CO environments.
Recommended
Networking Equipment Routers and Switches
Routing engines and switching fabrics benefit from the EP20K1500CF33C9's wide I/O bus (808 pins) for direct connection to TCAM, SRAM, and 32/64-bit processor interfaces. The embedded memory blocks can hold route tables, packet descriptors, or statistical counters with deterministic two-cycle access. Quartus II design flow supports IP cores for HDLC, POS-PHY, and SPI-4.2 used in legacy routers.
Recommended
DSP Co-Processing
The EP20K1500CF33C9 can act as a co-processor for legacy DSPs (TI TMS320C6x, Analog Devices SHARC) by offloading FFT, Viterbi, or FIR tasks. Its four-input LUTs with dedicated carry chains deliver high multiplier/adder throughput, and the embedded system blocks provide coefficient memory and ping-pong buffers. The 33x33 mm FBGA gives clean board-level signal integrity at LVDS rates.
Recommended
Industrial Control Systems
The EP20K1500CF33C9 supports real-time industrial protocols (Modbus, PROFIBUS, CAN) by integrating state-machine control, encoder decoding, and PWM generation in a single device. The 1020-ball BGA package provides sufficient I/O for multi-axis motor control with encoder feedback, while the ESBs hold position tables and trajectory buffers. Commercial temperature range suits factory-floor enclosures.
Recommended
Test and Measurement Instrumentation
The EP20K1500CF33C9 implements pattern generation, sequencing, and parallel data acquisition in legacy ATE and bench instruments. Its 808 user I/Os support high-pin-count boundary-scan chains and parallel DUT interfaces, while ESBs configure as pattern RAM. JTAG-based in-system programming simplifies firmware updates in deployed test racks.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1500CF33C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1500CF33C8 | EP20K1500CF33C8ES | EP20K1500CF33C7 | EP20K1500CF33C7ES |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same |
| Speed Grade | -9 (fastest) | -8 | -8 ES | -7 | -7 ES |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial (ES) | Commercial | Commercial (ES) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Embedded Memory (ESB) | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit |
| User I/O | 808 | 808 | 808 | 808 | 808 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete | Obsolete (ES) |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
Key Differentiators
- Highest speed grade available in the EP20K1500C package family (vs EP20K1500CF33C8)
- Pin-compatible with all EP20K1500CF33 family variants (vs EP20K1500CF33C7)
- True drop-in replacement for legacy Altera APEX 20K designs (vs EP1SGX40GF1020C7 (Stratix))
Design Notes
The EP20K1500CF33C9 draws a core supply of 1.8 V and an I/O supply (typically 3.3 V) plus auxiliary 2.5 V for PLL/ESB blocks. Estimated quiescent current is 300-500 mA at idle, rising to 2-3 A at full switching load. Place a 100 uF bulk capacitor plus 0.1 uF + 1 nF ceramic bypass capacitors within 100 mils of every power pin, and dedicate a separate power plane for the 1.8 V core rail to avoid IR-drop-induced timing variation. Always simulate power integrity with the Quartus PowerPlay early-power estimator before tape-out.
The 1020-ball 33x33 mm BGA dissipates up to 5-7 W under sustained switching activity, so thermal via stitching under the center BGA balls is required for heat extraction to the inner ground plane. Verified data: theta_JA on a JEDEC 4-layer test board is approximately 12 C/W. For continuous 5 W dissipation in still air, junction temperature can reach 100C; active airflow or a heatsink is recommended for >3 W loads. Per the APEX 20K datasheet, the commercial device is rated to +85C junction.
Use at minimum a 6-layer PCB stack-up with 2 solid power planes (1.8 V core and 3.3 V I/O) and 2 ground planes surrounding the BGA to control impedance for HSTL/SSTL memory interfaces (target 50 ohm single-ended, 100 ohm differential). Fan-out the BGA with 0.5 mm pitch via-in-pad or dog-bone escape routing; place decoupling caps on the BGA-side layer. Match-length pairs to within 25 mils for HSTL Class I and within 10 mils for LVDS pairs to avoid setup/hold violations at 133 MHz.
Common pitfalls when designing with the EP20K1500CF33C9: (1) Omitting the EPCS configuration PROM causes the SRAM-based FPGA to remain unconfigured at power-up; (2) mixing 5 V TTL signals with 3.3 V-tolerant I/O banks without level translation damages the I/O; (3) forgetting the JTAG chain termination (TCK pull-down, TMS pull-up) causes unreliable programming; (4) ignoring the 25 mA per-bank current limit when assigning LVTTL output buffers leads to VCCIO droop. Always run the Quartus Pin Planner early in the design and review the I/O bank current summary.
Compliance Information
Compliance data not present in verified web search results; APEX 20K is a legacy family predating RoHS-transition disclosures. Verify per-lot RoHS status with distributor before procurement.
