EP20K200BC356-2XV - APEX-20K FPGA, 8320 LE, 356-BGA | Altera/Intel
MPN: EP20K200BC356-2XV ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 250 | $48 | $12,000.00 |
| 500 | $45 | $22,500.00 |
EP20K200BC356-2XV Overview
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic via a configurable array of logic elements, interconnect, and embedded memory blocks. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices), PALs, and ASICs; APEX-20K is specifically a multi-core architecture that combines Look-Up Table (LUT)-based logic with dedicated embedded memory and high-speed I/O, making it a member of the pre-Cyclone/Stratix Altera lineup targeted at high-density glue logic, bus bridging, and DSP prototyping.
Key features include 8320 logic elements distributed across 832 LABs (Logic Array Blocks), 106 Kbit of embedded SRAM distributed in EABs (Embedded Array Blocks), 277 user I/O pins, JTAG/IEEE 1149.1 boundary-scan support, and a flexible multi-volt I/O ring that can interface with 1.8V/2.5V/3.3V peripherals. The 356-ball BGA package exposes all I/O while preserving board area, and the -2 speed grade designates the second-fastest commercially available bin at the time of release.
Architecturally, APEX-20K combines a fine-grained MegaLAB structure, each MegaLAB containing 16 LABs plus an EAB. Logic is implemented via 4-input LUTs in each LE, and embedded memory is implemented in EABs that can be configured as RAM, ROM, or FIFO. The -2 speed grade corresponds to faster propagation delays versus the -3 grade, enabling higher system-clock operation; users typically target this part for glue logic, custom bus interfaces, and low-volume ASIC-replacement designs.
Typical applications include custom bus-bridging logic, telecommunications line-card glue, ASIC prototyping, industrial control interfacing, and legacy system upgrades where 277 user I/O are required. The wide I/O count and embedded memory also suit custom DSP datapaths such as finite-impulse-response (FIR) filters and correlators used in instrumentation. Because the part is now mature silicon, it is most often specified for long-lifecycle designs, defense systems, and industrial equipment already in service.
Design considerations include JTAG programming through the ByteBlaster or BitBlaster cable, single-event-upset (SEU) sensitivity in SRAM-based APEX-20K devices, and the use of core/I/O decoupling per APEX-20K reference designs. For aerospace/defense applications, designers should evaluate radiation-tolerant APEX-20K variants and consider watchdog/CRC scrubbing on the configuration bitstream.
This page synthesizes verified distributor inventory and pricing as of 2026-09-07, drop-in same-package alternatives from the APEX-20K family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP20K200BC356-2XV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200BC356-2XV (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Series, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200BC356-2
✅ Drop-In✓ In Stock
$88.25 / Unit
View Datasheet →EP20K200BC356-1X
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP20K200BC356-1
✅ Drop-In✓ In Stock
$335 / Unit
View Datasheet →EP20K200BC356-2XV Maximum Ratings & Electrical Characteristics
| Family | APEX-20K |
| Series | APEX-20K® |
| Number of LABs/CLBs | 832 |
| Number of Logic Elements / Cells | 8320 |
| Total RAM Bits | 106496 |
| Number of I/O | 277 |
| Number of Gates | 526000 |
| Core Voltage Supply | 2.375 V to 2.625 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (TJ) |
| Package / Case | 356-LBGA (Ball Grid Array) |
| Speed Grade | -2 |
| Configuration Memory | SRAM-based (volatile) |
| Programming Interface | JTAG (IEEE 1149.1) |
EP20K200BC356-2XV 356-lbga (ball grid array) Pin Configuration Guide
Pin configuration for EP20K200BC356-2XV (356-lbga (ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200BC356-2XV.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200BC356-2XV is suitable for 6 applications: ASIC Prototyping and Validation, Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation, Military and Defense Avionics (Legacy), Custom DSP Datapaths (FIR/FFT Filters), Legacy Medical Imaging Systems.
ASIC Prototyping and Validation
The EP20K200BC356-2XV is well-suited to ASIC prototyping because its 8320 logic elements and 106,496 bits of embedded RAM allow full mapping of mid-complexity ASICs (up to ~500K gates). The 356-BGA package exposes 277 user I/O - sufficient to break out wide datapath buses, DDR-style memory interfaces, and multiple peripheral channels typical of ASIC prototyping boards. Designers map ASIC gates to APEX-20K MegaLABs and use Quartus to validate timing before tape-out.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards historically used APEX-20K devices to bridge legacy TDM buses with newer packet-processing ASICs, performing custom framing, UTOPIA/LVDS serialization, and clock-domain crossing. The EP20K200BC356-2XV's 277 user I/O and embedded RAM support UTOPIA-2/3, POS-PHY Level 2, and SPI-4.2 bridge functions, while the -2 speed grade supports the 50-77 MHz bus interfaces typical of mid-2000s telecom designs. Long product life cycles in carrier networks keep demand alive.
Recommended
Industrial Control and Factory Automation
Industrial control systems benefit from the EP20K200BC356-2XV's high I/O count, embedded memory, and 0-85 °C commercial temperature rating. The 277 I/O support multi-axis motor control, parallel ADC interfaces, encoder feedback channels, and fieldbus protocols (Profibus, DeviceNet) implemented in soft logic. The -2 speed grade ensures deterministic timing for closed-loop control loops, while SRAM-based configuration allows in-field firmware updates via JTAG for long-life factory equipment.
Recommended
Military and Defense Avionics (Legacy)
Defense programs specified APEX-20K devices including the EP20K200BC356-2XV for avionics databuses, radar signal preprocessing, and MIL-STD-1553 bridging. The wide 277-I/O capacity supports parallel MIL-STD-1553 channels, ARINC 429 receivers, and discrete I/O aggregation. Long defense program life cycles (20+ years) sustain demand even after commercial obsolescence. Designers must evaluate SEU sensitivity of the SRAM configuration memory and consider CRC scrubbing for safety-critical applications.
Recommended
Custom DSP Datapaths (FIR/FFT Filters)
The 106,496 bits of embedded SRAM in the EP20K200BC356-2XV map well to custom DSP datapaths such as FIR filters, FFT engines, and digital correlators. EABs (Embedded Array Blocks) can be configured as RAM/ROM lookup tables for sine/cosine generation or twiddle factors, while the 8320 LEs implement the multiplier-accumulator (MAC) tree. The -2 speed grade sustains 50-80 MHz DSP throughput, sufficient for audio-rate signal processing and moderate-bandwidth radar preprocessing in instrumentation.
Recommended
Legacy Medical Imaging Systems
Ultrasound and MRI imaging equipment from the early 2000s used APEX-20K FPGAs like the EP20K200BC356-2XV for beamforming, channel aggregation, and image preprocessing. The wide I/O count supports parallel LVDS data acquisition from multi-channel analog front-ends, while the embedded RAM holds line buffers and lookup tables for windowing functions. Long medical device lifecycles and FDA validation constraints keep demand for these obsolete parts active in service and refurbishment markets.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200BC356-2XV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200BC356-2 | EP20K200BC356-1X | EP20K200BC356-1 |
|---|---|---|---|---|
| Brand | Altera | Altera (same) | Altera (same) | Altera (same) |
| Package | 356-LBGA | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) |
| Logic Elements | 8320 | 8320 | 8320 | 8320 |
| Speed Grade | -2 (extended temp) | -2 (standard temp) | -1 (extended temp) | -1 (standard temp) |
| Total RAM Bits | 106496 | 106496 | 106496 | 106496 |
| Number of I/O | 277 | 277 | 277 | 277 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
Key Differentiators
- Extended-temperature -2 speed grade bin (vs EP20K200BC356-2)
- Faster timing closure versus -1X alternative (vs EP20K200BC356-1X)
- Identical pinout enables PCB reuse across speed grades (vs EP20K200BC356-1)
Design Notes
The APEX-20K family requires both VCCINT (core, 2.375V-2.625V) and VCCIO (I/O, 1.8V/2.5V/3.3V selectable) rails. Per the APEX-20K reference designs, place 0.1 µF ceramic decoupling capacitors adjacent to every VCCINT pin and 10 µF bulk capacitors per VCCIO bank. Estimating: with 8320 LEs at typical 20% utilization, ICCINT is approximately 200-400 mA; full utilization approaches 800 mA. Add heat-sinking for high-utilization designs.
The 356-BGA package demands 4-6 layer PCB with controlled-impedance routing for high-speed I/O. Per APEX-20K datasheet pinout supplement, JTAG signals (TCK, TMS, TDI, TDO) and configuration pins (nSTATUS, nCONFIG, CONF_DONE, DCLK) must be routed to test points for in-system programming. Maintain continuous ground planes under the BGA; break-out traces on inner layers with microvias to preserve signal integrity on LVDS/clock nets.
APEX-20K is SRAM-based, so the configuration bitstream is volatile - it must be reloaded on every power-up via a configuration PROM (e.g., EPC2, EPC8) or JTAG. Single-event upsets (SEUs) in SRAM configuration can flip logic in radiation environments - aerospace/defense designs must implement configuration scrubbing. Also note: the -2XV and -2X suffix difference is minor (commercial vs extended commercial), but timing derating differs at temperature extremes.
Estimating: at -2 speed grade, internal LE-to-LE delays are approximately 0.5 ns and MegaLAB interconnect delays are 1.5-3 ns. For 50 MHz operation, the critical path budget is 20 ns - achievable with moderate pipelining. Synchronous design with registered I/O is mandatory; asynchronous paths through global clock networks cause hold-time failures in the APEX-20K architecture. Use Quartus fitter reports to verify timing closure.
Compliance Information
RoHS, REACH, lead-free, halogen-free status not provided in the verified distributor data. The APEX-20K family predates widespread RoHS adoption; many original parts are non-RoHS. Verify with the distributor for specific lot compliance. AEC-Q100 is not applicable - this is a commercial-grade FPGA, not automotive-qualified.
