EP20K200CB356C9 - APEX 20KC FPGA 200K Gates 356BGA | Intel
MPN: EP20K200CB356C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.66 | $78.66 |
| 10 | $74.92 | $749.20 |
| 100 | $71.35 | $7,135.00 |
| 1,000 | $69.95 | $69,950.00 |
| 10,000 | $69.95 | $699,500.00 |
EP20K200CB356C9 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, memory, and high-speed I/O through software configuration after PCB assembly. FPGAs sit at the top of the digital logic hierarchy, below ASICs in NRE cost but above fixed-function CPLDs in density and capability. The APEX 20KC series, introduced in the early 2000s, is a multi-level interconnect, SRAM-based architecture widely used in telecommunications, industrial control, and DSP applications where parallel processing and rapid design iteration outweigh the cost benefits of an ASIC.
Key features include 8,320 logic elements with embedded system blocks for distributed and dual-port memory, up to 250 MHz internal performance, multi-standard I/O supporting LVTTL, LVCMOS, PCI, and GTL+ signaling, and an 8-bit embedded multiplier (via embedded system blocks) for DSP functions. The 356-pin LBGA package supports high pin density for the 271 user I/O, and the 0.15 μm process delivers a favorable logic-element-per-watt ratio compared to older APEX 20K (0.22 μm) parts.
Typical applications include high-speed data-path and channel-card designs in telecom equipment, glue-logic consolidation around microprocessors and DSPs, custom peripheral bus bridges (PCI to local bus), and pre-ASIC prototyping. The combination of large logic capacity, embedded memory, and multi-standard I/O made the APEX 20KC a popular choice for telecom line cards and industrial machine controllers in the 2001-2008 era.
When designing with the EP20K200CB356C9, ensure the 1.8 V core supply is well decoupled with at least four 0.1 μF ceramic capacitors placed close to the LBGA's power balls. JTAG configuration is recommended for in-system reprogrammability, and the Quartus II design tool (versions 5.0 and later discontinued support for APEX 20KC - check availability). Note that the APEX 20KC family has been declared NRND/end-of-life by Altera/Intel; new designs should target Cyclone, Arria, or MAX 10 series.
Drop-in alternatives for EP20K200CB356C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200CB356C9 (same form factor and footprint) — differing in Operating Temperature, Family, Process Technology, Package, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200EBC356-3
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EBC356-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EBC356-2N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200BC356-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$162 / Unit
View Datasheet →EP20K200BC356-2XV
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$45 / Unit
View Datasheet →EP20K200BC356-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.25 / Unit
View Datasheet →EP20K200BC356-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$285 / Unit
View Datasheet →EP20K200CB356C9 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements / Cells | 8,320 |
| Total RAM Bits | 106,496 |
| Typical Gate Count | 200,000 |
| Number of User I/O | 271 |
| Process Technology | 0.15 μm CMOS |
| Core Voltage | 1.8 V |
| Maximum Internal Frequency | 250 MHz |
| Package Type | 356-LBGA |
| Number of Pins | 356 |
| Operating Temperature | 0 °C to +85 °C (commercial, C-grade) |
| Configuration Method | SRAM-based, JTAG / passive serial / passive parallel |
| Embedded Memory | Embedded System Blocks (ESB) - dual-port RAM, ROM, CAM |
| Mounting Type | Surface Mount (BGA) |
| Lifecycle Status | Not Recommended for New Designs (NRND) |
EP20K200CB356C9 356-lbga Pin Configuration Guide
Pin configuration for EP20K200CB356C9 (356-lbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200CB356C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200CB356C9 is suitable for 6 applications: Telecom Line-Card Data-Path Processing, PCI Bus Bridge and Custom Peripheral Interfaces, DSP Pre-Processing and Co-Processing, Industrial Machine Controllers (Legacy), Pre-ASIC Prototyping and Verification, Legacy Telecom Backplane Aggregation.
Telecom Line-Card Data-Path Processing
The EP20K200CB356C9's 8,320 logic elements and 271 user I/O pins make it a strong fit for telecom line cards where parallel processing of multiple data streams is required. With 250 MHz fMAX in the C9 speed grade and Embedded System Blocks providing dual-port RAM up to 32x18 bits, the device can implement custom framing, cell delineation, and protocol-translation functions across STS-1/STM-1 line rates. The 1.8 V core and 3.3 V-tolerant I/O enable direct interface to legacy telecom ASICs, while the LBGA package supports the dense pin-out required for backplane connectivity. Engineers typically pair this part with a network processor (e.g., Intel IXP series) for offloading data-path tasks, where the FPGA acts as a flexible co-processor that can be reprogrammed for evolving protocols without respinning the line-card PCB.
Recommended
PCI Bus Bridge and Custom Peripheral Interfaces
With 8,320 logic elements and PCI-compatible I/O, the EP20K200CB356C9 can implement custom 32-bit/33 MHz PCI bus bridges between a host CPU and proprietary peripheral ASICs. The device's 271 user I/O provide ample headroom for multiple peripheral buses (Local Bus, ISA, VME, custom serial protocols) alongside the PCI interface. Embedded System Blocks deliver 106,496 bits of RAM for buffering DMA transfers and command queues. In legacy industrial PCs and VMEbus systems, this FPGA commonly replaces multiple discrete bridge ASICs, reducing BOM cost and PCB area while adding the flexibility to modify bus behavior through firmware updates. Compared to CPLDs, the 8,320-cell density easily accommodates full master/target PCI state machines plus auxiliary logic.
Recommended
DSP Pre-Processing and Co-Processing
The EP20K200CB356C9's embedded system blocks include multiplier support that allows efficient FIR filters and FFT butterfly operations, making the part suitable for DSP pre-processing alongside a host DSP or GPP. With 250 MHz fMAX and 8,320 logic elements, the device can implement a 64-tap FIR filter running at sample rates up to 100 MHz while leaving substantial logic headroom for control logic and I/O interfacing. The 1.8 V core keeps power consumption reasonable for multi-channel radar, sonar, or instrumentation front-ends, while the 3.3 V I/O permits direct connection to ADCs and DACs. Engineers often pair this FPGA with a TI TMS320C6000 series DSP, offloading first-stage filtering and decimation to the FPGA to free DSP MIPS for higher-level algorithms.
Recommended
Industrial Machine Controllers (Legacy)
The APEX 20KC family is widely deployed in industrial machine controllers built in the 2001-2010 era, where its 200K-gate capacity accommodates multiple stepper/servo control loops, encoder counters, and fieldbus interfaces (Profibus, CANopen). With 271 user I/O pins, the EP20K200CB356C9 can directly connect to multi-axis servo amplifiers, quadrature encoders, limit switches, and serial peripherals without external multiplexer ICs. The 0.15 μm process keeps junction temperatures manageable in enclosed industrial cabinets, and the 1.8 V core enables efficient power design. For legacy machines still in production, this part continues to serve as the central logic hub for motion-control and PLC functions.
Recommended
Pre-ASIC Prototyping and Verification
The 8,320 logic elements and Embedded System Blocks of the EP20K200CB356C9 provide ample headroom to prototype designs targeted at ~200K-gate ASICs, allowing hardware-software co-development before mask sets are committed. Designers can map the full RTL to the FPGA, run real-world I/O traffic, and validate firmware in parallel with ASIC backend flows. The SRAM-based configuration supports rapid design iteration via JTAG or passive serial configuration in minutes, not hours. The 250 MHz fMAX in the C9 speed grade typically matches or exceeds the target ASIC's clock, providing realistic timing validation. For larger designs, multiple EP20K200CB356C9 devices can be cascaded with multi-FPGA partitioning tools, supporting pre-silicon validation of ASICs up to ~500K gates.
Recommended
Legacy Telecom Backplane Aggregation
In legacy SDH/SONET multiplexer equipment, the EP20K200CB356C9 is commonly used as a backplane aggregator, combining multiple lower-rate tributary signals into higher-rate aggregates with custom framing overhead insertion. The 271 user I/O support 8-bit LVTTL parallel connections to multiple framers and mappers, while the 106,496 bits of embedded RAM provide pointer-adjustment FIFOs and overhead-scratch buffers. The 0.15 μm process and 1.8 V core deliver the logic density per watt needed for high-availability equipment with NEBS thermal compliance. Engineers often pair this FPGA with a clock-recovery PLL (e.g., Altera's altpll mega-function) for jitter-attenuated tributary synchronization. While newer Cyclone IV/V devices offer lower static power, the existing deployed base makes this part a cost-effective maintenance solution.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200CB356C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200EBC356-3 | EP20K200EBC356-2X | EP20K200EBC356-2N | EP20K200BC356-3 | EP20K200BC356-2 |
|---|---|---|---|---|---|---|
| Package | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA | 356-LBGA |
| Brand | Intel / Altera | Altera | Altera | Altera | Altera | Altera |
| Family / Process | APEX 20KC (0.15 μm) | APEX 20KE (0.22 μm) | APEX 20KE (0.22 μm) | APEX 20KE (0.22 μm) | APEX 20K (0.22 μm) | APEX 20K (0.22 μm) |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Total RAM Bits | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| User I/O | 271 | 271 | 271 | 271 | 271 | 271 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- C9 speed grade delivers 250 MHz fMAX versus 205 MHz in -3 grade alternatives (vs EP20K200EBC356-3)
- 0.15 μm CMOS process versus 0.22 μm in the original APEX 20K/20KE (vs EP20K200BC356-3)
- Embedded System Blocks with dedicated multiplier support (vs EP20K100CQ240C9)
Design Notes
The EP20K200CB356C9 requires a regulated 1.8 V core supply (VCCINT) capable of delivering up to 1.5 A during configuration and full-speed operation. Decoupling must include at least four 0.1 μF X7R ceramic capacitors placed within 5 mm of the LBGA's power balls, supplemented by bulk 47-100 μF tantalum or polymer capacitors at the regulator output. I/O bank voltage (VCCIO) is independent of VCCINT and can be set to 3.3 V, 2.5 V, or 1.8 V to match the connected peripherals. Power-rail sequencing is recommended: VCCINT should reach 90% of nominal before VCCIO ramps to avoid I/O latch-up, especially during hot-plug or in-circuit programming events.
The 356-ball LBGA package has a 1.27 mm ball pitch, requiring 6/6 mil trace/spacing design rules at the breakout layer with microvia or laser-drilled via-in-pad for the inner balls. Power and ground balls should fan out to dedicated inner planes (at least 2 oz copper on power layer) to maintain <25 mΩ impedance. JTAG chain signals (TCK, TMS, TDI, TDO) must be routed with controlled impedance (50 Ω typical) and length-matched within ±50 mils if used in a multi-device chain. According to the APEX 20KC datasheet, all unused I/O pins should be configured as outputs driving ground to minimize power consumption and reduce susceptibility to noise-induced oscillation.
Common pitfalls include (1) using Quartus II versions newer than 5.0 - APEX 20KC support was dropped after v5.0; retain a legacy installation. (2) Configuring I/O standards mixed across banks without proper VCCIO assignment - each bank has a single VCCIO rail. (3) Forgetting the nCONFIG initialization pulse after power-up - this pin must be held low then released to begin configuration. (4) Connecting a 5 V device to an I/O without level shifting - while the I/O is 3.3 V-tolerant, voltages above VCCIO + 0.7 V on the input will forward-bias ESD diodes. (5) Assuming the JTAG IDCODE matches the part number - the APEX 20KC family shares an 8-bit manufacturer ID with related families, so use the full 32-bit IDCODE plus BSDL file for unambiguous identification.
Compliance Information
RoHS and REACH compliance status not explicitly stated in the verified web data; the part is lead-free per typical Intel/Altera LBGA practices from its production era. AEC-Q100 is not applicable for FPGAs in this product class.
