EP20K200EQI240-2 - APEX 20KE FPGA | Altera | 240PQFP
MPN: EP20K200EQI240-2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25.6 | $25.60 |
| 10 | $23.1 | $231.00 |
| 100 | $20.05 | $2,005.00 |
| 500 | $17.9 | $8,950.00 |
| 1,000 | $16.3 | $16,300.00 |
EP20K200EQI240-2 Overview
An FPGA, or Field-Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing through SRAM-based look-up tables and programmable interconnect. FPGAs occupy a design niche between CPLDs and ASICs: they offer high capacity and parallelism but can be reprogrammed without wafer-level NRE costs. Within the programmable logic hierarchy, an FPGA can be described as a programmable logic device, and more broadly as an integrated circuit used for digital system implementation. The APEX-20KE family is one of Altera’s high-density FPGA architectures, combining look-up table logic, product-term logic, and embedded memory blocks in a single device.
Key distinguishing features of the EP20K200EQI240-2 include the APEX MultiCore architecture that unifies LUT-based logic, product-term logic, and embedded system blocks; 205 MHz internal operation; 106,496 bits of on-chip RAM; and 168 user I/Os with support for multiple I/O standards. The industrial temperature suffix expands operation beyond the commercial range, and the 240-pin BFQFP package provides a manageable fine-pitch surface-mount footprint for boards that need high pin count without a larger ball-grid array. The device is configured through an external configuration device or JTAG interface, allowing in-system design updates.
The EP20K200EQI240-2 is fabricated on a 0.22 µm process, and its 1.8 V core voltage reduces dynamic power relative to 2.5 V or 3.3 V FPGAs. The APEX-20KE family includes Embedded System Blocks (ESBs) that can be configured as FIFOs, dual-port RAM, or content-addressable memory, integrating memory functions that would otherwise require separate SRAM on the PCB. The architecture also supports multiple low-voltage I/O standards for interfacing with high-speed ADCs, DACs, and processors while simplifying board-level termination.
Typical applications for this FPGA include telecom line-card packet buffering, industrial motion-control logic, video/image interface pre-processing, and ASIC prototyping. The 168 available user I/Os are useful for parallel data buses connecting external memories, converters, and host controllers, while the 106,496 RAM bits handle small FIFOs and scratchpad storage without external components. The 205 MHz clock capability allows the implementation of system-level control, data-path, and DSP blocks on one device.
A practical design consideration is that the EP20K200E is SRAM-based and loses its configuration at power-off; therefore an external EPC2/EPC4 configuration device or JTAG download must be provided. Decoupling of the 1.8 V core and I/O supplies is critical, with low-ESR 0.1 µF ceramic capacitors placed near every supply pin and bulk capacitance per power region to control transient noise.
This page synthesizes distributor-level pricing, drop-in alternatives from the same EP20K200E family, and practical APEX-20KE design checks that are not printed in the manufacturer datasheet, giving engineers a faster path from datasheet to PCB.
Drop-in alternatives for EP20K200EQI240-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200EQI240-2 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, RoHS Status, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200EQI240-2N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K200EQI240-2X
✅ Drop-In✓ In Stock
$55.8 / Unit
View Datasheet →EP20K200EQC240-2
✅ Drop-In✓ In Stock
$14 / Unit
View Datasheet →EP20K200EQC240-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198.75 / Unit
View Datasheet →EP20K200EQC240-2X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52 / Unit
View Datasheet →EP20K200EQC240-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$45.25 / Unit
View Datasheet →EP20K200EQI240-2 Maximum Ratings & Electrical Characteristics
| Product Family | APEX-20KE |
| Logic Elements | 8320 |
| System Gates | 200000 |
| Total RAM Bits | 106496 |
| User I/Os | 168 |
| Core Supply Voltage | 1.8 V |
| Maximum Clock Frequency | 205 MHz |
| Technology Process | 0.22 um |
| Package / Case | 240-BFQFP |
| Mounting Type | Surface Mount |
| Number of Terminals | 240 |
| Terminal Form | Gull Wing |
| Package Shape | Square |
| Speed Grade | -2 |
EP20K200EQI240-2 square Pin Configuration Guide
Pin configuration for EP20K200EQI240-2 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200EQI240-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200EQI240-2 is suitable for 6 applications: Industrial Control and Factory Automation, Telecommunication Line Card Logic, Video and Image Interface Processing, ASIC Prototyping and Verification, Test and Measurement Equipment, Aerospace, Defense and Rugged Electronics.
Industrial Control and Factory Automation
The EP20K200EQI240-2 fits industrial control systems by combining 8,320 logic elements and 168 I/Os with an industrial temperature rating. In a PLC or motion controller, the FPGA can implement high-speed encoder counting, PWM generation, and custom fieldbus bridging with deterministic parallel I/O. The 1.8 V core and 0.22 µm process help limit power in sealed industrial enclosures, while the 240-pin BFQFP provides enough routing for multiple motor-driver interface signals. When implementing safety interlocks, the FPGA can execute parallel redundancy checks that a sequential MCU would struggle to handle at speed. Designers should pair this FPGA with an external configuration device and provide clean 3.3 V or 5 V I/O level-shifting for legacy industrial sensors.
Recommended
Telecommunication Line Card Logic
The EP20K200EQI240-2 is suited to telecom line cards because its 106,496 RAM bits and 205 MHz internal clock support packet buffering, cell processing, and simple MAC/PHY bridging. The 168 user I/O signals can connect to a backplane bus, PHY devices, and a control processor without external CPLD glue. The embedded system blocks can be configured as FIFOs to absorb burst traffic, reducing demand for external SRAM. Using the I-suffix variant allows the line card to operate in central office environments with elevated ambient temperatures. For frame-based protocols such as 100 Mb/s Ethernet, designers can implement a lightweight MAC state machine and interface directly to a 10/100 PHY using LVCMOS signaling; the APEX-20KE provides the port count and internal RAM depth needed for small per-port queues.
Video and Image Interface Processing
In video capture or display boards, the EP20K200EQI240-2 accepts parallel pixel data from CMOS sensors or video decoders, applies line-buffer delays in embedded RAM, and performs simple scaling or color-space conversion before transmission to a display controller or DSP. Its 8320 logic elements are sufficient for 2D raster operations, while 168 I/Os accommodate 24-bit RGB buses, sync signals, and a host-interface. The 106,496 memory bits serve as scan-line buffers, reducing the need for separate FIFO chips. The -2 speed grade supports pixel clocks up to roughly 150–200 MHz, well above standard XGA/HD formats. The industrial temperature grade is also valuable when cameras are placed near motors or other heat sources. Care must be taken with clock-domain crossing between incoming pixel clock and the local FPGA clock to avoid metastability.
ASIC Prototyping and Verification
The EP20K200EQI240-2 is a cost-effective prototyping vehicle for ASIC blocks that require up to 200K system gates. Designers can map RTL intended for a standard-cell ASIC into the FPGA using the same synchronous design methodology, then verify boot code and interface timing in real hardware. The 168 user I/Os allow bridging to the target SoC bus, external SRAM, and host PC through a JTAG or parallel port. Because the FPGA is SRAM-based, iterative builds are fast, and the 240-pin BFQFP can be soldered onto a small daughtercard for bench experiments. The 0.22 µm process imposes timing differences from a newer ASIC process, so engineers should include timing margin and use the -2 speed grade to approximate final system clocks.
Test and Measurement Equipment
The EP20K200EQI240-2 is well matched to waveform generators, logic analyzers, and custom measurement front-ends. Its parallel I/O structure can create stimulus patterns, interface to high-speed ADCs/DACs, and decode digital buses with custom trigger logic. The 8,320 logic elements can hold small signal-processing chains, while embedded RAM implements acquisition buffers or pattern memory. The industrial temperature rating supports benchtop instruments in factory environments that see heat from nearby power supplies. Because the FPGA can be reconfigured over JTAG, instrument firmware can load different measurement personalities into the same hardware, reducing board variants. For data acquisition, design a synchronous sample clock fan-out and use the FPGA’s internal PLLs, if available in the APEX-20KE family, to align multiple channels.
Aerospace, Defense and Rugged Electronics
EP20K200EQI240-2 is often considered for rugged, high-reliability systems because the I-suffix extends the operating temperature and Altera/Intel APEX-20KE parts have a long history in military-grade programs. The FPGA can implement custom encryption, bus bridging, sensor processing, and redundant control logic in a single device. Its 1.8 V core reduces power budget pressure in conduction-cooled enclosures, while the 240-pin BFQFP allows reliable soldering without the inspection difficulty of large BGA columns. The 0.22 µm technology may be older, but it provides predictable single-event effects data for heritage designs. When used in avionics or defense projects, the designer should follow IPC-2221 and AEC-like derating guidelines, even though the part itself is not AEC-Q100 qualified.
Recommended Products Summary
Engineering reference data for EP20K200EQI240-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200EQI240-2N | EP20K200EQI240-2X | EP20K200EQC240-2 | EP20K200EQC240-3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 240-BFQFP | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same |
| Temperature Grade | Industrial (I-suffix) | Industrial (I-suffix) | Industrial (I-suffix) | Commercial (C-suffix) | Commercial (C-suffix) |
| Speed Grade | -2 | -2 | -2X (extended) | -2 | -3 |
| Logic Elements | 8320 | 8320 | 8320 | 8320 | 8320 |
| RAM Bits | 106496 | 106496 | 106496 | 106496 | 106496 |
| User I/Os | 168 | 168 | 168 | 168 | 168 |
| Lead-Free / RoHS Finish | No (N-suffix absent) | Yes | No | No | Yes |
Key Differentiators
- Industrial temperature grade in a 240-pin PQFP FPGA (vs EP20K200EQC240-2)
- Standard -2 speed grade provides a balance of timing margin and availability (vs EP20K200EQI240-2X)
- The base EP20K200EQI240-2 supports matching with drop-in N/X variants without a pinout change (vs EP20K200EQC240-3N)
Design Notes
The EP20K200E is an SRAM-based FPGA, so configuration data is not retained when power is removed. Designers must include a configuration device such as an EPC2 or EPC4, or provide an active-serial or JTAG download path that runs at every power-up. Do not assume the FPGA is live immediately after supply ramp; the CONF_DONE and nSTATUS signals must go high before user logic begins operating. Also ensure the configuration device voltage domain is compatible with the FPGA's I/O bank voltage.
Estimated: For a 1.8 V APEX-20KE FPGA with 8,320 logic elements, core current can range from roughly 200 mA to 600 mA depending on utilization and toggle rate. At a nominal 500 mA, core power is approximately 0.9 W. Add I/O power for external interfaces, which can add another 0.3–0.8 W depending on output loading. Use 0.1 µF ceramic capacitors close to every core supply pin and at least 4.7 µF to 10 µF bulk capacitance per power plane to prevent supply droop during high-current switching events.
The 240-pin BFQFP uses a 0.5 mm pitch or similar fine-pitch gull-wing footprint depending on the exact supplier land pattern. Use the manufacturer-recommended PCB land pattern for the 240-PQFP to avoid solder bridging, and add thermal relief spokes on ground and power pads if required. Place vias within 2 mm of the FPGA pins for dense fanout, but avoid cutting return paths under the device. For industrial EMC, include series resistors on high-speed I/O lines and a solid ground pour beneath the FPGA.
The 240-BFQFP package is a plastic QFP with an exposed or non-exposed pad depending on the specific version; thermal resistance is higher than a BGA package. For high-density designs using most of the 8,320 logic elements, forced airflow or a heatsink may be needed. Estimate junction temperature using theta-JA from the APEX-20KE datasheet [DATA_NEEDED] and keep Tj below the recommended maximum for the industrial temperature range. Providing a copper plane and populated vias under the center pad will improve heat spreading even if the pad is not soldered.
Compliance Information
Compliance status was not explicitly provided in the captured web data. The presence or absence of the N-suffix changes lead-free finish availability; verify with the specific datasheet and distributor before claiming RoHS compliance.