EP20K200RC240-1 - APEX 20K FPGA 200K Gates 8320 Cells | Intel
MPN: EP20K200RC240-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79.2 | $7,920.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $65 | $65,000.00 |
EP20K200RC240-1 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be redefined by the designer after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-defined processors. The APEX 20K family extends this further by combining LUT logic, product-term logic, and embedded memory on a single MultiCore architecture, eliminating the need for external companion chips in many designs.
Key features of the EP20K200RC240-1 include its MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded memory blocks, LVDS-capable I/O support, in-system programmability via SRAM configuration cells, and dedicated interfaces such as the FastTrack interconnect and a PLL-rich clock network. The exposed thermal pad on the 240-BFQFP package improves heat spreading for sustained high-utilization designs.
Technically, the device is implemented on a 0.22 µm CMOS process, supports a 2.5 V core supply, and provides 8320 logic elements (LEs) and 106,496 RAM bits across four embedded array blocks (EABs). The LVDS I/O option (-1 suffix indicates the speed grade) supports low-voltage differential signaling, which is critical for reducing EMI in high-speed parallel buses between FPGAs and external memory or backplane transceivers.
Typical applications include telecommunications infrastructure (SONET/SDH framer interfaces, ATM switching), high-speed data acquisition and DSP pre-processing, ASIC prototyping, and embedded control systems in industrial and military designs. The wide gate count makes it suitable for multi-channel signal conditioning pipelines.
When designing with the EP20K200RC240-1, ensure the Quartus II toolchain (or MAX+PLUS II for legacy designs) is used for synthesis, place-and-route, and timing closure. Decoupling capacitors must be placed adjacent to every VCCINT/VCCIO pin pair, and the exposed pad must be soldered to a continuous ground plane for thermal performance and signal return paths.
This page synthesizes distributor pricing for the EP20K200RC240-1, a curated list of same-package drop-in alternatives within the APEX 20K family, and practical PCB layout notes not consolidated in the original datasheet.
Drop-in alternatives for EP20K200RC240-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200RC240-1 (same form factor and footprint) — differing in Package, Family, Speed Grade, Process Technology, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200RC240-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200RC240-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200BC356-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$162 / Unit
View Datasheet →EP20K200CB356C7ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108.5 / Unit
View Datasheet →EP20K200RC240-1 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Device Family Subseries | 20KE (1.8V, LVDS capable) |
| Logic Elements / Cells | 8320 |
| Total Gates | 200,000 |
| Embedded Memory Bits | 106,496 |
| Maximum User I/O | 174 |
| Maximum Internal Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 2.5 V |
| Speed Grade | -1 |
| Package | 240-BFQFP Exposed Pad (RQFP) |
| Pin Count | 240 |
| Mounting Type | Surface Mount |
| LVDS I/O Support | Yes (per APEX 20KE subseries) |
EP20K200RC240-1 240-bfqfp exposed pad (rqfp) Pin Configuration Guide
Pin configuration for EP20K200RC240-1 (240-bfqfp exposed pad (rqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200RC240-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200RC240-1 is suitable for 6 applications: Telecommunications Infrastructure (SONET/SDH Framing), High-Speed Data Acquisition and DSP Pre-Processing, ASIC Prototyping and Emulation, Embedded Industrial Control Systems, Military and Aerospace Avionics (Legacy Programs), Networking Switch and Router Line Cards.
Telecommunications Infrastructure (SONET/SDH Framing)
The EP20K200RC240-1 fits telecommunications infrastructure applications because its 200,000-gate capacity and 8,320 logic elements can implement multi-channel SONET/SDH framer and mapper functions in a single device. With a 250 MHz internal frequency and LVDS-capable I/O on the APEX 20KE subseries, the FPGA handles high-speed serial backplane interfaces between line cards and cross-connect fabrics, while the 106,496 bits of embedded memory provide per-channel elastic stores and pointer-processing buffers. Placed on the line card between the optical transceiver and the network processor, the device consumes roughly 1.5–2 W at typical utilisation. Compared to discrete TTL framer implementations, this integrated approach reduces board area and BOM while supporting in-field firmware upgrades via SRAM configuration.
Recommended
High-Speed Data Acquisition and DSP Pre-Processing
The EP20K200RC240-1 is suitable for high-speed data acquisition front-ends and DSP pre-processing pipelines because its 106,496 bits of embedded memory serve as dual-ported sample buffers between ADC FIFOs and downstream DSP processors. With 174 user I/O pins, the FPGA can interface directly to parallel ADCs (e.g., 14-bit @ 65 MSPS) and provide gain/offset calibration, decimation filtering, and trigger logic. The 250 MHz internal frequency supports multiply-accumulate operations at rates suitable for radar, sonar, and instrumentation front-ends. Power dissipation is approximately 1–2 W at typical 60% utilisation. Unlike discrete DSP chips, the EP20K200 allows algorithm updates without board respin, and its LVDS I/O simplifies connection to modern high-speed converters.
Recommended
ASIC Prototyping and Emulation
The EP20K200RC240-1 is well suited for ASIC prototyping and hardware emulation because its 200,000-gate capacity can host mid-complexity ASIC designs (up to ~150K ASIC gates equivalent) with full timing-accurate behaviour. The SRAM-based configuration allows unlimited design iterations via JTAG, and the embedded memory blocks serve as register-file and FIFO models. Multiple EP20K200 devices can be cascaded via the FastTrack interconnect to prototype larger ASICs. Compared to ASIC NRE, the EP20K200-based prototype reduces development cost by 80–90% for designs in the 50K–150K gate range, with the trade-off of higher per-unit cost in volume production.
Recommended
Embedded Industrial Control Systems
The EP20K200RC240-1 fits embedded industrial control applications because its MultiCore architecture combining LUT logic, product-term logic, and embedded memory matches the mixed requirements of state-machine controllers with table lookups. With 174 user I/O pins, the FPGA can directly drive numerous sensors, actuators, and motor-control PWM channels without external bus-expanders. The exposed thermal pad on the 240-BFQFP package supports sustained operation in enclosed industrial enclosures. Power dissipation is typically 1.5 W at 70% utilisation, manageable without active cooling. Unlike microcontroller-based solutions, the FPGA provides deterministic sub-microsecond response times essential for safety-critical industrial interlocks.
Recommended
Military and Aerospace Avionics (Legacy Programs)
The EP20K200RC240-1 remains in service in legacy military and aerospace avionics programs because the APEX 20K family was qualified to MIL-STD-883 and supported in long-lifecycle defence contracts. With its 200K-gate logic capacity and LVDS I/O, the device implements redundant flight-control signal conditioning, mission-computer interface glue logic, and radar pre-processor interfaces. The -1 speed grade and X-suffix ruggedised variants support extended-temperature mission profiles. Bridge-supply channels through defence distributors sustain these programs. New defence designs should target the Microsemi RTG4 or Xilinx Defense-Grade Kintex UltraScale families, but the EP20K200RC240-1 continues to fill in legacy systems with established DO-254 certification artefacts.
Recommended
Networking Switch and Router Line Cards
The EP20K200RC240-1 fits networking switch and router line-card applications because its 200K gates and 174 I/O pins implement packet-classification lookup tables, queue managers, and switch-fabric interfaces in a single device. With 106,496 bits of embedded memory, the FPGA provides per-port statistics counters and CAM-like TCAM emulation via distributed RAM. The LVDS I/O of the 20KE subseries enables direct connection to high-speed SerDes and switch-fabric ASICs without external transceivers. Typical line-card power at 60% utilisation is around 1.8 W. Compared to network-processor-only designs, the EP20K200 offloads lookup-intensive tasks at deterministic latency, improving overall switch throughput by 15–30%.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200RC240-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200RC240-1N | EP20K200RC240-1X | EP20K200BC356-3 | EP20K200CB356C7ES |
|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad | BGA-356 (different footprint) | BGA-356 (different footprint) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Total Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Memory (bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Speed Grade | -1 (fastest) | -1N | -1X | -3 (slower) | -7 (slowest) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V (20KE subseries) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-package drop-in compatibility with N and X variants (vs EP20K200RC240-1N)
- Highest speed grade in the APEX 20K 200K-gate family (vs EP20K200CB356C7ES)
- LVDS-capable I/O via 20KE subseries (vs EP20K200FC484-1 (APEX 20K, non-KE))
Design Notes
The 240-BFQFP exposed-pad package requires the central thermal pad to be soldered to a continuous ground plane on the PCB top layer with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) connecting to inner ground layers. Per APEX 20K datasheet layout guidelines, missing this thermal connection can raise junction temperature by 20–30 °C under typical 1.5 W dissipation, compromising long-term reliability. Maintain 0.8 mm trace clearance between adjacent to the BFQFP pads to satisfy IPC-7351 nominal land pattern tolerances.
The EP20K200RC240-1 requires separate VCCINT (2.5 V core) and VCCIO (3.3 V or 2.5 V I/O) rails, each decoupled with 0.1 µF ceramic capacitors adjacent to every supply pin pair plus a bulk 47 µF tantalum capacitor per rail. Per the APEX 20K datasheet, VCCINT ramp time must be monotonic within 50 ms; an inrush-limiting soft-start circuit or LDO with controlled rise-time is required to prevent configuration SRAM corruption. Estimated power dissipation at 60% utilisation with 100 MHz toggle: ~1.5 W core + 0.3 W I/O = 1.8 W total.
Modern Quartus Prime versions (20.x and later) do NOT support the APEX 20K device family. According to Intel/Altera tool support matrices, you must retain Quartus II version 9.0 (final release with APEX 20K support) or MAX+PLUS II version 10.x for synthesis, place-and-route, and bitstream generation. Do not assume Quartus Prime Web Edition will load .qpf APEX 20K projects - the device library was removed after Intel's 2015 transition to Cyclone/Stratix naming.
When using the LVDS I/O capability of the APEX 20KE subseries, route LVDS pairs as length-matched 100 Ω differential traces with 0.2 mm spacing within the pair and 0.4 mm spacing to adjacent signals, per APEX 20K datasheet signal-integrity guidelines. The exposed ground pad provides the clean return path required for >500 Mbps LVDS signalling. Place 100 Ω termination resistors within 5 mm of the receiver pins; failing to terminate causes 200–400 mV common-mode oscillations that corrupt data.
Compliance Information
The APEX 20K family was launched in the late 1990s before RoHS compliance was widely enforced. RoHS/REACH compliance status is not verified in the available web data; customers should request a compliance certificate from the distributor before placing RoHS-restricted orders. The -1X variant may carry MIL-STD-883 screening per Altera/Intel legacy military part numbers.
