EP20K300EBC652-3 - APEX 20KE FPGA 1152 LABs 652-BGA | Altera
MPN: EP20K300EBC652-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198.5 | $19,850.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138.75 | $138,750.00 |
EP20K300EBC652-3 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device whose interconnect and logic fabric are configured by the end user after manufacture. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, non-volatile) and ASICs (larger, fixed-function); the APEX 20KE family specifically pioneered the "System-on-a-Programmable-Chip" (SOPC) concept by combining look-up-table logic, product-term logic, and embedded memory in a single MultiCore architecture, paving the way for modern SoC FPGAs.
Key features of the EP20K300EBC652-3 include LVDS I/O support (signature "E" = enhanced I/O, "20KE" = 1.8V core/LVDS), 147,456 bits of embedded SRAM, 4-phase PLL clock management, multi-voltage I/O capability, and 408 maximum user I/O pins. The -3 speed grade places the part in Altera's faster tier for this family, suitable for throughput-sensitive logic, datapath, and bus-interface designs.
The device uses a 1.8V core with hot-socketing capable I/O and supports several I/O standards including LVDS, LVPECL, PCI, GTL+, SSTL-2/3, and LVTTL. Each LAB contains 10 logic elements with carry-chain and cascade-chain support, enabling efficient implementation of arithmetic-intensive datapaths, FIFOs, and state machines. The embedded memory can be configured as dual-port RAM, ROM, FIFO, or CAM.
Typical applications include telecom line-card interfaces, ASIC prototyping, glue-logic and bus bridging, high-speed datapath processing, and industrial control systems. The APEX 20KE family is also widely used in legacy designs across military, aerospace, and telecommunications where long-lifecycle programs require stable, mature programmable logic.
When designing with this device, plan for JTAG-based configuration via ByteBlaster or MasterBlaster, account for 652 BGA PCB routing complexity, and verify multi-voltage I/O bank assignments against the Quartus II APEX 20KE support constraints. Heat dissipation is modest at typical clock rates but PCB thermal copper under the BGA is recommended for high-utilization designs.
This page consolidates distributor pricing, drop-in same-package alternatives, and design notes not found in the original Altera APEX 20KE datasheet, helping engineers evaluate lifecycle risk and replacement options for this mature FPGA family.
Drop-in alternatives for EP20K300EBC652-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K300EBC652-3 (same form factor and footprint) — differing in Operating Temperature, Total RAM Bits, Series, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K300EBC652-2X
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K300EBC652-2
✅ Drop-In✓ In Stock
$384.08 / Unit
View Datasheet →EP20K300EBC652-1X
✅ Drop-In✓ In Stock
$615.8 / Unit
View Datasheet →EP20K300EBC652-1
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K200EBC652-3
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP20K200EBC652-3N
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EP20K300EBC652-3 Maximum Ratings & Electrical Characteristics
| Series | APEX 20KE |
| Product Type | FPGA - Field Programmable Gate Array |
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Number of Logic Elements | 11,520 |
| Number of Logic Array Blocks (LABs) | 1152 |
| Number of Macros | 1152 |
| Total RAM Bits | 147,456 |
| Number of User I/Os | 408 |
| Package / Case | 652-BGA (45x45 mm) |
| Supplier Device Package | 652-BGA |
| Voltage - Supply | 1.71 V to 1.89 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to +85 C |
| Speed Grade | -3 |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| I/O Standards Supported | LVDS, LVPECL, PCI, GTL+, SSTL-2/3, LVTTL |
EP20K300EBC652-3 652-bga Pin Configuration Guide
Pin configuration for EP20K300EBC652-3 (652-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K300EBC652-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K300EBC652-3 is suitable for 6 applications: Telecom Line-Card Interface Logic, ASIC Prototyping and Emulation, Industrial Control and Datapath Bridging, Legacy Military/Aerospace Avionics, High-Speed Datapath and DSP Front-End, Medical Imaging and Diagnostic Systems.
Telecom Line-Card Interface Logic
The EP20K300EBC652-3's 11,520 logic elements and 147,456 bits of embedded RAM suit telecom line cards that need parallel datapath processing and per-channel FIFOs. The MultiCore architecture with embedded dual-port RAM enables efficient queue management between TDM buses and packet backplanes, and the LVDS I/O support directly interfaces to serializer/deserializer (SERDES) companions without external level translation. With 408 user I/Os, designers can map multiple channels plus a control processor bus onto one device, while the -3 speed grade ensures timing margin at telecom clock rates.
Recommended
ASIC Prototyping and Emulation
The EP20K300EBC652-3 provides a balanced 11,520-logic-element capacity that maps well to mid-complexity ASIC RTL designs for pre-silicon validation. Quartus II APEX 20KE support preserves Verilog/VHDL compatibility, and the 147,456-bit embedded memory models ASIC SRAM blocks for accurate timing studies. The 652-BGA package supports JTAG-based configuration plus external memory interfaces, allowing prototypes to load test vectors rapidly. Engineers building ASIC emulators frequently chain multiple EP20K300 devices via LVDS to scale capacity beyond a single FPGA.
Recommended
Industrial Control and Datapath Bridging
The EP20K300EBC652-3 is widely deployed in industrial automation backplanes where it bridges legacy parallel buses (VME, ISA, custom) to modern processor interfaces. Its 408 user I/Os comfortably accommodate wide datapath glue logic between sensor arrays, motor controllers, and supervisory processors. The 0 to +85 C commercial temperature range fits factory-floor enclosures, and the LVDS capability reduces EMI on long backplane traces. Embedded CAM blocks support address-lookup functions common in industrial protocol converters.
Recommended
Legacy Military/Aerospace Avionics
The EP20K300EBC652-3 is found in mature avionics and military programs where long-lifecycle support outweighs the need for modern features. Its MultiCore architecture combines LUT and product-term logic that survives decades of configuration reuse, and the 652-BGA package with 1.27 mm pitch is compatible with mil-spec PCB processes. For programs needing traceability, Altera/Intel still supports the APEX 20KE silicon mask set via long-term agreements, and the 1.8V core simplifies power supply design compared to legacy 5V FPGAs.
Recommended
High-Speed Datapath and DSP Front-End
The EP20K300EBC652-3's LAB structure with carry-chain support enables efficient arithmetic pipelines, FIR filters, and FFT pre-processors in software-defined radio and signal-intelligence front-ends. The 147,456 bits of embedded RAM allow coefficient tables and sample buffers to sit on-chip, reducing external memory access latency. With LVDS I/O at -3 speed grade, designers can clock datapaths into the 200+ MHz range and feed external DACs or ADCs directly, while keeping the pin count of 408 sufficient for wide sample buses.
Recommended
Medical Imaging and Diagnostic Systems
The EP20K300EBC652-3 appears in medical imaging modalities such as ultrasound beamformers and endoscopy controllers, where parallel image processing channels demand high logic density and ample embedded memory. The 11,520 logic elements support per-channel digital filters and scan-conversion logic, while the 147,456-bit RAM holds line buffers and lookup tables. The MultiCore architecture and abundant I/Os let one FPGA interface to multiple image sensors, motor drivers, and display controllers simultaneously, with LVDS reducing noise on sensitive analog front-end signals.
Recommended
Recommended Products Summary
Engineering reference data for EP20K300EBC652-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K300EBC652-2X | EP20K300EBC652-2 | EP20K300EBC652-1X | EP20K300EBC652-1 | EP20K200EBC652-3 | EP20K200EBC652-3N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA (45x45 mm) | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same |
| Series | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE |
| Speed Grade | -3 (fastest) | -2X | -2 | -1X | -1 | -3 | -3 |
| Logic Elements | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 8,320 | 8,320 |
| Number of LABs | 1152 | 1152 | 1152 | 1152 | 1152 | 1024 | 1024 |
| Total RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 106,496 | 106,496 |
| User I/Os | 408 | 408 | 408 | 408 | 408 | 376 | 376 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
Key Differentiators
- Highest speed grade in the APEX 20KE 300K family (vs EP20K300EBC652-2)
- Maximum logic capacity among 300K APEX 20KE speed variants (vs EP20K200EBC652-3)
- LVDS-capable MultiCore architecture with 408 user I/Os (vs EP20K300EBC652-1)
Design Notes
The 652-BGA package uses 1.27 mm ball pitch on a 45x45 mm substrate. PCB layout requires a minimum of 6 routing layers for clean BGA escape, with microvia or via-in-pad recommended for inner rows. Use continuous ground planes beneath the BGA and assign at least one inner layer as a solid power island for the 1.8V core. Decoupling: place 0.1 uF X7R ceramics on every VCCINT and VCCIO pin pair, plus bulk 22 uF tantalum or polymer caps near each supply pin group.
LVDS signals must be routed as 100 ohm differential pairs with matched lengths within 150 mil for the -3 speed grade. Keep LVDS pairs on the same layer to avoid impedance discontinuities, and route them at least 3W away from single-ended signals to minimize crosstalk. The APEX 20KE supports LVDS inputs but requires external 100 ohm termination across the pair at the receiver; series AC-coupling capacitors are typically 0.1 uF for telecom data rates.
Do not confuse the APEX 20KE (1.8V core) with the older APEX 20K (2.5V core); the two are not voltage-compatible. When migrating from APEX 20K designs to APEX 20KE, recompile in Quartus II with the 20KE device library, re-validate I/O standard assignments, and re-check timing closure because LAB and EAB structures changed subtly. Configuration bitstreams are also not interchangeable between the two families.
Estimated: at full logic utilization with 100% toggle rate at 200 MHz, the EP20K300EBC652-3 dissipates roughly 1.5-2.5 W. The 652-BGA package has theta_JA of approximately 12 C/W with 1 sq inch of copper and 100 LFM airflow, so junction temperature stays within the 0-85 C commercial range. For high-utilization designs, place multiple thermal vias under the BGA thermal balls and use a 4-layer PCB minimum to keep junction rise below 20 C.
Compliance Information
Compliance information not explicitly stated in the verified web data; the APEX 20KE family predates current RoHS documentation standards. Many APEX 20KE parts shipped in both Sn/Pb and Pb-free variants - check distributor date code and lot markings.
