EP20K400CB652C7N - 400K-Gate APEX 20KC FPGA | Intel (Altera)
MPN: EP20K400CB652C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $158 | $79,000.00 |
EP20K400CB652C7N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing configurable logic blocks, programmable interconnects, and dedicated memory/DSP blocks. APEX 20KC devices sit within the broader taxonomy: PLD -> FPGA -> high-density SRAM-based FPGA -> APEX family -> APEX 20KC generation. This device is engineered for data-path and DSP-heavy designs that require embedded memory alongside general-purpose logic.
Key features include 502 user I/Os, 1.48 ns pin-to-pin propagation delay (per Microchip USA listing), 2.5 ns internal logic delay (per DigChip specification), and core supply voltage of 1.8 V (VCCINT) with 2.5 V I/O supply (VCCIO). The device supports up to 375.94 MHz operation (per Jotrin listing) and is pin-compatible with the lower-cost APEX 20KE series while offering 25-35% faster design performance, thanks to the all-layer copper interconnect.
Architecturally, the APEX 20KC combines MegaLAB structures containing multiple Logic Array Blocks (LABs), embedded system blocks (ESBs) for RAM/ROM/CAM, and FastTrack interconnect. The 0.15-micron copper process lowers interconnect resistance and capacitance versus aluminium metallization, reducing dynamic power and improving timing margins. Embedded memory and dedicated carry chains simplify DSP and datapath implementation.
Typical applications include telecommunications infrastructure (line cards, protocol bridges), high-speed data acquisition systems, DSP co-processing, network switching equipment, and industrial imaging/medical imaging front-ends. The 502 user I/Os make it suitable for bus-intensive designs that require wide external memory or multiple parallel data streams.
When designing with this part, note that configuration data must be loaded from external PROMs (EPC devices such as EPC2 or EPC16) at every power-up because the SRAM configuration cells are volatile. Designers must also respect the APEX 20KC I/O standard rules and provide proper decoupling across VCCINT and VCCIO planes.
Drop-in alternatives for EP20K400CB652C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CB652C7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CB652C7ES
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View Datasheet →EP20K400BC652-3
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View Datasheet →EP20K200EBC652-3N
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View Datasheet →EP20K400CB652C7N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Series | EP20K400 |
| System Gates | 400,000 |
| Logic Elements / Cells | 16,640 |
| User I/Os | 502 |
| Package | 652-ball PBGA (BGA-652) |
| Logic Family | CMOS (SRAM-based) |
| Process Technology | 0.15-um all-layer copper |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 2.5 V |
| Supply Voltage (general) | 2.5 V |
| Pin-to-Pin Propagation Delay | 1.48 ns |
| Internal Propagation Delay | 2.5 ns |
| Maximum Operating Frequency | 375.94 MHz |
| Operating Temperature | 0 C to 85 C (commercial) |
| Mounting Type | Surface Mount |
| Architecture | MultiCore (LUT + embedded memory) |
EP20K400CB652C7N 652-ball pbga (bga-652) Pin Configuration Guide
Pin configuration for EP20K400CB652C7N (652-ball pbga (bga-652) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CB652C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CB652C7N is suitable for 7 applications: Telecommunications Line Cards, High-Speed Data Acquisition Systems, DSP Co-Processing Accelerators, Industrial Imaging and Machine Vision, Network Switching and Routing Fabric, Medical Imaging Front-End Processing, Legacy System Repair and Sustainment.
Telecommunications Line Cards
The EP20K400CB652C7N fits telecommunications line-card designs because its 400K system gates and 16,640 logic elements provide ample capacity for cell/packet processing engines, framer/mapper functions, and serial-protocol state machines. The 502 user I/Os accommodate wide parallel UTOPIA/SPI-4.2 or POS-PHY bus interfaces to network processors without external bus-multiplexing logic. With 375.94 MHz maximum internal frequency, it can sustain the throughput required for OC-48/STM-16 backplane rates while the 0.15-um copper interconnect keeps dynamic power manageable in dense line-card layouts. The MultiCore architecture with embedded memory blocks simplifies per-channel buffer implementation for asynchronous transfer mode or MPLS switching fabric.
Recommended
High-Speed Data Acquisition Systems
For data acquisition front-ends, the EP20K400CB652C7N's 16,640 logic elements deliver parallel processing for real-time DSP pipelines, FIR filtering, and histogram generation while the embedded system blocks (ESBs) handle sample-buffer memory without external SRAM. The 502 user I/Os accept wide LVDS or LVCMOS buses directly from high-speed ADCs, reducing inter-chip glue logic. With 1.48 ns pin-to-pin propagation delay (per Microchip USA listing), the part captures fast-edge sample timing at rates well above 100 MHz; the 0-85 C commercial temperature range suits laboratory and industrial-grade instrumentation enclosures.
Recommended
DSP Co-Processing Accelerators
The APEX 20KC family supports DSP co-processing through dedicated carry chains and embedded multipliers; the EP20K400CB652C7N at 400K gates hosts complex FFT, convolution, and digital-filter engines offloaded from a host CPU or DSP. The MultiCore architecture integrates LUT logic with memory blocks, enabling systolic-array or pipelined MAC implementations. With 375.94 MHz internal frequency, the device sustains high sample rates for radar, software-defined radio, or audio-processing applications; 502 user I/Os connect to host processors via standard parallel buses or high-speed LVDS links.
Recommended
Industrial Imaging and Machine Vision
The EP20K400CB652C7N's 502 user I/Os accept raw sensor data from CCD/CMOS camera interfaces, while the 16,640 logic elements implement Bayer demosaicing, color-space conversion, and image-statistics engines in real time. Embedded memory blocks hold line buffers for 2D filter kernels, eliminating the need for external SRAM. The 1.48 ns pin-to-pin propagation delay handles high-speed Camera Link or LVDS image streams; 0-85 C commercial temperature is appropriate for factory-floor enclosures. Industrial-vision designers can pair this FPGA with Altera's Nios soft-core for embedded control.
Recommended
Network Switching and Routing Fabric
For switching fabrics, the EP20K400CB652C7N implements queue managers, schedulers, and lookup engines with 400K system gates and 16,640 logic elements, scaling to multi-gigabit throughput. The 502 user I/Os interface to multiple Gigabit Ethernet MACs, content-addressable memories (CAMs), or external TCAM lookups for routing tables. At 375.94 MHz, the part sustains line-rate processing for 10+ Gigabit Ethernet aggregate switches; the MultiCore architecture with embedded memory implements deep packet buffers and statistics counters efficiently.
Recommended
Medical Imaging Front-End Processing
Medical imaging systems - ultrasound beamformers, MRI digitizers, CT reconstruction boards - use the EP20K400CB652C7N because of its large embedded-memory capacity for sample buffers, plus 502 user I/Os for parallel ADC interfaces. The 1.48 ns propagation delay supports high-frequency ultrasound receive paths, while the 0.15-um copper interconnect reduces power dissipation critical in patient-proximal equipment. Designers should use the -2V or -3 industrial variants for wider temperature tolerance in clinical settings. The MultiCore LUT-plus-memory architecture simplifies beamforming kernel implementations.
Recommended
Legacy System Repair and Sustainment
Many defense, aerospace, and industrial-control systems designed in the early 2000s used APEX 20KC devices and require replacement parts for sustainment. The EP20K400CB652C7N remains the exact production-line part for these boards; its pin-compatible variants EP20K400CB652C7ES and EP20K400BC652-3 (Site MPN list) serve as direct drop-in replacements when the original part is out of stock. This sustainment use case is the dominant application for this obsolete part, with broker inventory and aftermarket suppliers serving long-tail defense and industrial customer bases.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CB652C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CB652C7ES | EP20K400BC652-3 | EP20K400BC652-2V | EP20K300EBC652-3 | EP20K200EBC652-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-652 (PBGA652) | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same |
| System Gates | 400,000 | 400,000 (same) | 400,000 (same) | 400,000 (same) | 300,000 (-25%) | 200,000 (-50%) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V | 1.8 V |
| Speed Grade | -7 (C7N) | -7 (C7ES) extended screening | -3 (faster timing closure margin) | -2 with industrial temperature | -3 | -3 |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial extended screening | Commercial | Industrial (-40 C to 100 C) | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration PROM Required | Yes (EPC2/EPC4/EPC8/EPC16/EPC32) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Key Differentiators
- Highest logic capacity in the Altera APEX 20K BGA-652 footprint family within Site MPN list (vs EP20K300EBC652-3 and EP20K200EBC652-3N)
- Drop-in identical functional option for higher-reliability screening (vs EP20K400CB652C7ES)
- Industrial-temperature drop-in variant available in same BGA-652 package (vs EP20K400BC652-2V)
- Pin-compatible with faster speed grade -3 for timing margin headroom (vs EP20K400BC652-3)
Design Notes
The EP20K400CB652C7N requires separate 1.8 V VCCINT and 2.5 V VCCIO supplies. VCCINT powers the SRAM configuration cells and core logic; VCCIO powers the I/O banks. Decouple each supply pin with a 0.1 uF ceramic capacitor placed as close as physically possible to each ball, plus bulk decoupling (10-100 uF tantalum or polymer) per supply plane. Sequence VCCINT before VCCIO (or simultaneously) - never power VCCIO before VCCINT, which can trigger I/O latch-up and permanent damage to the FPGA.
Route configuration signals (nSTATUS, CONF_DONE, nCONFIG, nCE, DCLK) carefully because they drive all SRAM cells at power-up. Use controlled-impedance traces, isolate them from switching I/O near the BGA, and provide a JTAG header (TCK, TMS, TDO, TDI) accessible from the board edge for programming and boundary-scan. Because the FPGA is BGA-652, escape routing must use high-density interconnect (HDI) PCB technology with microvias; 4-layer FR-4 is generally insufficient for this package. Plan a minimum 6-layer stack-up with dedicated power and ground planes.
Estimated: At typical 60% utilization with 1.8 V core and 2.5 V I/O supplies, the EP20K400CB652C7N may dissipate 1.5-2.5 W in a properly ventilated enclosure, but worst-case designs with all 502 I/Os toggling at 100 MHz can reach 3-4 W. The PBGA-652 package has a junction-to-ambient thermal resistance of approximately 18-25 C/W depending on PCB copper area, so derate board thermal design accordingly. Provide forced-air cooling for designs where total expected dissipation exceeds 2 W.
Common pitfalls: (1) Forgetting that SRAM-based APEX 20KC parts re-load from configuration PROM at every power-up - cold boot is not transparent; (2) Driving JTAG TCK with non-3.3V-compliant signals can damage the input structure; (3) Leaving unused I/O pins floating - they will draw excess current and increase noise; explicitly set unused pins to 'tri-state' in the Quartus pin-assignment file; (4) Mixing 3.3V LVCMOS signals into a 2.5 V VCCIO bank will damage the I/O cells - check bank voltage assignment before PCB layout.
Compliance Information
RoHS/REACH/lead-free status not confirmed in verified web data for the EP20K400CB652C7N specifically. Altera/Intel APEX 20KC parts were manufactured before strict RoHS enforcement on legacy parts; some lots may be lead-containing. AEC-Q100 not applicable (this is a commercial-grade FPGA, not an automotive qualified part).
