EP20K300EQI240-3N - APEX 20KE 300K Gates FPGA | Altera (Intel)
MPN: EP20K300EQI240-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $121 | $12,100.00 |
| 500 | $108.75 | $54,375.00 |
| 1,000 | $97.2 | $97,200.00 |
EP20K300EQI240-3N Overview
What is an APEX-20K FPGA? APEX (Advanced Logic Element Matrix) is Altera's multi-core, multi-volt family of SRAM-based FPGAs targeting high-density logic, embedded memory, and PLLs in a single die. APEX sits in the broader taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) / FPGA -> SRAM-based FPGA -> APEX 20K family. Within that family, APEX 20KE is the 1.8 V variant of the original APEX 20K (2.5 V), and 'EQ' indicates the enhanced commercial/extended temperature range and '-3' is the speed grade.
Key features include 152 user I/O pins (with 4 dedicated inputs), embedded system blocks that combine LUTs, product-term logic and memory, on-chip PLLs for clock management, multi-volt I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V), and an in-system programmability interface via Altera's ByteBlaster or MasterBlaster cable through the IEEE 1149.1 JTAG port. The die offers 1,536 flip-flops distributed across embedded logic array blocks (LABs) and supports up to 152 maximum user I/O.
Typical applications include high-volume telecom line cards, industrial control and instrumentation, data-path glue logic, glue-logic integration alongside processors, and legacy designs where a 1.8 V APEX 20KE footprint is required. The 'I' temperature grade extends operation to -40 °C to +105 °C, suitable for industrial enclosures.
When designing with this part, verify the Quartus II or MAX+PLUS II legacy bitstream and software support, as APEX 20K is end-of-life; new designs should consider Cyclone or MAX families. JTAG programming is recommended for production programming and boundary-scan testing.
This page synthesizes distributor pricing and stock data for EP20K300EQI240-3N alongside parametric drop-in alternatives from the same APEX 20KE family, providing information gain not available on any single distributor product page.
Drop-in alternatives for EP20K300EQI240-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K300EQI240-3N (same form factor and footprint) — differing in Family, Series, Operating Temperature, Package / Case, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K300EQC240-3N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K300EQI240-2X
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP20K300EQC240-3
✅ Drop-In✓ In Stock
$87.2 / Unit
View Datasheet →EP20K300EQC240-2X
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP20K300EQC240-2XN
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EP20K300EQC240-2
✅ Drop-In✓ In Stock
$89 / Unit
View Datasheet →EP20K300EQI240-3N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Series | EP20K300 |
| System Gates | 300,000 |
| Logic Elements | 11,520 |
| Embedded Memory (bits) | 147,456 |
| Maximum User I/O | 152 |
| Dedicated Inputs | 4 |
| Package | 240-pin BQFP/PQFP (PowerQuad Flat Pack) |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V nominal (1.71 V min, 1.89 V max) |
| I/O Standard Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Operating Temperature | -40 °C to +105 °C (industrial 'I' grade) |
| Speed Grade | -3 |
| Programming Interface | IEEE 1149.1 JTAG (ByteBlaster / MasterBlaster) |
EP20K300EQI240-3N 240-pin bqfp/pqfp (powerquad flat pack) Pin Configuration Guide
Pin configuration for EP20K300EQI240-3N (240-pin bqfp/pqfp (powerquad flat pack) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K300EQI240-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K300EQI240-3N is suitable for 6 applications: Legacy Telecom Line-Card Glue Logic, Industrial Control and Instrumentation, Data-Path Glue Logic and Bridge FPGA, Legacy ASIC Replacement and Bridge Logic, JTAG-Based Board Test and Boundary Scan, Embedded System Block and Memory Integration.
Legacy Telecom Line-Card Glue Logic
The EP20K300EQI240-3N integrates 300K system gates, 11,520 LEs, and 152 user I/O in a single APEX 20KE die, making it ideal for legacy telecom line cards that previously relied on multi-CPLD glue-logic farms. Its multi-volt I/O (1.5 V to 3.3 V) lets it bridge TDM buses, framer ICs, and T1/E1 transceivers without level shifters. The 1.8 V core reduces power versus the older 2.5 V APEX 20K, while the industrial temperature grade ensures operation in controlled-environment central-office racks. JTAG ISP enables field reprogramming during service windows without removing the line card.
Recommended
Industrial Control and Instrumentation
The EP20K300EQI240-3N's industrial -40 to +105 °C temperature grade and 1.8 V core make it suitable for industrial control and instrumentation platforms. With 147,456 bits of embedded memory and 11,520 LEs, the FPGA can host PID controllers, state machines, and high-speed signal-conditioning glue. Multi-volt I/O lets it interface 3.3 V ADCs, 2.5 V DACs, and 1.8 V processor buses on the same board. JTAG boundary-scan plus ISP support in-system firmware updates during commissioning, which is critical when devices are mounted in sealed industrial enclosures.
Recommended
Data-Path Glue Logic and Bridge FPGA
With 152 user I/O and embedded memory, the EP20K300EQI240-3N excels as a data-path bridge FPGA between legacy parallel buses, custom interfaces, and modern processors. It can implement custom memory controllers, FIFO buffers, and protocol converters (for example, UTOPIA, IMA, or custom DMA bridges) that fall outside standard ASSP offerings. The 240-pin PQFP gives enough I/O for 32-bit data buses plus control, addressing, and clock signals. Its 1.8 V core matches modern processor I/O voltages, simplifying PCB routing.
Recommended
Legacy ASIC Replacement and Bridge Logic
The EP20K300EQI240-3N is widely used in production systems where a legacy ASIC has gone EOL and must be re-implemented on an FPGA for continued supply. The 300K-gate capacity and APEX 20KE architecture support direct re-mapping of older ASIC netlists with Quartus II legacy support. The 240-pin PQFP package matches many legacy ASIC footprints, enabling PCB reuse with minimal rework. The industrial temperature grade suits industrial and telecom-end equipment, while JTAG ISP allows post-assembly verification.
Recommended
JTAG-Based Board Test and Boundary Scan
The EP20K300EQI240-3N supports IEEE 1149.1 JTAG boundary scan, making it useful as a high-density logic test vehicle for legacy boards whose original boundary-scan devices are obsolete. Its 152 user I/O can be chained to test adjacent devices, RAMs, and connectors. Multi-volt I/O lets it sit at the JTAG chain head regardless of the board's primary logic voltage. The APEX 20KE on-chip PLL also serves as a board-level clock source for scan testing.
Recommended
Embedded System Block and Memory Integration
The EP20K300EQI240-3N integrates 147,456 bits of embedded SRAM distributed across MegaLAB structures, allowing designers to implement dual-port RAMs, ROMs, and FIFOs without external memory. Combined with 11,520 LEs, designers can build complete embedded subsystems - microcontroller cores, peripheral controllers, and DSP functions - in a single APEX 20KE device. The 1.8 V core and multi-volt I/O integrate cleanly into mixed-voltage embedded boards, while 152 user I/O are enough for typical embedded bus widths plus peripheral connections.
Recommended
Recommended Products Summary
Engineering reference data for EP20K300EQI240-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K300EQC240-3N | EP20K300EQI240-2X | EP20K300EQC240-3 | EP20K300EQC240-2X | EP20K300EQC240-2XN | EP20K300EQC240-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 240-pin PQFP/BQFP | 240-pin PQFP/BQFP - same | 240-pin PQFP/BQFP - same | 240-pin PQFP/BQFP - same | 240-pin PQFP/BQFP - same | 240-pin PQFP/BQFP - same | 240-pin PQFP/BQFP - same |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE |
| System Gates | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 |
| Logic Elements | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 |
| Speed Grade | -3 (fastest) | -3 (same) | -2X (slower) | -3 (same) | -2X (slower) | -2XN (slower) | -2 (slower) |
| Operating Temperature | -40 to +105 °C (industrial) | 0 to +85 °C (commercial) | -40 to +105 °C (industrial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O (max) | 152 | 152 | 152 | 152 | 152 | 152 | 152 |
Key Differentiators
- Industrial temperature grade (-40 to +105 °C) (vs EP20K300EQC240-3N)
- Fastest speed grade (-3) in the APEX 20KE family (vs EP20K300EQI240-2X)
- Same-die second source within APEX 20KE (vs EP20K300EQC240-3)
Design Notes
The EP20K300EQI240-3N APEX 20KE core runs at 1.8 V nominal, but the multi-volt I/O banks each need their own supply rail (1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the connected logic). Decouple each VCCINT and each VCCIO bank with a 0.1 µF ceramic plus a bulk 10 µF tantalum placed within 5 mm of the package leads. Tie unused I/O banks to a valid VCCIO rather than leaving them floating to avoid I/O latch-up during power-up sequencing. The PQFP240 leads have limited current-carrying capacity, so do not route high-current traces through the FPGA leads.
Estimated: the APEX 20KE core dissipates roughly 0.5-1.5 W at 1.8 V depending on toggle rate and logic utilization; PQFP packages typically have θJA of ~20-30 °C/W with adequate PCB copper. For full 300K-gate utilization at industrial temperatures, calculate junction temperature rise (P × θJA + ambient) and confirm it stays below 125 °C. Add thermal vias beneath the exposed die attach pad if the PCB layout permits; otherwise use external airflow or heatsink contact on the package top.
The 240-pin PQFP has 0.5 mm typical lead pitch (verify exact pitch against the device package drawing) and gull-wing leads requiring solder paste on the pads. Use a 4-layer PCB with continuous ground plane beneath the FPGA to control impedance for high-speed I/O. Route clock and JTAG traces first with impedance-controlled length matching; assign 4 dedicated inputs to clock inputs to leverage the on-chip PLL's low-skew clock distribution.
Do not confuse APEX 20KE (1.8 V core) with APEX 20K (2.5 V core); they are not drop-in across core voltage. Verify the bitstream and Quartus II / MAX+PLUS II project target the '20KE' device family before programming - programming an APEX 20K bitstream into a 20KE device, or vice versa, can damage the device. JTAG programming requires the correct BSDL file for the EP20K300EQI240-3N device variant; ensure boundary-scan testers load the right BSDL.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not specified in the verified distributor data for the obsolete APEX 20KE family. AEC-Q100 is not applicable to FPGAs. For new automotive designs, use AEC-Q100-qualified Cyclone or MAX 10 devices instead.
