EP20K300EQC240-3 - APEX-20KE 300K Gate FPGA | Intel | PQFP-240
MPN: EP20K300EQC240-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $112 | $11,200.00 |
| 250 | $98.75 | $24,687.50 |
| 500 | $87.2 | $43,600.00 |
EP20K300EQC240-3 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the end-user can reprogram after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) - alongside CPLDs, SPLDs, and PALs - and belong to the digital logic / ASIC-prototyping class of semiconductors. The APEX-20KE family introduced MultiCore architecture, integrating look-up tables, embedded system blocks (ESBs) for memory, and dedicated I/O elements on a single die.
Key features include 152 maximum user I/O pins, four Phase-Locked Loops (PLLs) for clock management, hot-socketing support, multi-volt I/O compatibility (1.8V core / 2.5V, 3.3V, 5.0V tolerant I/O), and in-system programmability via the IEEE 1149.1 JTAG interface. The PQFP-240 package offers gull-wing leads on a 1.0 mm pitch and supports commercial operating temperature ranges (0C to +85C).
Architecturally, the EP20K300E combines LUT-based logic with embedded system blocks that can be configured as FIFO, dual-port RAM, or CAM, all interconnected via a high-bandwidth MultiTrack routing fabric. The four PLLs enable sophisticated clock-domain management for multi-rate telecommunications and DSP pipelines.
Typical applications include telecommunications line cards, DSP co-processing in baseband systems, high-speed glue logic, bus bridging (PCI to local bus), and ASIC prototyping for designs up to ~250K usable gates. Designers also deploy the EP20K300E in industrial control, video processing front-ends, and military/aerospace pre-production validation.
When designing with this part, ensure the Quartus II (or legacy MAX+PLUS II) tool flow is used, plan JTAG chain ordering carefully, and respect 1.8V VCCINT supply ramp sequencing to avoid in-rush latch-up. Legacy parts may require lifecycle planning since the APEX-20KE family reached end-of-life; contact Intel FPGA for last-time-buy windows.
Drop-in alternatives for EP20K300EQC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K300EQC240-3 (same form factor and footprint) — differing in Family, Operating Temperature, Package / Case, Series, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K300EQC240-3N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K300EQC240-2X
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP20K300EQC240-2XN
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EP20K300EQC240-2
✅ Drop-In✓ In Stock
$89 / Unit
View Datasheet →EP20K200EQC240-3N
✅ Drop-In✓ In Stock
$45.25 / Unit
View Datasheet →EP20K160EQC240-3N
✅ Drop-In✓ In Stock
$92.5 / Unit
View Datasheet →EP20K300EQC240-3 Maximum Ratings & Electrical Characteristics
| Family | APEX-20KE |
| Typical Gates | 300,000 |
| Logic Elements / Cells | 11,520 |
| Embedded Memory (bits) | 147,456 |
| Maximum User I/O | 152 |
| Number of PLLs | 4 |
| Speed Grade | -3 |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage Tolerance | 2.5V / 3.3V / 5.0V compatible |
| Package | 240-pin PQFP / BFQFP (240-BFQFP) |
| Pin Pitch | 1.0 mm |
| Terminal Form | Gull Wing |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Programmable Logic Type | Loadable PLD |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| Process Technology | 0.22 um CMOS |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial |
EP20K300EQC240-3 240-pin pqfp / bfqfp (240-bfqfp) Pin Configuration Guide
Pin configuration for EP20K300EQC240-3 (240-pin pqfp / bfqfp (240-bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K300EQC240-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K300EQC240-3 is suitable for 6 applications: Telecommunications Line Card Processing, ASIC Prototyping and Validation, DSP Co-Processing and Pipeline Acceleration, PCI Bus Bridge and Glue Logic, Industrial Control and Automation, Video Processing Front-End.
Telecommunications Line Card Processing
The EP20K300EQC240-3 fits telecommunications line-card designs because its 300K typical gates and 152 user I/Os deliver the logic density and signal count needed for multi-channel framer, mapper, and HDLC controllers. The four PLLs allow independent clock synthesis for STS-1/STM-0 line rates, while the MultiCore embedded system blocks implement pointer-processing FIFOs and elastic-store memories without external SRAM. The 1.8V core with 3.3V-tolerant I/O integrates cleanly with legacy 3.3V bus interfaces; the PQFP-240 footprint is solderable with standard SMT lines.
Recommended
ASIC Prototyping and Validation
The EP20K300EQC240-3 is widely deployed as an ASIC prototyping vehicle for gate-array and standard-cell designs in the 200-280K usable-gate range. Designers map RTL into Quartus II targeting the APEX-20KE device to validate timing, verify functional behavior, and benchmark performance before committing to NRE mask charges. The 11,520 logic elements and 147 Kbits embedded memory map large datapath blocks, while the 152 I/Os expose enough off-chip connectivity to validate multi-bus ASICs. The PQFP-240 package provides easy probing and rework during prototype bring-up.
Recommended
DSP Co-Processing and Pipeline Acceleration
The EP20K300EQC240-3 fits DSP co-processor roles in baseband and image-processing pipelines by combining 11,520 logic elements for parallel datapath operators (multipliers, accumulators, FFT butterflies) with 147 Kbits embedded memory for coefficient and sample buffering. The four PLLs generate the multiple clock domains required for sample-rate conversion, and the high I/O count enables parallel LVDS or sub-LVDS interfaces to high-speed ADCs/DACs. Designers pair the FPGA with a host DSP (e.g., TI TMS320) for the algorithmic control flow while offloading compute kernels.
Recommended
PCI Bus Bridge and Glue Logic
The EP20K300EQC240-3 implements PCI / PCI-X bus bridges, I/O expansion bridges, and legacy glue-logic consolidation because the 240-pin PQFP package exposes sufficient I/Os for 32- or 64-bit PCI bus signaling plus local-bus and memory interfaces. The MultiCore embedded system blocks implement DMA FIFOs and posted-write buffers without external memory, and the JTAG-based in-system programmability enables field firmware updates for industrial PC platforms.
Recommended
Industrial Control and Automation
The EP20K300EQC240-3 fits industrial control designs that require deterministic parallel logic for motor control, encoder decoding, and real-time I/O aggregation. The 152 I/Os handle multi-axis encoder inputs, PWM outputs, and parallel sensor buses. MultiCore ESBs implement deterministic FIFOs for command queuing and event timestamping. The commercial 0C-85C temperature grade suffices for factory-floor enclosures; for harsher environments, designers use the -I (industrial) speed grade variant. The PQFP-240 package is compatible with through-hole-compatible lead-forming for repairable industrial backplanes.
Recommended
Video Processing Front-End
The EP20K300EQC240-3 suits video processing front-ends (broadcast routing, format conversion, chroma-keying) because the 300K-gate density maps line buffers, color-space converters, and timing generators in a single device. The 147 Kbits embedded memory implements small line stores; larger frame buffers live in external SDRAM controlled by the FPGA. The four PLLs generate pixel-clock, memory-clock, and output-clock domains from a single 27 MHz reference, simplifying the BOM and the PCB layout. The PQFP-240 footprint exposes 152 I/Os for 30-bit digital video buses plus control.
Recommended
Recommended Products Summary
Engineering reference data for EP20K300EQC240-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K300EQC240-3N | EP20K300EQC240-2X | EP20K200EQC240-3N | EP20K160EQC240-3N |
|---|---|---|---|---|---|
| Package | PQFP-240 (BFQFP) | PQFP-240 (BFQFP) - same | PQFP-240 (BFQFP) - same | PQFP-240 (BFQFP) - same | PQFP-240 (BFQFP) - same |
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | -3 | -3 (same) | -2X (faster) | -3 (same) | -3 (same) |
| Typical Gates | 300,000 | 300,000 | 300,000 | 200,000 (-33%) | 160,000 (-47%) |
| Logic Elements | 11,520 | 11,520 | 11,520 | ~8,000 (-30%) | ~6,400 (-45%) |
| Embedded Memory (bits) | 147,456 | 147,456 | 147,456 | 106,496 (-28%) | 81,920 (-44%) |
| Maximum User I/O | 152 | 152 | 152 | ~140 | ~140 |
| Lead-Free (RoHS) | No (SnPb) | Yes (RoHS) | No (SnPb) | Yes (RoHS) | Yes (RoHS) |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Key Differentiators
- Highest density in APEX-20KE PQFP-240 family (vs EP20K200EQC240-3N)
- Four PLLs versus two in lower-density siblings (vs EP20K160EQC240-3N)
- Most PQFP-240 I/O available (152) (vs EP20K100EQC240-3N)
Design Notes
The EP20K300EQC240-3 requires a clean 1.8V VCCINT supply capable of delivering up to ~1.5A during configuration and high-utilization operation. Use a low-dropout linear regulator (e.g., LT1764-1.8) or a switching regulator with sufficient bulk capacitance (>= 220 uF low-ESR) at the FPGA supply pin. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the pin; place 10 uF tantalum bulk capacitors at every VCCINT-to-GND pair. Estimated: at typical 70% utilization and 100 MHz operation, the VCCINT current is ~1.2A; peak in-rush during configuration can reach 1.5A for ~10 ms.
PQFP-240 packages on 1.0 mm pitch require careful PCB layout. Use 0.20 mm wide copper pads with 1.5:1 aspect ratio, NSMD (Non-Solder-Mask-Defined) land patterns, and micro-via-in-pad only on inner layers. Place GND vias on the inner-thermal pad area to dissipate ~0.8 W typical power. Match trace lengths within +/- 0.13 mm for clock and JTAG signals to avoid setup/hold violations at 100+ MHz. Place all VCCIO decoupling within 3 mm of each bank pin and route each bank supply independently for noise isolation.
Common pitfalls include (1) forgetting that VCCINT must ramp monotonically to 1.8V in <= 100 ms - failure to do so risks in-rush latch-up; (2) tying nCONFIG low at power-up without proper reset logic, preventing configuration; (3) mixing 5V signals on I/O banks powered at 3.3V without 5V-tolerant clamping; (4) overlooking that the -3 speed grade degrades Fmax by ~25% vs -1, often pushing designs into timing failure when over-clocked; (5) using JTAG chain devices with incompatible TCK frequencies - all devices in the JTAG chain must support the slowest TCK rate.
Route all four PLL analog supplies (VCCA_PLL) independently from their respective digital VCCIO, with an LC pi-filter (ferrite bead + 10 uF + 0.1 uF) to minimize jitter. Place the PLL feedback loop traces on the same PCB layer without vias, and guard them with GND pours. Distribute VCCIO across the four I/O banks according to the I/O standard assignments in Quartus pin-planner; never allow floating VCCIO pins - each bank must be powered even if unused. Maintain 50 ohm controlled impedance on LVDS and clock traces, with 90 ohm differential for LVDS pairs.
Compliance Information
EP20K300EQC240-3 uses SnPb (leaded) terminal finish - non-RoHS. Choose EP20K300EQC240-3N for RoHS compliance. AEC-Q100 not applicable for FPGA logic devices.
