EP20K400BI652-2V - 400K Gates APEX 20K FPGA 652-BGA | Intel / Altera
MPN: EP20K400BI652-2V ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $99 | $49,500.00 |
| 1,000 | $84.5 | $84,500.00 |
EP20K400BI652-2V Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing to implement arbitrary digital logic. FPGAs sit hierarchically between standard-cell ASICs (highest performance, highest NRE cost) and CPLDs (lower density, non-volatile), offering the optimal balance of high logic density, parallel processing, hardware-level determinism, and short time-to-market for mid-to-high complexity designs. The APEX 20K family was Altera's first multi-core architecture to combine LUT logic with embedded memory, foreshadowing the modern concept of a system-on-a-programmable-chip (SOPC).
Key features include 502 user I/Os with multi-voltage I/O support, on-chip RAM/ROM via ESBs, dedicated clock networks with PLL support, JTAG-compliant boundary-scan testing, and in-system programmability through the IEEE 1149.1 (JTAG) interface or the passive serial configuration port. The device supports PCI, LVDS, SSTL, and GTL+ I/O standards when paired with appropriate external reference voltages. The 652-ball FineLine BGA package provides a compact 35 × 35 mm footprint suitable for high-density PCB designs.
Typical applications include telecommunications infrastructure (DSLAM line cards, SONET/SDH framer interface blocks), high-speed data acquisition and DSP preprocessing pipelines, networking switches and routers, industrial control and machine vision backplanes, and embedded computing platforms that require hardware-accelerated co-processing. Designers typically target APEX 20K devices for designs that exceed the logic capacity of CPLDs but do not justify the NRE of an ASIC.
When designing with this part, verify that your Quartus II (or legacy MAX+PLUS II) design environment version supports the EP20K400 device family, and confirm PCB layout accommodates the 1.27 mm BGA pitch with proper via-in-pad or dog-bone fanout. Power sequencing of the 2.5 V VCCINT and VCCIO rails should follow Altera's application note AN-117 to avoid hot-socket damage. Long-term supply is constrained because the APEX 20K family is now in the mature/legacy lifecycle phase.
Drop-in alternatives for EP20K400BI652-2V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400BI652-2V (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Series, Propagation Delay.
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EP20K400BI652-2
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$108.4 / Unit
View Datasheet →EP20K400BC652-3V
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$195 / Unit
View Datasheet →EP20K400BC652-3
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$189 / Unit
View Datasheet →EP20K400BC652-2V
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$260 / Unit
View Datasheet →EP20K400BC652-2XV
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$165 / Unit
View Datasheet →EP20K400BC652-2AA
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View Datasheet →EP20K400BI652-2V Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | APEX 20K (EPLD-based SOPC) |
| System Gates | 400,000 |
| Logic Elements | 16,640 |
| Maximum User I/O | 502 |
| Embedded Memory (bits) | 212,992 |
| Embedded Memory Blocks | ESBs (Embedded System Blocks) |
| Macros (per Mouser listing) | 1664 |
| Logic Family | CMOS |
| Process Technology | 0.22 μm |
| Core Supply Voltage (VCCINT) | 2.5 V |
| Propagation Delay | 2.5 ns (typical) |
| Internal Performance | 200 MHz (speed grade -2) |
| Operating Temperature | 0 °C to +85 °C (industrial, "I") |
| Package | 652-ball FineLine BGA (35 × 35 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive Serial |
EP20K400BI652-2V 652-ball fineline bga (35 × 35 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for EP20K400BI652-2V (652-ball fineline bga (35 × 35 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400BI652-2V.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400BI652-2V is suitable for 6 applications: Telecommunications Line Cards, High-Speed Data Acquisition Front-End, Industrial Machine-Vision Backplane, Networking Switch / Router Line Card, Embedded Computing Co-Processor Board, Test & Measurement Instrumentation.
Telecommunications Line Cards
The EP20K400BI652-2V fits telecom line-card designs that require 16,640 logic elements of parallel processing for protocol termination, packet classification, and traffic shaping. Its 502 user I/Os comfortably accommodate UTOPIA, POS-PHY, and SPI-4.2 parallel interfaces between the framer, network processor, and TDM switching fabric, while the 212,992 bits of embedded ESB memory provide on-chip buffer space for cell/packet queuing. The 200 MHz internal performance supports STS-1/STM-0 and even STS-3/STM-1 line rates when combined with external SERDES. The 652-ball BGA package integrates cleanly into multi-layer backplane PCBs common in DSLAM and SDH/SONET equipment.
Recommended
High-Speed Data Acquisition Front-End
The EP20K400BI652-2V serves as a parallel pre-processing engine in high-speed ADC data-acquisition systems where multiple LVDS data streams must be demultiplexed, calibrated, and formatted before delivery to a host processor or DSP. The 502 I/O count accepts wide parallel LVDS buses from multi-channel ADC arrays (e.g., 16-channel 14-bit ADCs at 100 MSPS), while the 16,640 logic elements implement digital down-conversion, FIR filtering, and channel calibration. The 2.5 ns LUT delay (~200 MHz) sets the per-channel processing ceiling; ESB memory buffers block transfers before DMA to the host.
Recommended
Industrial Machine-Vision Backplane
In machine-vision and factory-automation backplanes, the EP20K400BI652-2V aggregates data from multiple Camera Link or GigE Vision cameras, performing real-time pre-processing (region-of-interest extraction, Bayer demosaicing, edge detection) before passing frames to a host CPU. The 502 I/Os support multiple 32-bit Camera Link base-configuration channels, while the embedded ESB memory buffers line-scan data from high-speed line cameras. The industrial 0 °C to +85 °C temperature grade is essential for factory-floor deployment.
Recommended
Networking Switch / Router Line Card
The EP20K400BI652-2V is well-matched to Layer 2/3 switch line cards where 16,640 logic elements implement forwarding-table lookups, ACL matching, and QoS queuing, while 212,992 bits of ESB memory hold TCAM shadow tables and statistics counters. The 502 user I/Os accept multiple 10/100/1000 Ethernet MAC interfaces and bus connections to network processors. The 2.5 V core and LVDS/SSTL I/O standards interface cleanly with PHY and switch-fabric devices of the era.
Recommended
Embedded Computing Co-Processor Board
As a hardware co-processor on VME or CompactPCI boards, the EP20K400BI652-2V offloads compute-intensive DSP, encryption, or compression tasks from the host PowerPC/MIPS processor. Its 16,640 logic elements implement crypto engines (AES, DES, SHA) or Reed-Solomon codecs, while the high I/O count interfaces to the host bus (PCI 32/64-bit) and to dedicated memory buses. The 652-ball BGA integrates well with controlled-impedance backplane layouts, and the JTAG interface supports in-system bring-up and boundary-scan testing.
Recommended
Test & Measurement Instrumentation
The EP20K400BI652-2V is used in bench-top and ATE test equipment where it implements protocol-aware pattern generation, real-time protocol analysis, and high-speed stimulus/response sequencing. The 502 I/Os drive multi-channel logic-analyzer probe pods or ATE pin-electronics cards, while the 16,640 logic elements implement timing generators, format engines, and result comparators. The 200 MHz internal performance supports pattern rates up to 200 Mbps per pin in parallel, and ESB memory holds stimulus vectors for repetitive test loops.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400BI652-2V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400BI652-2 | EP20K400BC652-3V | EP20K400BC652-2V | EP20K400BC652-2XV |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-ball FineLine BGA (35×35 mm) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) | 652-ball FineLine BGA (same) |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| User I/Os | 502 | 502 | 502 | 502 | 502 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -2 (200 MHz) | -2 | -3 (faster) | -2 | -2 lead-free |
| Temperature Grade | Industrial (0 °C to +85 °C) | Industrial | Commercial (0 °C to +70 °C) | Commercial | Commercial, lead-free |
| Lifecycle Status | Obsolete (legacy) | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade (-2V) with same speed/pinout as the commercial -2V variant (vs EP20K400BC652-2V)
- Same 652-ball BGA footprint and pinout as all other EP20K400 652-BGA family members (vs EP20K400BC652-3V)
- Higher logic density than EP20K200 family with same toolchain (vs EP20K200 series)
Design Notes
Estimated: The 652-ball FineLine BGA uses a 1.27 mm ball pitch in a 35 × 35 mm body. PCB layout must use 0.6 mm via-pad diameters with either microvia (laser-drilled, 0.1 mm) or dog-bone fanout to break out the inner balls. Maintain a continuous ground plane beneath the device for thermal dissipation and signal return paths; the typical thermal resistance θJA is approximately 12 °C/W with adequate airflow, so for ~3 W dissipation the junction rises ~36 °C above ambient.
Power sequencing must follow Altera application note AN-117: bring VCCINT (2.5 V) up before or simultaneously with VCCIO, and discharge VCCINT before VCCIO during power-down. Hot-socket events can damage the I/O cells if sequencing is violated. Use a tracking LDO or power-good supervisory circuit to enforce sequencing. The core current can reach 1-2 A at full toggle activity across 16,640 logic elements - size the 2.5 V regulator for at least 3 A.
LVDS and SSTL I/O standards require external reference voltages (VREF) and matched 100 Ω differential termination at the receiver. LVDS outputs use a 2.5 V supply; ensure the receiver common-mode range is within 0.2-2.2 V. For multi-voltage I/O banks, group pins by voltage standard into contiguous I/O banks to minimize VREF pin count and simplify layout. SSTL-2 and GTL+ are common for DDR memory interfaces on this device.
Do not attempt to use the APEX 20K EP20K400 device with Quartus Prime versions newer than 13.0 - the family is no longer supported in modern Quartus. Use MAX+PLUS II 10.23 or Quartus II 9.1 for design compilation. Configuration via JTAG requires a ByteBlasterMV or USB-Blaster download cable; the newer USB-Blaster II is not backward-compatible with APEX 20K JTAG instructions. Confirm configuration mode (Passive Serial vs JTAG) matches your board's byte-wide or bit-wide PROM.
Compliance Information
RoHS/REACH/lead-free status not confirmed from verified web data; the EP20K400BC652-2XV variant exists with explicit 'X' (lead-free) marking, suggesting the standard EP20K400BI652-2V may be non-RoHS or have an unknown compliance status. AEC-Q100 not applicable to FPGAs in this class.
