EP20K400BI652-2 - 400K Gate APEX-20KC FPGA, 652-BGA | Intel
MPN: EP20K400BI652-2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $137.6 | $137.60 |
| 10 | $132 | $1,320.00 |
| 100 | $124.5 | $12,450.00 |
| 500 | $116.2 | $58,100.00 |
| 1,000 | $108.4 | $108,400.00 |
EP20K400BI652-2 Overview
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic circuits through configuration memory rather than fixed silicon. Within the broader semiconductor hierarchy, FPGAs sit above application-specific integrated circuits (ASICs) in flexibility but below them in per-unit cost and power efficiency. The APEX-20KC family pioneered system-on-a-programmable-chip (SOPC) integration by combining LUT logic, product-term logic, and embedded memory blocks on a single die, enabling designers to build complete digital systems including processors, peripherals, and glue logic on one chip.
Key differentiating features of the EP20K400BI652-2 include its 652-ball BGA package measuring 45 x 45 mm, support for LVDS I/O at data rates suitable for backplane and high-speed serial interfaces, and compatibility with the Quartus development toolchain. The device includes on-chip phase-locked loops (PLLs) for clock management, embedded memory blocks for FIFO and dual-port RAM applications, and dedicated multiplier circuitry for DSP functions.
Typical applications for the EP20K400BI652-2 include telecommunications infrastructure, industrial automation controllers, military and aerospace signal processing, and high-speed data acquisition systems. Its combination of high logic density, generous embedded memory, and LVDS support makes it well suited for designs that previously required multiple discrete FPGAs or a custom ASIC.
When designing with this device, engineers should plan for the 1.71 V to 1.89 V core supply rail using a low-noise LDO regulator, and observe BGA fanout and routing rules to maintain signal integrity on the 652-ball land pattern. The device is shipped in tray packaging suitable for prototype and low-volume production builds. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP20K400BI652-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400BI652-2 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400BC652-2V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$260 / Unit
View Datasheet →EP20K400BC652-2AA
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP20K400BC652-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$189 / Unit
View Datasheet →EP20K400BC652-3V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP20K400BC652-2XV
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EP20K400BI652-2 Maximum Ratings & Electrical Characteristics
| Series | APEX-20KC |
| Family | APEX 20K |
| Logic Elements / Cells | 16640 |
| System Gates | 400000 |
| Total RAM Bits | 212992 |
| Number of Logic Array Blocks (LABs) | 502 |
| User I/O Count | 502 (max per family) |
| Number of I/O Banks | 8 |
| Core Voltage | 1.71 V to 1.89 V |
| I/O Voltage Reference | 2.5 V (LVDS support) |
| Maximum Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Pin-to-Pin Delay (Tpd) | 3.1 ns |
| Package | 652-BGA (45 x 45 mm) |
| Mounting Type | Surface Mount |
EP20K400BI652-2 652-bga (45 x 45 mm) Pin Configuration Guide
Pin configuration for EP20K400BI652-2 (652-bga (45 x 45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400BI652-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400BI652-2 is suitable for 6 applications: Telecommunications Backplane Interface, Industrial Automation Controller, High-Speed Data Acquisition System, Military and Aerospace Signal Processing, DSP and Multiplier-Intensive Designs, Legacy System Sustainment and Long-Life Programs.
Telecommunications Backplane Interface
The EP20K400BI652-2 fits telecommunications backplane interface designs because its 502 user I/O pins and LVDS I/O support (via the 2.5V VREF) enable high-speed differential signaling across backplane connectors, while its 212,992 bits of embedded memory buffer packet data at line rate. Placed as a glue-logic and protocol-bridging device between line cards and a switch fabric ASIC, the 400K-gate density absorbs custom framing, error correction, and clock-domain crossing functions that would otherwise require a companion CPLD or ASIC. Engineers should feed the core from a 1.8V LDO with sub-50mV ripple and route LVDS pairs with 100-ohm differential impedance matching the datasheet guidelines.
Recommended
Industrial Automation Controller
The EP20K400BI652-2 is well-suited for industrial automation controllers because its 16,640 logic elements and 200 MHz MultiCore architecture can implement multiple soft-CPU state machines, PID loops, and fieldbus protocol engines (PROFIBUS, Modbus, EtherCAT) concurrently, while 502 user I/O pins absorb digital and analog sensor fan-in directly. The 0.22 µm CMOS process and -40C to +85C industrial temperature range allow deployment near motors and power electronics. Trade-off: APEX-20K is in last-time-buy, so industrial designers should plan a migration roadmap to Cyclone IV or Cyclone 10 LP for long-life-cycle products.
Recommended
High-Speed Data Acquisition System
For high-speed data acquisition systems, the EP20K400BI652-2's 212,992 bits of embedded memory and 200 MHz internal clock rate enable real-time buffering of ADC samples at rates up to 200 MSPS when paired with a compatible front-end converter, while its LVDS I/O can directly interface to high-speed serial ADCs. The 652-BGA package provides sufficient I/O for parallel LVDS data lanes and control signals without external multiplexing. Estimated: at 200 MHz operation with typical LVDS toggling, designers should budget 2 to 4W core power and use a 4-layer PCB with dedicated ground planes to maintain signal integrity.
Recommended
Military and Aerospace Signal Processing
The EP20K400BI652-2's combination of high logic density, embedded memory, and ruggedized industrial-grade variants (-2I) supports military and aerospace signal-processing applications including radar front-end pre-processing, electronic countermeasure (ECM) waveform generation, and avionics bus interfacing. The APEX-20KC architecture's product-term logic blocks are particularly efficient at implementing state machines and decoding logic common in MIL-STD-1553 and ARINC-429 interfaces. Note: aerospace designs typically require a MIL-PRF-38535-compliant variant; verify part grade before deployment.
Recommended
DSP and Multiplier-Intensive Designs
The EP20K400BI652-2's embedded MultiCore architecture integrates dedicated multiplier blocks that accelerate DSP operations such as FIR filtering, FFT butterflies, and digital down-conversion, making it a fit for software-defined radio (SDR) baseband and image-processing pipelines. With 212,992 bits of embedded memory, designers can implement dual-port RAM coefficient tables without external memory overhead. Performance trade-off: the APEX-20K family predates current Cyclone families' hardened DSP blocks; complex DSP may consume more logic and run at lower Fmax than on Cyclone IV/V.
Recommended
Legacy System Sustainment and Long-Life Programs
The EP20K400BI652-2 remains in demand for sustainment of legacy fielded systems such as medical imaging equipment, semiconductor test instrumentation, and military communication platforms where end-customer certifications forbid board-level redesign. Stocking distributors like Rochester Electronics maintain factory-traceable inventory for these long-life programs. Engineers sustaining such systems should leverage last-time-buy notices from Intel/Altera to secure multi-year inventory and develop migration plans to Cyclone IV/V/10 for next-generation derivatives.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400BI652-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400BC652-2V | EP20K400BC652-2AA | EP20K400BC652-3 | EP20K400BC652-3V | EP20K400BC652-2XV |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 652-BGA (45x45) | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same |
| Series | APEX-20KC | APEX-20K | APEX-20K | APEX-20K | APEX-20K | APEX-20K |
| Core Voltage | 1.71 V to 1.89 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -3 (faster) | -2 |
| Logic Elements | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| Total RAM Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| LVDS I/O Support | Yes (2.5V VREF) | No (2.5V I/O only) | No | No | No | No |
Key Differentiators
- Lower core voltage (1.8 V) enables reduced power consumption vs APEX-20K family (vs EP20K400BC652-3)
- Native LVDS I/O support for high-speed differential signaling (vs EP20K400BC652-2V)
- Industrial temperature range (-40C to +85C) standard on -2I variant (vs EP20K400BC652-2AA)
Design Notes
The EP20K400BI652-2 requires a tightly regulated 1.71 V to 1.89 V core supply capable of delivering up to 1.5 A peak current during configuration and high-utilization operation. Recommended: use a low-dropout regulator with sub-50 mV ripple and place bulk decoupling (100 µF tantalum) plus 0.1 µF and 0.01 µF ceramic capacitors within 5 mm of each VCCINT ball cluster. A separate 2.5 V rail is required for VREF when using LVDS I/O standards.
The 652-BGA package uses a 45 x 45 mm substrate with 1.27 mm ball pitch; PCB layout requires microvia technology or staggered via-in-pad construction for reliable fanout. Use a 4-layer minimum stack-up with continuous ground plane beneath the BGA. Escape routing should target 4 mil (0.1 mm) traces between balls, and matched-length routing (within 50 mil) is mandatory for LVDS pairs. Estimated: at full I/O utilization, route congestion may force adoption of a 6-layer or 8-layer stack-up.
Do not confuse the APEX-20KC family (1.8 V core, LVDS-capable, suffix 'I' or 'BI' in part number) with the APEX-20K family (2.5 V core, no LVDS, suffix 'B' or 'BC'). Substituting across families without adjusting the core supply will destroy the device. Also, configuration files generated for the EP20K400BI652-2 are not bit-stream compatible with EP20K400BC652-x devices because of the architectural differences in I/O structure.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified web data; please consult Intel/Altera product compliance documentation or the manufacturer PCN before procurement for environmentally regulated applications.
