EP20K400CB652I9 - APEX 20KC 400K Gates FPGA | Intel / Altera
MPN: EP20K400CB652I9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 250 | $108 | $27,000.00 |
| 500 | $99.5 | $49,750.00 |
EP20K400CB652I9 Overview
Background Knowledge: An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows hardware designers to implement custom digital circuits after manufacturing. FPGAs belong to the broader category of programmable logic devices, which sit hierarchically under integrated circuits and semiconductors. The APEX 20KC family is a second-generation APEX architecture from Altera that combines logic elements, embedded system blocks (ESBs) for memory and dual-port RAM, and high-speed I/O elements on a single die. The 'K' suffix denotes enhanced multi-core interconnect and on-chip memory resources compared with the original APEX 20K family.
Key features include 16,640 logic elements, 212,992 bits of embedded memory distributed across embedded system blocks, and support for LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards. The 652-ball LBGA package has a seated height of 1.63 mm and supports high-density board layouts with controlled-impedance signal routing. The 'I9' speed grade provides a balance between cost and performance for industrial-grade designs, with -1 being the fastest and -3 the slowest within the same speed-grade family.
Technical depth: the APEX 20KC architecture combines four-input look-up tables (LUTs) with embedded system blocks that can be configured as dual-port RAM, single-port RAM, ROM, or content-addressable memory. The MultiCore interconnect uses a hierarchical row/column structure that delivers predictable timing closure for high-utilization designs. The 1.8 V core reduces dynamic power versus 2.5 V predecessors, while I/O banks operate independently from 1.5 V to 3.3 V for mixed-voltage system integration.
Typical applications include digital signal processing front-ends, telecommunications channel cards, video broadcast equipment, and embedded processor peripherals. The 488 I/O count makes the part particularly attractive for parallel bus architectures and high-throughput memory interfaces.
Design consideration: when laying out the LBGA-652 footprint, designers should allocate a minimum of six PCB layers with dedicated power and ground planes to suppress simultaneous-switching noise on the 488 I/O banks. Decoupling must include both bulk and high-frequency capacitors placed within 5 mm of each power-ball cluster.
This page synthesizes distributor availability, drop-in same-package alternatives from the same Altera/Intel APEX 20K family, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for EP20K400CB652I9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CB652I9 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Maximum Operating Frequency, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CB652C9
✅ Drop-In✓ In Stock
$89.2 / Unit
View Datasheet →EP20K400CB652C9N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400CB652C9ES
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400CB652C8N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP20K400CB652C7N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP20K400CB652I8N
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K400CB652I8ES
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K400CB652I7
✅ Drop-In✓ In Stock
$149.5 / Unit
View Datasheet →EP20K400CB652I9 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements | 16,640 cells |
| System Gates | 400,000 |
| Maximum User I/O | 488 |
| Embedded Memory Bits | 212,992 bits |
| Embedded System Blocks (ESBs) | 104 |
| Process Technology | 0.15 um CMOS |
| Core Voltage | 1.8 V |
| Maximum Frequency | 250 MHz |
| Package | 652-pin LBGA (CB) |
| Maximum Seated Height | 1.63 mm |
| Operating Temperature | -40C to +85C (industrial, 'I' grade) |
| Speed Grade | -9 |
| Total Terminals | 652 |
EP20K400CB652I9 652-pin lbga (cb) Pin Configuration Guide
Pin configuration for EP20K400CB652I9 (652-pin lbga (cb) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CB652I9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CB652I9 is suitable for 6 applications: Telecommunications Channel Card, Digital Video Broadcast Equipment, Industrial Motion Control, Embedded Processor Peripheral Hub, Military / Aerospace Avionics (legacy), Test and Measurement Instrumentation.
Telecommunications Channel Card
The EP20K400CB652I9 fits telecommunications channel-card designs where 400K system gates, 488 user I/O pins, and 104 embedded system blocks enable parallel processing of multiple E1/T1 or STM-1 framers on a single die. The 1.8 V core and LVDS-capable I/O banks support 155 Mbps serializer/deserializer interfaces, while the embedded dual-port RAM blocks implement elastic stores and jitter-attenuation FIFOs without external SRAM. Compared to an ASIC approach, the APEX 20KC cuts NRE cost and lets carriers revise protocols via in-system JTAG reprogramming for evolving standards.
Recommended
Digital Video Broadcast Equipment
Broadcast video routers and format converters benefit from the EP20K400CB652I9's 488 I/O pins, which accommodate parallel ITU-R BT.656 / SMPTE 259M / SMPTE 292M digital video buses plus ancillary data and GPIO. The 16,640 logic elements and 212,992 bits of embedded memory implement cross-point switches, chroma resamplers, and de-interlacers without external SDRAM. The -9 industrial speed grade delivers sufficient bandwidth for SD-SDI and HD-SDI processing at 270 Mbps and 1.485 Gbps respectively when paired with an external serializer.
Recommended
Industrial Motion Control
Servo drives and CNC controllers use the EP20K400CB652I9 for multi-axis trajectory generation, encoder quadrature decoding, and PWM generation. The 488 I/O pins handle up to 16 encoder channels, 32 PWM outputs, and EtherCAT / Profibus / CANopen industrial bus interfaces through companion transceivers. The industrial temperature range (-40C to +85C) supports factory-floor enclosures, and the embedded system blocks implement PID loop tables and look-up tables for non-linear motion profiles. The legacy APEX 20K architecture remains a stable, long-life platform for industrial OEMs with multi-decade product cycles.
Recommended
Embedded Processor Peripheral Hub
The EP20K400CB652I9 acts as a programmable companion to PowerPC, MIPS, or ARM host processors, providing custom peripheral logic, high-speed DMA engines, and protocol bridges such as PCI-to-ISA or Local Bus to I2C/SPI/UART expansion. The MultiCore interconnect and 488 I/O pins let designers implement a 32-bit/33 MHz PCI bus plus 16 UARTs, 8 SPIs, and 4 I2C controllers on one device. The 1.8 V core is pin-compatible with the surrounding low-voltage host CPU, simplifying board layout in telecom blades and industrial SBCs.
Recommended
Military / Aerospace Avionics (legacy)
Legacy avionics LRUs use the EP20K400CB652I9 industrial grade for flight-control interfaces, redundant MIL-STD-1553B bridges, and discrete I/O aggregation. Although newer defense designs use radiation-hardened FPGAs, the -40C to +85C industrial temperature and Altera's proven 0.15 um CMOS process deliver the long-term reliability required for 20-30 year service-life programs. Designers use the 488 I/O to interface to ARINC 429 transceivers, synchro/resolver converters, and 28 V avionics power buses through optocouplers.
Recommended
Test and Measurement Instrumentation
ATE pin-electronics and protocol-analyzer platforms leverage the EP20K400CB652I9's 488 I/O and high-speed LVTTL/LVCMOS capability to implement pattern generation, comparator logic, and timing-and-control sequencing. Each I/O bank can be set to a different voltage (1.5 V / 1.8 V / 2.5 V / 3.3 V), eliminating external level shifters when probing DUTs of mixed voltage families. Embedded system blocks implement deep capture buffers and timing-edge FIFOs, while the legacy Altera architecture enables long-term ATE platform support where re-validation cost dominates redesign cost.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CB652I9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CB652C9 | EP20K400CB652C9N | EP20K400CB652C9ES | EP20K400CB652C8N | EP20K400CB652I8N |
|---|---|---|---|---|---|---|
| Package | 652-pin LBGA (CB) | 652-pin LBGA (CB) - same | 652-pin LBGA (CB) - same | 652-pin LBGA (CB) - same | 652-pin LBGA (CB) - same | 652-pin LBGA (CB) - same |
| Brand | Altera / Intel | Altera / Intel - same | Altera / Intel - same | Altera / Intel - same | Altera / Intel - same | Altera / Intel - same |
| Speed Grade | -9 | -9 (same) | -9 (same) | -9 (same) | -8 (slower) | -8 (slower) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) |
| Logic Elements | 16,640 cells | 16,640 cells | 16,640 cells | 16,640 cells | 16,640 cells | 16,640 cells |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- Highest speed grade in the industrial-temperature family (vs EP20K400CB652I8N)
- Industrial temperature range for harsh-environment deployment (vs EP20K400CB652C9)
- Full 488 I/O count of the APEX 20KC flagship (vs EP20K200CF484I9)
Design Notes
The 652-ball LBGA package has a seated height of 1.63 mm and requires a minimum of six PCB layers with dedicated VCCINT, VCCIO, and GND planes. Designers should route signals on the top and bottom layers with buried power/ground planes for return-path integrity, and use 50 ohm controlled-impedance traces for clock and global signal routing. Ball-to-pad via-in-pad construction is recommended to minimize stub length on high-speed I/O banks.
Decoupling must include both bulk and high-frequency capacitors within 5 mm of every power-ball cluster: 10 uF X5R ceramic for low-frequency noise plus 0.1 uF and 0.01 uF X7R ceramics for high-frequency transients. The 1.8 V VCCINT rail should be sourced from a low-noise LDO regulator such as the TPS7A4515 with at least 20% headroom over peak current. VCCIO banks must be sequenced after VCCINT to avoid powering I/O before the core - see the APEX 20K handbook for recommended power-up sequencing.
The EP20K400CB652I9 is obsolete - new designs should target Cyclone IV/V or MAX 10 instead. For legacy hardware maintenance, verify that obsolete-market suppliers provide a Certificate of Conformance (C-of-C) and date code traceability; counterfeit APEX 20K parts have been observed on the secondary market. Re-programming via JTAG requires the legacy ByteBlasterMV or USB-Blaster cable and Quartus II software version 13.0 or earlier.
The 652-ball LBGA package relies on thermal balls and vias to dissipate heat. Designers should array at least 16 thermal vias (0.3 mm drill, 0.5 mm pad) under the center thermal-ball cluster and tie them to internal GND planes for a 30-40% reduction in theta-JA. Industrial (-40C to +85C) operation in enclosed enclosures requires derating the maximum junction temperature to 100C, with continuous monitoring via the on-chip die-temperature diode.
Compliance Information
EP20K400CB652I9 is an obsolete Altera/Intel APEX 20KC FPGA. RoHS, REACH, and lead-free status were not present in the verified web data and are marked unknown. Not subject to AEC-Q100 (not an automotive-grade part designation). Designers should request C-of-C documentation from obsolete-market distributors to verify original component compliance.
