EP20K400BC652-1 - 400K Gates APEX-20K FPGA, 502 I/O, BGA-652
MPN: EP20K400BC652-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 50 | $122 | $6,100.00 |
| 100 | $115 | $11,500.00 |
| 250 | $108 | $27,000.00 |
EP20K400BC652-1 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic resources, routing, and I/O can be configured by the end user after manufacture. The APEX-20K family is a high-density PLD family incorporating MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks on a single die. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> field programmable gate array (FPGA) -> SRAM-based high-density FPGA -> SOPC-class integrated FPGA. They are typically used for glue logic, custom datapaths, bus interfaces, DSP, and prototype ASIC development.
Key features of the EP20K400BC652-1 include 1664 macrocells of logic, a maximum of approximately 212,992 bits of embedded RAM, a propagation delay of 2.5 ns, and a supply voltage of 1.71 V to 1.89 V (2.5 V core supply standard). The device operates across the commercial temperature range of 0 °C to 85 °C and is delivered in a thermally enhanced 45 x 45 mm 652-BGA package suitable for high-density board designs.
The APEX-20K architecture combines a fine-grained LUT fabric with embedded array blocks (EABs) that act as dual-port RAM, ROM, or FIFO memory. This MultiCore integration allows the EP20K400 to be partitioned between register-intensive datapath logic and block-memory functions in the same device, eliminating the need for an external memory companion in many designs.
Typical applications include high-speed telecommunications interface cards, custom bus bridges, DSP pre/post-processing, and prototype ASIC emulation. The 502 user I/O count supports wide parallel buses and multiple serial interfaces in a single device.
When designing with this part, pay attention to the 1.8 V core supply and the thermally enhanced BGA-652 footprint, which mandates reflow-compatible PCB stack-ups and a sufficient copper area for heat dissipation. Quartus II or MAX+PLUS II software is required for design entry.
This page synthesizes distributor pricing, drop-in variants from the same APEX-20K family, and design considerations not found in the manufacturer datasheet alone.
Drop-in alternatives for EP20K400BC652-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400BC652-1 (same form factor and footprint) — differing in Operating Temperature, Package, Series, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400BC652-1V
✅ Drop-In✓ In Stock
$47.95 / Unit
View Datasheet →EP20K400BC652-1X
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP20K400BC652-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400BC652-2V
✅ Drop-In✓ In Stock
$260 / Unit
View Datasheet →EP20K400BC652-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K300EBC652-1
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K200EBC652-1X
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP20K400BC652-1 Maximum Ratings & Electrical Characteristics
| Series | APEX-20K |
| Family | APEX 20KE (1.8 V, LVDS) |
| Logic Macrocells | 1664 |
| Total Gates | 400,000 |
| User I/O | 502 |
| Package | 652-BGA (45x45 mm, thermally enhanced) |
| Supplier Device Package | 652-BGA |
| Total RAM Bits | 212,992 |
| Propagation Delay | 2.5 ns |
| Supply Voltage - Core | 1.71 V to 1.89 V (2.5 V standard) |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
EP20K400BC652-1 652-bga Pin Configuration Guide
Pin configuration for EP20K400BC652-1 (652-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400BC652-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400BC652-1 is suitable for 6 applications: Telecommunications Interface Cards, Custom Bus Bridges and Protocol Converters, DSP Pre/Post-Processing Pipelines, Prototype ASIC Emulation, Industrial Control and Motion Control, High-Speed Image Processing Front-End.
Telecommunications Interface Cards
The EP20K400BC652-1 fits telecommunications line-card and switch-fabric designs because its 400K gates and 502 user I/O support wide parallel bus widths alongside on-chip EAB memory for packet buffering. The 2.5 ns propagation delay supports 200+ MHz datapaths typical of TDM and POS-PHY interfaces, while the 212,992 bits of embedded RAM enable small FIFO structures without external SRAM. Designers place the device between a network processor and PHY transceivers, using LUT fabric for protocol state machines and EABs for elastic buffers. Unlike a discrete ASIC, the EP20K400 allows late-stage protocol changes via JTAG reconfiguration. Trade-off: at 1.8 V core with 502 switching I/O, decoupling must be aggressive to meet telecom EMI masks.
Recommended
Custom Bus Bridges and Protocol Converters
The EP20K400BC652-1 is well-suited to bridge legacy parallel buses (PCI, VME, Multibus) to modern serial protocols because its 502 user I/O pins can absorb wide legacy datastreams while the LUT fabric implements serializer logic. The 1664 macrocells are sufficient for typical bus-bridge state machines, and the EABs can emulate small dual-port RAMs for transaction buffering. Place the EP20K400 between a host CPU and a downstream ASIC, using the JTAG port for in-system reconfiguration during bridge bring-up. Compared to a discrete CPLD bank, the EPEX-20K reduces board area by consolidating multiple bridging functions on one die.
Recommended
DSP Pre/Post-Processing Pipelines
The EP20K400BC652-1 serves as a DSP pre/post-processor where moderate logic density (400K gates) is required alongside embedded memory for coefficient storage. The 212,992 bits of EAB RAM are ideal for storing FIR coefficients or small lookup tables, while the LUT fabric implements arithmetic pipelines at the 2.5 ns propagation delay. Place the EP20K400 between an analog front-end ADC/DAC and a host DSP, performing decimation, interpolation, or modulation. Compared to a dedicated DSP chip, the EPEX-20K offers flexibility to change algorithms via reconfiguration, at the cost of higher power per MMAC.
Recommended
Prototype ASIC Emulation
The EP20K400BC652-1 is widely used to prototype ASIC designs before mask commitment because the 400K-gate density and MultiCore architecture allow mapping of substantial blocks of an ASIC RTL. Quartus II supports industry-standard VHDL/Verilog entry and synthesis targeting the EPEX-20K, with bitstream generation in seconds versus ASIC mask weeks. Designers load the design via JTAG, exercise it at 200 MHz in-system, then iterate on RTL without NRE cost. Trade-off: I/O voltage is fixed at 2.5 V/3.3 V tolerant, which can complicate emulation of 1.2 V ASIC I/O.
Recommended
Industrial Control and Motion Control
The EP20K400BC652-1 fits industrial motion controllers and PLC platforms because its 502 I/O can absorb multi-axis encoder inputs, PWM outputs, and EtherCAT or Profibus glue logic on a single device. The 0 °C to 85 °C commercial temperature range covers most factory-floor enclosures, and the EAB memory buffers control-loop setpoints. Place the EP20K400 between servo amplifiers and a host CPU, running custom commutation algorithms at the 2.5 ns propagation delay. Compared to a microcontroller, the EPEX-20K allows parallel execution of multiple axes with deterministic latency.
Recommended
High-Speed Image Processing Front-End
The EP20K400BC652-1 supports front-end image processing such as Bayer demosaicing, white-balance, and histogram accumulation because its 400K gates accommodate pixel pipelines at 100+ MHz while EAB memory holds line buffers. The 502 I/O can interface directly to Camera Link or LVDS image sensors, reducing the need for a companion frame grabber ASIC. Place the EP20K400 between the sensor and a host CPU/ASIC, performing real-time preprocessing before DMA transfer. Compared to a discrete ASSP, the EPEX-20K offers reconfigurability for multiple sensor formats via JTAG bitstream updates.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400BC652-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400BC652-1V | EP20K400BC652-1X | EP20K400BC652-1N | EP20K400BC652-2V | EP20K400BC652-2X | EP20K300EBC652-1 | EP20K200EBC652-1 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| Total Gates | 400K | 400K | 400K | 400K | 400K | 400K | 300K (-25%) | 200K (-50%) |
| Core Supply Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
Key Differentiators
- Highest density APEX-20K family member in the 652-BGA footprint (vs EP20K300EBC652-1)
- Fastest speed grade available in the 652-BGA package (vs EP20K400BC652-2V)
- Industry-leading 502 user I/O count for legacy parallel buses (vs EP20K200EBC652-1)
Design Notes
The 652-BGA package on a 45x45 mm footprint requires a high-density PCB stack-up with microvia or via-in-pad construction. Standard 0.1 inch-pitch via fanouts do not fit the 1.27 mm BGA pitch. Use a 4-6 layer PCB with dedicated power and ground planes immediately below the device. Decoupling must place 0.1 uF and 10 uF capacitors on every VCCIO and VCCINT ball, with via stubs kept under 0.5 mm to maintain signal integrity at 100+ MHz I/O.
Estimated: at a typical 1.8 V VCCINT, 502 I/O toggling at 50 MHz with 20 pF loading, the EP20K400BC652-1 dissipates approximately 1.5 to 2.5 W. The thermally enhanced BGA package improves theta_JA but still requires a minimum 4 square inches of unbroken inner ground plane copper and adequate airflow to stay within the 85 °C commercial limit. Add a copper heatsink pad or thermal interface material if the design is sealed.
JTAG pins (TCK, TMS, TDI, TDO, TRST) must be brought out to a header or test pad for in-system reconfiguration. The nCONFIG, nSTATUS, and CONF_DONE pins should be pulled up correctly per the APEX-20K datasheet to prevent unintended configuration lockup. Leave at least 4 GND balls between any high-speed LVDS pair and any noisy supply rail to minimize crosstalk.
Do not assume the EP20K400BC652-1 and Cyclone/Stratix devices share the same Quartus II pin assignments - APEX-20K uses legacy pin naming and requires an explicit migration step in Quartus II before recompiling. Also note that the V, X, N suffixes indicate specific sub-grade qualifications (material set, temperature, lead finish) - verify with the manufacturer datasheet that the chosen sub-grade meets your reliability target before substituting in aerospace or medical applications.
Compliance Information
Compliance information not provided in verified web data. EP20K400 family predates widespread RoHS documentation in many datasheets. Consult manufacturer for specific sub-grade compliance.
