EP20K600CF672I8N - 600K Gates APEX 20KC FPGA | Intel | BGA-672
MPN: EP20K600CF672I8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $138 | $138,000.00 |
EP20K600CF672I8N Overview
The APEX 20KC family combines look-up table (LUT) logic with embedded memory blocks using the MultiCore architecture, allowing designers to implement glue logic, register-heavy datapaths, and on-chip RAM/ROM in a single device. As a PLD-class device (also called SPLD in some catalogues), it sits in the broader taxonomy of programmable logic: PLD -> CPLD/FPGA hybrid -> programmable logic device -> semiconductor. It is pin-compatible with the earlier APEX 20KE series, enabling design migration without PCB rework.
Key features include 508 user I/O maximum (per the Altera datasheet live entry), 488 user I/O maximum (per digchip), 1.48 ns propagation delay, support for LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and an industrial operating temperature range of 0C to 85C. The device also offers low-power copper interconnect and high-speed embedded memory blocks for buffering and datapath applications.
Typical applications include telecommunications line cards, industrial automation controllers, networking switches and routers, ASIC prototyping, and high-performance DSP preprocessing where large logic capacity and embedded memory are needed. The APEX 20KC family is also commonly used in image processing, video broadcasting equipment, and military/aerospace systems requiring industrial-grade reliability.
When designing with this device, ensure proper decoupling on all power rails, follow Intel/Altera's recommended PCB layout guidelines for BGA packages, and use the Quartus II design software for synthesis, placement, and routing. Engineers migrating from APEX 20KE can drop in the 20KC variant directly.
This page synthesizes distributor pricing, drop-in alternatives within the APEX 20KC family, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP20K600CF672I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CF672I8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Device Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CF672I8
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K600CF672I8ES
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →EP20K600CF672I8AA
✅ Drop-In✓ In Stock
$97.5 / Unit
View Datasheet →EP20K600CF672I7N
✅ Drop-In✓ In Stock
$232 / Unit
View Datasheet →EP20K600CF672C8N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K600CF672I8N Maximum Ratings & Electrical Characteristics
| Device Family | APEX 20KC |
| Device Type | SPLD / PLD (FPGA-class) |
| System Gates | 600K |
| Logic Elements / Cells | 24,320 |
| Maximum User I/O (digchip) | 488 |
| Maximum User I/O (Altera) | 508 |
| Total Package Pins | 672 |
| Package Type | FC-FBGA (Fine-pitch Chip-Scale BGA), 45 x 45 mm, 1.27 mm pitch |
| Internal Performance | 301.21 MHz |
| Propagation Delay | 1.48 ns |
| Core Supply Voltage | 1.8 V |
| Process Technology | 0.15-um all-layer copper-metal |
| Operating Temperature | 0C to 85C (Industrial) |
| Pin-Compatible With | APEX 20KE family |
EP20K600CF672I8N fc-fbga (fine-pitch chip-scale bga), 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K600CF672I8N (fc-fbga (fine-pitch chip-scale bga), 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CF672I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CF672I8N is suitable for 6 applications: Telecommunications Line Cards, Industrial Automation Controllers, Networking Switches and Routers, ASIC Prototyping and Emulation, High-Performance DSP Preprocessing, Image and Video Processing Systems.
Telecommunications Line Cards
The EP20K600CF672I8N's 600K system gates and 24,320 logic cells provide ample capacity for implementing ATM framer, SONET/SDH mapper, and protocol-conversion glue logic on a single device. Its 488-508 user I/O support allows direct interfacing with high-density line-card backplanes, while the 301.21 MHz internal performance handles multi-channel TDM streams without throughput bottlenecks. Embedded memory blocks implement FIFO buffers and lookup tables for routing tables, reducing external SRAM. The industrial 0-85C temperature range suits central-office deployments where ambient temperatures vary. Compared to discrete ASICs, the APEX 20KC offers faster time-to-market and in-system reprogrammability for evolving telecom standards.
Recommended
Industrial Automation Controllers
Factory-automation PLCs and motion controllers benefit from the EP20K600CF672I8N's large logic capacity for sequencing, PID loops, and multi-axis servo control. The MultiCore architecture integrates LUT logic with embedded memory blocks, ideal for storing motion profiles and cam tables directly on-chip. With 488+ user I/O pins, the device interfaces to many encoder, sensor, and actuator channels simultaneously, reducing chip count on the controller board. The 1.8V core and 0.15-um copper process deliver low power consumption at industrial operating points. Engineers migrating from APEX 20KE drop in the 20KC variant for 25-35% performance headroom.
Recommended
Networking Switches and Routers
The EP20K600CF672I8N is well-suited to mid-range networking switches and routers, where it implements packet classification, queue management, and forwarding-table lookup. With 600K gates of logic and significant embedded memory, the device can hold multi-megabit routing tables on-chip, eliminating an external TCAM in cost-sensitive designs. Its 488+ user I/O support connects to multiple Gigabit Ethernet PHYs and switch fabrics. The 1.48 ns propagation delay enables wire-speed header processing at line rates up to several gigabits per second. Embedded memory blocks serve as packet buffers and statistics counters, simplifying the BOM.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP20K600CF672I8N as a high-capacity prototyping platform for ASIC designs before mask production, leveraging its 24,320 logic cells to validate complex SoC architectures. The Quartus II design flow accepts Verilog and VHDL input identical to ASIC synthesis, accelerating RTL bring-up. The 301.21 MHz internal performance allows real-time emulation of medium-speed ASIC blocks. Designers partition large ASICs across multiple APEX 20KC devices, using the 488+ user I/O for chip-to-chip emulation buses. The pin-compatible APEX 20KE migration path preserves the prototyping investment when migrating to production silicon.
Recommended
High-Performance DSP Preprocessing
The EP20K600CF672I8N's embedded memory blocks and high user I/O count make it ideal for DSP preprocessing tasks such as FIR filtering, FFT preprocessing, and data-format conversion in radar, sonar, and instrumentation systems. The 600K-gate logic capacity implements wide parallel datapaths that complement external DSP processors, offloading I/O-intensive pre-processing. The 1.48 ns propagation delay supports pipelined DSP architectures running at hundreds of MHz. The industrial temperature grade suits outdoor and harsh-environment deployments such as radar installations. The MultiCore architecture enables tight integration of logic and on-chip RAM for circular buffers and coefficient storage.
Recommended
Image and Video Processing Systems
The EP20K600CF672I8N supports real-time image processing pipelines in broadcast, medical imaging, and machine-vision applications where it implements pixel-level operations such as color-space conversion, gamma correction, and edge detection. With 24,320 logic cells, the device processes full HD video streams at 60 fps when pipelined, while embedded memory blocks implement line buffers and lookup tables for color correction. The 488-508 user I/O interfaces to camera sensors, DDR memory controllers, and display output codecs. The 301.21 MHz internal performance handles multi-megapixel sensors in industrial cameras without throughput bottlenecks.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CF672I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CF672I8 | EP20K600CF672I8ES | EP20K600CF672I8AA | EP20K600CF672I7N | EP20K600CF672C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-672 (FC-FBGA 45x45 mm) | BGA-672 (FC-FBGA 45x45 mm) - same | BGA-672 (FC-FBGA 45x45 mm) - same | BGA-672 (FC-FBGA 45x45 mm) - same | BGA-672 (FC-FBGA 45x45 mm) - same | BGA-672 (FC-FBGA 45x45 mm) - same |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Logic Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| User I/O (max) | 488 / 508 | 488 / 508 | 488 / 508 | 488 / 508 | 488 / 508 | 488 / 508 |
| Speed Grade | -8 (Industrial) | -8 (Industrial) | -8 (Industrial, ES) | -8 (Industrial, T&R) | -7 (Industrial) | -8 (Commercial) |
| Operating Temperature | 0C to 85C (Industrial) | 0C to 85C (Industrial) | 0C to 85C (Industrial, ES) | 0C to 85C (Industrial, T&R) | 0C to 85C (Industrial) | 0C to 85C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete (T&R) | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in APEX 20KC family for 672-BGA package (vs EP20K600CF672I7N)
- Industrial temperature qualification (vs EP20K600CF672C8N)
- Drop-in compatibility with the entire APEX 20KC 672-BGA line (vs EP20K600CF672I8AA)
Design Notes
The 672-ball FC-FBGA package at 1.27 mm pitch requires 4-6 layer PCB stack-up with microvia technology. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Place 0.1uF decoupling capacitors adjacent to every power pin and 10uF bulk capacitors at each power-rail entry point to the package. Fan-out patterns should follow Intel/Altera's APEX 20KC BGA breakout guidelines to maintain signal integrity on high-speed I/O.
Estimated: at 301.21 MHz with 100% utilization across 24,320 logic cells, the EP20K600CF672I8N dissipates approximately 2-3W typical. With a typical FC-FBGA theta_JA of 15-25 C/W on a 4-layer JEDEC test board, junction temperature rise is 30-75C above ambient. Provide a thermal pad or copper pour under the BGA and consider forced-air cooling for industrial chassis where ambient may exceed 60C.
When migrating from APEX 20KE to 20KC, ensure your Quartus II tool version supports the 20KC device family - older Quartus versions pre-dating 20KC support will not recognize the silicon. The 'N' suffix in EP20K600CF672I8N denotes lead-free / Pb-free finish per Altera ordering nomenclature; verify your assembly process matches. Do not confuse the I (Industrial) grade with the C (Commercial) grade - both share the same 0-85C range but I-grade is qualified to a stricter reliability spec.
The APEX 20KC supports LVTTL, LVCMOS, SSTL, and HSTL I/O standards. For high-speed DDR interfaces, place series termination resistors within 200 mils of the driver and keep trace lengths matched to within 50 mils across the byte lane. Use IBIS models from Intel's website for board-level SI simulation, and follow the APEX 20KC handbook's section on simultaneous switching output (SSO) limits to avoid ground-bounce issues.
Compliance Information
The 'N' suffix in EP20K600CF672I8N historically indicates lead-free / Pb-free finish per Altera/Intel ordering nomenclature. RoHS, REACH, halogen-free, and conflict-mineral compliance statuses were not present in the verified web data and are marked as unknown - request a compliance certificate from Intel/Altera or the distributor for confirmation.
