EP20K600CF672I8 - APEX 20KC FPGA 24K LE 508 I/O BGA-672 | Altera
MPN: EP20K600CF672I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $275 | $2,750.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP20K600CF672I8 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically re-configured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy: SPLD -> CPLD -> FPGA, and the APEX 20KC architecture extends traditional gate-array concepts by embedding memory, multipliers and high-speed interconnect on-chip. This positions the EP20K600CF672I8 at the high-density end of the 1.8 V APEX 20K lineup.
Key specifications include 600,000 typical gates, 311,296 bits of embedded RAM, 2432 macrocells (logic cells), a 1.48 ns propagation delay through the LUT path, and an industrial operating temperature range of 0 °C to +85 °C. The device operates from a 1.8 V core supply with the I/O banks separately powered to support multiple interface standards. The 672-ball BGA package measures 45 mm x 45 mm with a 1.27 mm pitch.
The APEX 20KC architecture combines four MegaLAB structures connected by a MultiCore interconnect, each MegaLAB containing 16 Logic Array Blocks (LABs), one ESB, and a MegaLAB interconnect. Designers use Altera Quartus II (or legacy MAX+PLUS II) to capture HDL, place-and-route, and bitstream-program the configuration through JTAG or passive serial.
Typical applications include high-speed digital signal processing, telecommunications line cards, ASIC prototyping, and industrial automation controllers that require hundreds of user I/O with significant on-chip memory for buffering. The 488/508 user I/O count enables glueless connection to multiple external buses.
Designers should ensure all 1.8 V core and I/O supply rails are decoupled within 2 cm of each ball, maintain the JTAG chain integrity for in-system programming, and validate signal integrity for high-speed LVDS or SSTL interfaces against the BGA escape pattern.
This page synthesizes authorized distributor pricing, drop-in same-package alternatives from the APEX 20K family, and practical design notes not consolidated on the manufacturer datasheet.
Drop-in alternatives for EP20K600CF672I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CF672I8 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CF672I7N
✅ Drop-In✓ In Stock
$232 / Unit
View Datasheet →EP20K600CF672C8N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K600CF672C7N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K600CF672I-8ES
✅ Drop-In✓ In Stock
$119 / Unit
View Datasheet →EP20K600CF672C9N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K600CF672I8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Type | SPLD / FPGA |
| Logic Elements / Cells | 24,320 |
| Macros (Logic Cells) | 2432 |
| Typical Gate Count | 600,000 gates |
| Embedded Memory | 311,296 bits |
| User I/Os | 488 to 508 |
| Number of Pins | 652 (functional) / 672 (BGA balls) |
| Propagation Delay (typical) | 1.48 ns |
| Core Supply Voltage | 1.8 V |
| Process Technology | 0.15 µm all-layer copper |
| Operating Temperature | 0 °C to +85 °C (Industrial) |
| Package Type | 672-ball BGA, 45 x 45 mm, 1.27 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant per legacy product records |
| Configuration Interface | JTAG / Passive Serial |
| Design Tool | Quartus II (legacy MAX+PLUS II) |
EP20K600CF672I8 672-ball bga, 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K600CF672I8 (672-ball bga, 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CF672I8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CF672I8 is suitable for 6 applications: Telecommunications Line-Card Processing, Industrial Automation Controllers, ASIC Prototyping and Emulation, Military and Aerospace Avionics Buses, High-Performance Image Processing, Medical Imaging Equipment Controllers.
Telecommunications Line-Card Processing
The EP20K600CF672I8 fits telecom line-card DSP because its 24,320 logic elements and 311,296 bits of embedded memory let designers implement channel aggregation, framing, and protocol conversion in a single device. Its 488 to 508 user I/O enable glueless connection to TDM buses, UTOPIA / POS-PHY interfaces, and external PHY devices. The 1.8 V core and selectable I/O standards (LVTTL, LVCMOS, SSTL, LVDS) simplify interface to multi-rate SERDES. The APEX 20KC MultiCore interconnect provides deterministic routing for critical paths, which is essential for synchronous fabric switching. Versus an ASIC, the FPGA cuts NRE cost and supports late-stage protocol updates.
Recommended
Industrial Automation Controllers
The EP20K600CF672I8 suits industrial PLC and motion-control applications because of its 0 to 85 °C industrial temperature range and 508 user I/O, enough to drive dozens of opto-isolated digital channels and incremental encoder inputs concurrently. The embedded dual-port RAM blocks (311,296 bits total) hold real-time position and status tables without external SRAM. Designers typically use Quartus II to capture state machines and PID loops in VHDL. Compared with microcontroller-based PLCs, the FPGA delivers deterministic latency for multi-axis servo loops and parallel I/O scan. JTAG-based in-system programming allows firmware updates in the field via the customer's service tool.
Recommended
ASIC Prototyping and Emulation
The EP20K600CF672I8 is widely used as an ASIC prototype platform because its 600,000-gate capacity, MultiCore interconnect, and embedded memory match the requirements of pre-silicon validation for mid-complexity ASICs. Logic designers partition their RTL across multiple APEX 20KC devices with the same package footprint, allowing pin-compatible scalability from 300K to 600K gates without PCB rework. The JTAG chain lets emulators swap bitstreams in milliseconds during regression test sweeps. Quartus II synthesis results correlate well with downstream ASIC synthesis, reducing re-spin risk. The 1.8 V core simplifies power tree design compared with older 5 V or 3.3 V FPGAs.
Recommended
Military and Aerospace Avionics Buses
With its 672-ball BGA and 508 user I/O, the EP20K600CF672I8 supports MIL-STD-1553, ARINC 429, and other avionics serial bus implementations where each channel needs its own protocol engine in soft logic. The APEX 20KC architecture allows independent hardware threads for each bus instance, eliminating software scheduler jitter. The industrial temperature grade is sufficient for many avionics bays. Designers rely on Quartus II's incremental compile to keep verification cycles short. The 311,296-bit embedded memory buffers incoming and outgoing message frames without external SRAM. Drop-in variants (C7, C8, I7) ease long-lifecycle support for sustained programs.
Recommended
High-Performance Image Processing
The EP20K600CF672I8 fits real-time image preprocessing because its 311,296 bits of on-chip memory act as dual-port line buffers between sensor, ISP pipeline, and downstream compression engine. The 24,320 logic elements implement Bayer demosaicing, color correction, and edge detection at video rates. With 508 user I/O the device can accept parallel Camera Link streams without external bridge chips. The APEX 20KC fabric supports LVDS at hundreds of megabits per second per pair. Compared with a DSP plus memory solution, the FPGA delivers lower latency and lower BOM cost. The 672-ball BGA escapes cleanly to a 4-layer PCB with controlled impedance.
Recommended
Medical Imaging Equipment Controllers
Medical imaging systems such as ultrasound carts and endoscopy controllers use the EP20K600CF672I8 because its on-chip memory and 24,320 logic elements implement real-time beamforming or pixel-stream multiplexing without external SRAM. The 508 user I/O interface directly to high-speed ADC front-ends and LVDS display panels. The APEX 20KC deterministic routing supports safety-critical timing closures required for IEC 60601-1 compliance. Industrial temperature range (0 to 85 °C) covers clinical-room enclosures. Long-lifecycle drop-in variants ease FDA re-validation cycles when the original part goes obsolete.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CF672I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CF672I7N | EP20K600CF672C8N | EP20K600CF672C7N | EP20K600CF672I-8ES | EP20K600CF672C9N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 672-BGA (FCBGA, 45 x 45 mm, 1.27 mm pitch) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| User I/O | 488 to 508 | 488 to 508 | 488 to 508 | 488 to 508 | 488 to 508 | 488 to 508 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to +85 °C (Industrial) | 0 to +85 °C (Industrial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) | 0 to +85 °C (Industrial, ES) | 0 to +70 °C (Commercial) |
| Speed Grade | I8 (industrial, 1.48 ns typical) | I7 (slightly slower) | C8 (commercial, comparable) | C7 (commercial, slower) | I8 ES (engineering sample) | C9 (commercial, fastest) |
| Bitstream Compatibility | Same family, same configuration interface | Fully bitstream-compatible (same family) | Fully bitstream-compatible (same family) | Fully bitstream-compatible (same family) | Fully bitstream-compatible (same die) | Fully bitstream-compatible (same family) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ES, lower test coverage) | Obsolete |
Key Differentiators
- Industrial temperature grade (-I8 suffix) (vs EP20K600CF672C8N)
- Highest speed grade within the I-temp family (vs EP20K600CF672I7N)
- Standard production test flow (not engineering sample) (vs EP20K600CF672I-8ES)
- Maximum user I/O for the 672-ball package (vs EP20K600CB652C8)
Design Notes
The EP20K600CF672I8 requires a clean 1.8 V core rail capable of delivering up to approximately 1.5 A under typical operating conditions, plus per-bank I/O supplies (typically 2.5 V or 3.3 V) referenced to VREF pins. Place 10 µF bulk and 0.1 µF ceramic decoupling within 2 cm of each supply ball pair. Use a soft-start controller to limit in-rush current on the 1.8 V rail because the BGA's low-impedance decoupling can demand peak currents above 5 A during configuration.
The 672-ball BGA uses a 1.27 mm pitch with a 45 mm x 45 mm body, which is escape-friendly on a 4-layer PCB but requires buried vias or micro-vias on 6-layer stacks for clean signal routing. Maintain at least 8 mil trace-and-space for inner layers and use controlled-impedance stack-ups (50 Ω single-ended, 100 Ω differential) for LVDS pairs. Match length within 25 mils on critical clock and global signal routes to avoid setup/hold violations.
Estimated: Configuration bitstream programming via JTAG must chain the EP20K600CF672I8 with any companion devices in the proper order - the Quartus II programmer will report IDCODE mismatches if MSEL pins are tied to the wrong logic level. Verify that nCONFIG is held high through power-up ramp and that nSTATUS returns high within 100 ms, otherwise re-issue a configuration cycle. Failure to do so is the most common cause of 'dead on arrival' boards returned from the assembly house.
Keep all global clock and DCLK routing on dedicated inner layers with a continuous reference plane. Place the configuration PROM (EPC2 or EPC16 for legacy APEX 20KC designs) within 5 cm of the FPGA to keep the FCLK trace short. Maintain at least 25 mil clearance between analog I/O references and switching signals to avoid jitter injection into high-speed interfaces.
Compliance Information
RoHS compliant per legacy Altera product declaration. AEC-Q100 is not applicable (FPGA is not an automotive-qualified part; no APEX 20KC variant carries AEC-Q100). Verify REACH and halogen-free status with the distributor for the specific lot date code.
