EP2A70F1508I8 - APEX II FPGA 67.2K Cells | Altera | FC-FBGA-1508
MPN: EP2A70F1508I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
EP2A70F1508I8 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), under digital logic semiconductors, under integrated circuits. APEX II was positioned by Altera as a high-density platform for parallel datapath processing, telecommunications, and DSP-style compute before the Stratix and Cyclone families replaced it.
Key features of the EP2A70F1508I8 include 1,140 Kbits of embedded SRAM, 4 phase-locked loops (PLLs), support for LVDS I/O at data rates up to 840 Mbps, and a true LVDS-compatible output structure. The device supports multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on a per-bank basis via bank-level reference voltages, enabling glueless interfacing to legacy and modern peripherals. The FC-FBGA-1508 package provides high pin density suitable for high-I/O-count designs.
The APEX II architecture combines a logic array block (LAB) fabric with embedded system blocks (ESBs) that can be configured as RAM, ROM, CAM, or multiplier blocks. MultiTrack interconnect provides predictable routing delays for synchronous design closure. The 0.15 µm process delivered an internal performance envelope in the range of 200-300 MHz depending on design utilization.
Typical applications include high-speed telecommunication line cards, parallel DSP pipelines, ASIC prototyping, and bus-protocol bridging. The large logic capacity makes the EP2A70F1508I8 well suited to designs that would today be mapped onto Stratix or Cyclone 10 devices but where long-term production or legacy re-spin constraints apply.
When designing with the EP2A70F1508I8, ensure that the Quartus II (or Altera MAX+PLUS II legacy) toolchain is used for synthesis, place-and-route, and timing closure. Confirm availability through authorized distributors, since this device is no longer in active production; long lead times and last-time-buy notices are typical.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the original Altera datasheet, enabling rapid comparison for engineers maintaining APEX II based systems.
Drop-in alternatives for EP2A70F1508I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1508I8 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature Grade, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70F1508I-7
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP2A70F1508I-9
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A70F1508C9N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A70F1508C8N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A70F1508C7N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A70F1508I8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Technology | 0.15 µm CMOS SRAM |
| System Gates | 3,000,000 |
| Logic Elements (Cells) | 67,200 |
| Core Voltage | 1.5 V |
| Embedded System Blocks (ESBs) | 672 (max) |
| Embedded RAM Bits | 1,140,480 bits |
| Phase-Locked Loops (PLLs) | 4 |
| LVDS Data Rate | Up to 840 Mbps |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS, LVPECL |
| Package | FC-FBGA-1508 (FineLine BGA) |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG |
| MSL Level | 3 |
| Peak Reflow Temperature | 220 °C |
EP2A70F1508I8 Pin Configuration
| Pin A1 | I/O — User I/O bank (per datasheet pin table) |
| Pin B2 | I/O — User I/O bank (per datasheet pin table) |
| Pin GND | GND — Ground reference for core and I/O supplies |
| Pin VCCINT | VCCINT — 1.5 V core supply |
| Pin VCCIO | VCCIO — I/O bank reference voltage |
Typical Applications
EP2A70F1508I8 is suitable for 6 applications: Telecommunication Line Cards, Parallel DSP Pipelines, ASIC Prototyping, Bus Protocol Bridging, Industrial Control Systems, Legacy Avionics and Defense Systems.
Telecommunication Line Cards
The EP2A70F1508I8's 67,200 logic elements and 4 PLLs make it well suited to high-density telecom line cards that require multi-channel protocol termination, framer processing, and packet classification. Its LVDS support at up to 840 Mbps enables glueless interfacing to network PHYs and serializer/deserializer (SerDes) companion devices. The 1.5 V core and industrial -40 to +85 °C temperature range allow deployment in outdoor DSLAM, OTN, or SONET equipment. Compared to a discrete ASIC, the FPGA form factor allows late-stage firmware updates to accommodate evolving telecom standards.
Recommended
Parallel DSP Pipelines
The 672 embedded system blocks (ESBs) of the EP2A70F1508I8 can each be configured as a multiplier, enabling the device to deliver tens of thousands of multiply-accumulate (MAC) operations per clock cycle for FIR filters, FFT engines, and baseband processors. The 1.14 Mbit embedded SRAM provides zero-wait-state data buffering, while the 4 PLLs generate the multiple clock domains typically required in digital-down-conversion (DDC) and digital-up-conversion (DUC) pipelines. The FC-FBGA-1508 package exposes enough I/O to support 16-32 parallel data channels.
Recommended
ASIC Prototyping
The 3 million system gates of the EP2A70F1508I8 make it a viable platform for ASIC prototyping, allowing engineers to validate a million-gate-class ASIC design in real silicon before committing to mask costs. The Quartus II toolchain provides ASIC-probing and design-partitioning flows that ease migration from FPGA to ASIC. Multiple FPGAs can be chained via the passive-serial configuration chain to prototype ASICs larger than a single FPGA. The industrial temperature range also supports validation in target thermal environments prior to tape-out.
Recommended
Bus Protocol Bridging
The EP2A70F1508I8's mix of multi-voltage I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS, LVPECL) and 4 PLLs makes it ideal for bridging between legacy and modern buses - for example PCI-to-PCI Express, VME-to-Ethernet, or SPI-to-I2C. The LVDS capability at 840 Mbps supports high-speed serial links, while the LVCMOS/PCI banks support legacy parallel interfaces. The 67,200 logic elements can absorb protocol-state-machine complexity alongside the data-path logic.
Recommended
Industrial Control Systems
The industrial -40 to +85 °C temperature range of the EP2A70F1508I8 allows deployment in factory automation, motor control, and process-control systems where temperature extremes are common. The large logic capacity supports multi-axis motion control loops, while the embedded RAM can store look-up tables for sensor linearization. The LVDS I/O enables high-noise-immunity communication with remote sensors in electrically noisy factory environments. Long-term availability concerns make design-for-lifecycle planning critical.
Recommended
Legacy Avionics and Defense Systems
Many long-lifecycle avionics and defense platforms adopted APEX II FPGAs in the early 2000s and continue to require spares for sustainment. The EP2A70F1508I8's industrial temperature range, high gate count, and radiation-tolerant characteristics (via Altera's military-screening flow on related part numbers) make it suitable for these applications. Engineers maintaining these systems should secure last-time-buy inventory and consider designing for future migration to newer Cyclone or Stratix families while the EP2A70F1508I8 remains procurable.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1508I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1508I-7 | EP2A70F1508I-9 | EP2A70F1508C9N | EP2A70F1508C8N | EP2A70F1508C7N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1508 | FC-FBGA-1508 - same | FC-FBGA-1508 - same | FC-FBGA-1508 - same | FC-FBGA-1508 - same | FC-FBGA-1508 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -8 | -7 (slower) | -9 (faster) | -9 | -8 | -7 |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| Embedded RAM (bits) | 1,140,480 | 1,140,480 | 1,140,480 | 1,140,480 | 1,140,480 | 1,140,480 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| LVDS Max Data Rate | 840 Mbps | ~715 Mbps (scaled with speed grade) | ~925 Mbps (scaled with speed grade) | ~925 Mbps | 840 Mbps | ~715 Mbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density APEX II option (67,200 LEs) (vs EP2A40F1508 (40,960 LEs))
- Industrial temperature range standard (vs EP2A70F1508C8N (commercial 0-70C))
- Balance of speed and cost (vs EP2A70F1508I-9 (speed grade -9))
Design Notes
The FC-FBGA-1508 package has a relatively small die-to-package thermal path; with 67,200 logic elements switching simultaneously at internal clock rates up to 300 MHz, junction temperatures can rise significantly. Estimated: at 50% toggle rate and 1.5 V core, dynamic power is roughly P = C × V^2 × f × activity ≈ 4-6 W depending on utilization. The package has a typical theta_JA of approximately 8-10 °C/W with adequate airflow and PCB thermal vias, implying junction-to-ambient rise of 30-60 °C. For industrial -40 to +85 °C operation, ensure airflow or heatsink attachment.
The 1.0 mm ball pitch and 40 mm × 40 mm body of the FC-FBGA-1508 require a 4-6 layer PCB with microvia (laser-drilled) stack-up and a 1.0 mm pitch land pattern. Per Altera APEX II design guidelines, place at least one decoupling capacitor pair (0.1 µF + 10 µF) within 100 mil of each VCCINT and VCCIO ball group. Use a continuous ground plane on layer 2 to provide a low-impedance return path for high-speed LVDS signals. Thermal vias under the die attach pad are recommended at 1.0 mm spacing.
When migrating a design from EP2A70F1508I8 to a Stratix or Cyclone device, do NOT assume I/O bank assignments carry over - the I/O bank architecture changed between APEX II and Stratix. Also note that APEX II MSL 3 parts require bake-out prior to reflow if the dry-pack indicator shows humidity exposure. Configuration bitstream formats differ across families, so Quartus II-compiled SOF/POF files for APEX II will NOT load on a Stratix. Plan a full re-validation cycle for any platform migration.
Compliance Information
RoHS/REACH/lead-free status not present in verified web data; APEX II parts shipped before 2006 RoHS deadlines often used SnPb balls - check lot date code. AEC-Q100 not applicable (industrial/commercial FPGAs, not automotive-qualified).
